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H01L21/0335

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

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H01L21/0335characterised by their behaviour during the process

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Patents Grantslast 30 patents

Information Patent Grant
Forming method of semiconductor structure and semiconductor structure
- Patent number 12,198,933
- Issue date Jan 14, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- ChihCheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 12,191,299
- Issue date Jan 7, 2025
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Yifei Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask structure, semiconductor structure and methods for manufacturi...
- Patent number 12,148,618
- Issue date Nov 19, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Penghui Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming pattern
- Patent number 12,125,704
- Issue date Oct 22, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Qiang Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,112,979
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yan-Jhi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly etch selective amorphous carbon film
- Patent number 12,112,949
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Rajesh Prasad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Double-patterning method to improve sidewall uniformity
- Patent number 12,106,964
- Issue date Oct 1, 2024
- Winbond Electronics Corp.
- Chu-Chun Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming self-aligned double pattern and semiconductor st...
- Patent number 12,100,593
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Zhongming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active region array formation method
- Patent number 12,100,594
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- ChihCheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 12,080,553
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ting Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Line-end extension method and device
- Patent number 12,062,543
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Min Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an integrated circuit using a patterned mask layer
- Patent number 12,027,370
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Yen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Highly etch selective amorphous carbon film
- Patent number 12,014,927
- Issue date Jun 18, 2024
- Applied Materials, Inc.
- Rajesh Prasad
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Lithography method to reduce spacing between interconnect wires in...
- Patent number 12,014,952
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with reduced critical dimensions
- Patent number 12,009,212
- Issue date Jun 11, 2024
- NANYA TECHNOLOGY CORPORATION
- Kuo-Hui Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming mask pattern, storage medium, and apparatus for...
- Patent number 12,002,676
- Issue date Jun 4, 2024
- Tokyo Electron Limited
- Takashi Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and methods of forming the same
- Patent number 12,002,710
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hsin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition for forming silicon-containing resist underlayer film a...
- Patent number 12,001,138
- Issue date Jun 4, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yusuke Kai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Patterning methods for semiconductor devices and structures resulti...
- Patent number 12,002,711
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tai-Yen Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, method for fabricating thereof, and method...
- Patent number 11,996,290
- Issue date May 28, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Gang-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-color self-aligned double patterning (SADP) to yield static ran...
- Patent number 11,978,639
- Issue date May 7, 2024
- TESSERA LLC
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory devices and fabricating methods thereof
- Patent number 11,974,431
- Issue date Apr 30, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch reduction technology using alternating spacer depositions dur...
- Patent number 11,935,756
- Issue date Mar 19, 2024
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming nanostructures utilizing self-assembled nucleic...
- Patent number 11,923,197
- Issue date Mar 5, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and structure of middle layer removal
- Patent number 11,923,199
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Nai-Chia Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching of mask materials
- Patent number 11,915,932
- Issue date Feb 27, 2024
- Applied Materials, Inc.
- Toi Yue Becky Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 11,915,933
- Issue date Feb 27, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Qiang Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor fabrication method and structure using multiple sacri...
- Patent number 11,894,231
- Issue date Feb 6, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Haiyang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,887,977
- Issue date Jan 30, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Yifei Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing three-dimensional semiconductor device
- Patent number 11,862,464
- Issue date Jan 2, 2024
- Unisantis Electronics Singapore Pte. Ltd.
- Fujio Masuoka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR INTEGRATED CIRCUIT DESIGN AND FABRICATION
- Publication number 20240379358
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsong-Hua Ou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240363349
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ting Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING MASK PATTERN, STORAGE MEDIUM, AND APPARATUS FOR...
- Publication number 20240274438
- Publication date Aug 15, 2024
- TOKYO ELECTRON LIMITED
- Takashi YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RAN...
- Publication number 20240258113
- Publication date Aug 1, 2024
- Adeia Semiconductor Solutions LLC
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MEMORY DEVICE USING SELF-ALIGNED DOUBLE PAT...
- Publication number 20240234144
- Publication date Jul 11, 2024
- NANYA TECHNOLOGY CORPORATION
- Chih-Ching LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING HIGH VOLTAGE TRANSISTOR AND STRUCTURE RESULTING T...
- Publication number 20240234566
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- LING MEI LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MEMORY DEVICE USING SELF-ALIGNED DOUBLE PAT...
- Publication number 20240234145
- Publication date Jul 11, 2024
- NANYA TECHNOLOGY CORPORATION
- Chih-Ching LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF
- Publication number 20240224526
- Publication date Jul 4, 2024
- Yangtze Memory Technologies Co., Ltd.
- Zhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pitch Reduction Technology Using Alternating Spacer Depositions Dur...
- Publication number 20240222131
- Publication date Jul 4, 2024
- Lodestar Licensing Group LLC
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, METHOD FOR FABRICATING THEREOF, AND METHOD...
- Publication number 20240222124
- Publication date Jul 4, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Gang-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MEMORY DEVICE USING SELF-ALIGNED DOUBLE PAT...
- Publication number 20240136185
- Publication date Apr 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Chih-Ching LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING MEMORY DEVICE USING SELF-ALIGNED DOUBLE PAT...
- Publication number 20240136186
- Publication date Apr 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Chih-Ching LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240128082
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Inoue NAOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20240120329
- Publication date Apr 11, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Yifei Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINE-END EXTENSION METHOD AND DEVICE
- Publication number 20240087896
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Min HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RAN...
- Publication number 20240079247
- Publication date Mar 7, 2024
- TESSERA LLC
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL HARD MASK FOR PRECISE TUNING OF MANDRELS
- Publication number 20240038535
- Publication date Feb 1, 2024
- International Business Machines Corporation
- Joe Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON HARDMASK OPENING USING BORON NITRIDE MASK
- Publication number 20240014039
- Publication date Jan 11, 2024
- Applied Materials, Inc.
- Jeong Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240006178
- Publication date Jan 4, 2024
- WINBOND ELECTRONICS CORP.
- Pei-Hsiu Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PHOTORESIST PATTERN AND METHOD FOR FORMING PATTE...
- Publication number 20230386841
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Gyeyoung Kim
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20230386843
- Publication date Nov 30, 2023
- WINBOND ELECTRONICS CORP.
- Pin-Han CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
- Publication number 20230360927
- Publication date Nov 9, 2023
- STMicroelectronics S.r.l
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHY METHOD TO REDUCE SPACING BETWEEN INTERCONNECT WIRES IN...
- Publication number 20230335433
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-HIGH MODULUS AND ETCH SELECTIVITY BORON-CARBON HARDMASK FILMS
- Publication number 20230317455
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Prashant Kumar KULSHRESHTHA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230307435
- Publication date Sep 28, 2023
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Yifei Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PREPARING SMALL FEATURES ON A SUBSTRATE
- Publication number 20230253206
- Publication date Aug 10, 2023
- Applied Materials, Inc.
- Yongan XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pitch Scaling in Microfabrication
- Publication number 20230245890
- Publication date Aug 3, 2023
- TOKYO ELECTRON LIMITED
- Katie Lutker-Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230230837
- Publication date Jul 20, 2023
- WINBOND ELECTRONICS CORP.
- Chih-Yu Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIAL FOR FORMING ORGANIC FILM, SUBSTRATE FOR MANUFACTURING SEMI...
- Publication number 20230161258
- Publication date May 25, 2023
- Shin-Etsu Chemical Co., Ltd.
- Keisuke NIