characterised by the shape of the lapping plate surface

Industry

CPC
B24B37/16

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B24Grinding technology B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS B24B37/00Lapping machines or devices Accessories

Current Industry

B24B37/16characterised by the shape of the lapping plate surface

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Integrated abrasive polishing pads and manufacturing methods
- Patent number 11,980,992
- Issue date May 14, 2024
- Applied Materials, Inc.
- Ashavani Kumar
- B24 - GRINDING POLISHING
Information Patent Grant
Single bodied platen housing a detection module for CMP systems
- Patent number 11,975,421
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Lung Lai
- B24 - GRINDING POLISHING
Information Patent Grant
Platen surface modification and high-performance pad conditioning t...
- Patent number 11,794,305
- Issue date Oct 24, 2023
- Applied Materials, Inc.
- Christopher Heung-Gyun Lee
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing apparatus, polishing head, and substrate proce...
- Patent number 11,787,006
- Issue date Oct 17, 2023
- Tokyo Electron Limited
- Toshimitsu Igata
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing apparatus including a multi-zone platen
- Patent number 11,772,228
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Hsun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Abrasive articles with precisely shaped features and method of maki...
- Patent number 11,697,185
- Issue date Jul 11, 2023
- 3M Innovative Properties Company
- Duy K. Lehuu
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad for chemical mechanical planarization
- Patent number 11,685,013
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Hung Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Method for polishing substrate including functional chip
- Patent number 11,597,051
- Issue date Mar 7, 2023
- Ebara Corporation
- Tetsuji Togawa
- B24 - GRINDING POLISHING
Information Patent Grant
Single bodied platen housing a detection module for CMP systems
- Patent number 11,571,782
- Issue date Feb 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Lung Lai
- B24 - GRINDING POLISHING
Information Patent Grant
Integrated abrasive polishing pads and manufacturing methods
- Patent number 11,471,999
- Issue date Oct 18, 2022
- Applied Materials, Inc.
- Ashavani Kumar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Dual-surface polishing device and dual-surface polishing method
- Patent number 11,440,157
- Issue date Sep 13, 2022
- Sumco Corporation
- Keisuke Esaki
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing table and polishing apparatus having ihe same
- Patent number 11,433,502
- Issue date Sep 6, 2022
- Ebara Corporation
- Kenichiro Saito
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing measurement device and abrasion time controlling method t...
- Patent number 11,389,922
- Issue date Jul 19, 2022
- SK SILTRON CO., LTD.
- Kee Yun Han
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad with pad wear indicator
- Patent number 11,192,215
- Issue date Dec 7, 2021
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Mauricio E. Guzman
- B24 - GRINDING POLISHING
Information Patent Grant
Planarization apparatus and planarization method thereof
- Patent number 10,879,077
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Tung Wu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Debris-removal groove for CMP polishing pad
- Patent number 10,875,146
- Issue date Dec 29, 2020
- Rohm and Haas Electronic Materials CMP Holdings
- Lee Melbourne Cook
- B24 - GRINDING POLISHING
Information Patent Grant
Method for removing contamination from a chuck surface
- Patent number 10,792,778
- Issue date Oct 6, 2020
- M Cubed Technologies, Inc.
- Edward J. Gratrix
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer chuck featuring reduced friction support surface
- Patent number 10,790,181
- Issue date Sep 29, 2020
- M Cubed Technologies, Inc.
- Edward J. Gratrix
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface plate cleaning apparatus
- Patent number 10,780,548
- Issue date Sep 22, 2020
- SK SILTRON CO., LTD.
- Chan Min Jung
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Dressing device, polishing apparatus, holder, housing and dressing...
- Patent number 10,777,417
- Issue date Sep 15, 2020
- Ebara Corporation
- Hiroyuki Shinozaki
- B24 - GRINDING POLISHING
Information Patent Grant
Abrasive articles with precisely shaped features and method of maki...
- Patent number 10,710,211
- Issue date Jul 14, 2020
- 3M Innovative Properties Company
- Duy K. Lehuu
- B24 - GRINDING POLISHING
Information Patent Grant
One or more charging members used in the manufacture of a lapping p...
- Patent number 10,654,146
- Issue date May 19, 2020
- Seagate Technology LLC
- Mihaela Ruxandra Baurceanu
- B24 - GRINDING POLISHING
Information Patent Grant
Method for producing substrate
- Patent number 10,646,976
- Issue date May 12, 2020
- Shin-Etsu Chemical Co., Ltd.
- Yoko Ishitsuka
- B24 - GRINDING POLISHING
Information Patent Grant
Dressing device, polishing apparatus, holder, housing and dressing...
- Patent number 10,636,665
- Issue date Apr 28, 2020
- Ebara Corporation
- Hiroyuki Shinozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer pin chuck fabrication and repair
- Patent number 10,242,905
- Issue date Mar 26, 2019
- M Cubed Technologies, Inc.
- Edward J. Gratrix
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Disc containing copper for sapphire polishing, and method for prepa...
- Patent number 10,220,486
- Issue date Mar 5, 2019
- Lens Technology Co., Ltd.
- Qunfei Zhou
- B24 - GRINDING POLISHING
Information Patent Grant
Lapping plate and method of making
- Patent number 10,105,813
- Issue date Oct 23, 2018
- Seagate Technology LLC
- Raymond Leroy Moudry
- B24 - GRINDING POLISHING
Information Patent Grant
Lapping plate and method of making
- Patent number 10,010,996
- Issue date Jul 3, 2018
- Seagate Technology LLC
- Raymond Leroy Moudry
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer pin chuck fabrication and repair
- Patent number 9,941,148
- Issue date Apr 10, 2018
- M Cubed Technologies, Inc.
- Edward Gratrix
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad with foundation layer and polishing surface layer
- Patent number 9,931,728
- Issue date Apr 3, 2018
- Cabot Microelectronics Corporation
- William C. Allison
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE GRINDING TOOL AND METHODS OF OPERATION
- Publication number 20240332026
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Fan CHEN
- B24 - GRINDING POLISHING
Information Patent Application
Chemical Mechanical Polishing Process Method and Device
- Publication number 20240217055
- Publication date Jul 4, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Yu Bao
- B24 - GRINDING POLISHING
Information Patent Application
SURFACE HEIGHT MEASUREMENT METHOD USING DUMMY DISK
- Publication number 20230415299
- Publication date Dec 28, 2023
- EBARA CORPORATION
- HIROYUKI SHINOZAKI
- B24 - GRINDING POLISHING
Information Patent Application
Chemical Mechanical Polishing Apparatus Including a Multi-Zone Platen
- Publication number 20230364733
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Hsun Chang
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR POLISHING SUBSTRATE INCLUDING FUNCTIONAL CHIP
- Publication number 20230173636
- Publication date Jun 8, 2023
- EBARA CORPORATION
- Tetsuji Togawa
- B24 - GRINDING POLISHING
Information Patent Application
SINGLE BODIED PLATEN HOUSING A DETECTION MODULE FOR CMP SYSTEMS
- Publication number 20230133331
- Publication date May 4, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Lung Lai
- B24 - GRINDING POLISHING
Information Patent Application
PAD CONDITIONER WITH POLYMER BACKING PLATE
- Publication number 20230094483
- Publication date Mar 30, 2023
- Entegris, Inc.
- Doruk YENER
- B24 - GRINDING POLISHING
Information Patent Application
INTEGRATED ABRASIVE POLISHING PADS AND MANUFACTURING METHODS
- Publication number 20230052048
- Publication date Feb 16, 2023
- Applied Materials, Inc.
- Ashavani KUMAR
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, POLISHING HEAD, AND SUBSTRATE PROCE...
- Publication number 20210362285
- Publication date Nov 25, 2021
- TOKYO ELECTRON LIMITED
- Toshimitsu IGATA
- B24 - GRINDING POLISHING
Information Patent Application
TOOL FOR MODIFYING A SUPPORT SURFACE
- Publication number 20210263418
- Publication date Aug 26, 2021
- ASML NETHERLANDS B.V.
- Bert Dirk SCHOLTEN
- B24 - GRINDING POLISHING
Information Patent Application
Chemical Mechanical Polishing Apparatus Including a Multi-Zone Platen
- Publication number 20210220964
- Publication date Jul 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Hsun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING MEASUREMENT DEVICE AND ABRASION TIME CONTROLLING METHOD T...
- Publication number 20210205948
- Publication date Jul 8, 2021
- SK SILTRON CO., LTD.
- Kee Yun HAN
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR POLISHING SUBSTRATE INCLUDING FUNCTIONAL CHIP
- Publication number 20200391341
- Publication date Dec 17, 2020
- EBARA CORPORATION
- Tetsuji Togawa
- B24 - GRINDING POLISHING
Information Patent Application
ABRASIVE ARTICLES WITH PRECISELY SHAPED FEATURES AND METHOD OF MAKI...
- Publication number 20200298370
- Publication date Sep 24, 2020
- 3M Innovative Properties Company
- Duy K. Lehuu
- B24 - GRINDING POLISHING
Information Patent Application
DUMMY DISK, DRESSING DISK, AND SURFACE HEIGHT MEASUREMENT METHOD US...
- Publication number 20200246936
- Publication date Aug 6, 2020
- EBARA CORPORATION
- HIROYUKI SHINOZAKI
- B24 - GRINDING POLISHING
Information Patent Application
DRESSING DEVICE, POLISHING APPARATUS, HOLDER, HOUSING AND DRESSING...
- Publication number 20200219728
- Publication date Jul 9, 2020
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- B24 - GRINDING POLISHING
Information Patent Application
SINGLE BODIED PLATEN HOUSING A DETECTION MODULE FOR CMP SYSTEMS
- Publication number 20200164481
- Publication date May 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Lung Lai
- B24 - GRINDING POLISHING
Information Patent Application
ONE OR MORE CHARGING MEMBERS USED IN THE MANUFACTURE OF A LAPPING P...
- Publication number 20190224806
- Publication date Jul 25, 2019
- SEAGATE TECHNOLOGY LLC
- Mihaela Ruxandra Baurceanu
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING PAD WITH PAD WEAR INDICATOR
- Publication number 20190224811
- Publication date Jul 25, 2019
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Mauricio E. Guzman
- B24 - GRINDING POLISHING
Information Patent Application
PLANARIZATION APPARATUS AND PLANARIZATION METHOD THEREOF
- Publication number 20190131148
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-TUNG WU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURFACE PLATE FOR FINISH POLISHING, FINISH POLISHING DEVICE, AND PO...
- Publication number 20190047111
- Publication date Feb 14, 2019
- JAPAN AGENCY FOR MARINE-EARTH SCIENCE AND TECHNOLOGY
- Kenji Shimizu
- B24 - GRINDING POLISHING
Information Patent Application
Wafer pin chuck fabrication and repair
- Publication number 20180182657
- Publication date Jun 28, 2018
- M Cubed Technologies, Inc.
- Edward J. Gratrix
- B24 - GRINDING POLISHING
Information Patent Application
SURFACE PLATE CLEANING APPARATUS
- Publication number 20180147691
- Publication date May 31, 2018
- LG Siltron Incorporated
- Chan Min JUNG
- B24 - GRINDING POLISHING
Information Patent Application
WAFER CHUCK FEATURING REDUCED FRICTION SUPPORT SURFACE
- Publication number 20180122684
- Publication date May 3, 2018
- M Cubed Technologies, Inc.
- Edward J. Gratrix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRESSING DEVICE, POLISHING APPARATUS, HOLDER, HOUSING AND DRESSING...
- Publication number 20180047572
- Publication date Feb 15, 2018
- EBARA CORPORATION
- Hiroyuki SHINOZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAPPING PLATE AND METHOD OF MAKING
- Publication number 20170304988
- Publication date Oct 26, 2017
- Segate Technology LLC
- Raymond Leroy Moudry
- B24 - GRINDING POLISHING
Information Patent Application
LAPPING PLATE AND METHOD OF MAKING
- Publication number 20170304989
- Publication date Oct 26, 2017
- Seagate Technology LLC
- Raymond Leroy Moudry
- B24 - GRINDING POLISHING
Information Patent Application
Copper Disc for Sapphire Polishing, and Method of Repairing Double-...
- Publication number 20170129071
- Publication date May 11, 2017
- LENS TECHNOLOGY CO., LTD
- Qunfei Zhou
- B24 - GRINDING POLISHING
Information Patent Application
Wafer pin chuck fabrication and repair
- Publication number 20160276203
- Publication date Sep 22, 2016
- M Cubed Technologies, Inc.
- Edward Gratrix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATE AND DUAL SIDE WAFER GRINDING DEVICE INCLUDING SAME
- Publication number 20150352684
- Publication date Dec 10, 2015
- LG SILTRON INC.
- Dae-Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the shape of the lapping plate surface

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated abrasive polishing pads and manufacturing methods

Single bodied platen housing a detection module for CMP systems

Platen surface modification and high-performance pad conditioning t...

Substrate processing apparatus, polishing head, and substrate proce...

Chemical mechanical polishing apparatus including a multi-zone platen

Abrasive articles with precisely shaped features and method of maki...

Polishing pad for chemical mechanical planarization

Method for polishing substrate including functional chip

Single bodied platen housing a detection module for CMP systems

Integrated abrasive polishing pads and manufacturing methods

Dual-surface polishing device and dual-surface polishing method

Polishing table and polishing apparatus having ihe same

Polishing measurement device and abrasion time controlling method t...

Polishing pad with pad wear indicator

Planarization apparatus and planarization method thereof

Debris-removal groove for CMP polishing pad

Method for removing contamination from a chuck surface

Wafer chuck featuring reduced friction support surface

Surface plate cleaning apparatus

Dressing device, polishing apparatus, holder, housing and dressing...

Abrasive articles with precisely shaped features and method of maki...

One or more charging members used in the manufacture of a lapping p...

Method for producing substrate

Dressing device, polishing apparatus, holder, housing and dressing...

Wafer pin chuck fabrication and repair

Disc containing copper for sapphire polishing, and method for prepa...

Lapping plate and method of making

Lapping plate and method of making

Wafer pin chuck fabrication and repair

Polishing pad with foundation layer and polishing surface layer

Patents Applicationslast 30 patents

SUBSTRATE GRINDING TOOL AND METHODS OF OPERATION

Chemical Mechanical Polishing Process Method and Device

SURFACE HEIGHT MEASUREMENT METHOD USING DUMMY DISK

Chemical Mechanical Polishing Apparatus Including a Multi-Zone Platen

METHOD FOR POLISHING SUBSTRATE INCLUDING FUNCTIONAL CHIP

SINGLE BODIED PLATEN HOUSING A DETECTION MODULE FOR CMP SYSTEMS

PAD CONDITIONER WITH POLYMER BACKING PLATE

INTEGRATED ABRASIVE POLISHING PADS AND MANUFACTURING METHODS

SUBSTRATE PROCESSING APPARATUS, POLISHING HEAD, AND SUBSTRATE PROCE...

TOOL FOR MODIFYING A SUPPORT SURFACE

Chemical Mechanical Polishing Apparatus Including a Multi-Zone Platen

POLISHING MEASUREMENT DEVICE AND ABRASION TIME CONTROLLING METHOD T...

METHOD FOR POLISHING SUBSTRATE INCLUDING FUNCTIONAL CHIP

ABRASIVE ARTICLES WITH PRECISELY SHAPED FEATURES AND METHOD OF MAKI...

DUMMY DISK, DRESSING DISK, AND SURFACE HEIGHT MEASUREMENT METHOD US...

DRESSING DEVICE, POLISHING APPARATUS, HOLDER, HOUSING AND DRESSING...

SINGLE BODIED PLATEN HOUSING A DETECTION MODULE FOR CMP SYSTEMS

ONE OR MORE CHARGING MEMBERS USED IN THE MANUFACTURE OF A LAPPING P...

POLISHING PAD WITH PAD WEAR INDICATOR

PLANARIZATION APPARATUS AND PLANARIZATION METHOD THEREOF

SURFACE PLATE FOR FINISH POLISHING, FINISH POLISHING DEVICE, AND PO...

Wafer pin chuck fabrication and repair

SURFACE PLATE CLEANING APPARATUS

WAFER CHUCK FEATURING REDUCED FRICTION SUPPORT SURFACE

DRESSING DEVICE, POLISHING APPARATUS, HOLDER, HOUSING AND DRESSING...

LAPPING PLATE AND METHOD OF MAKING

LAPPING PLATE AND METHOD OF MAKING

Copper Disc for Sapphire Polishing, and Method of Repairing Double-...

Wafer pin chuck fabrication and repair

PLATE AND DUAL SIDE WAFER GRINDING DEVICE INCLUDING SAME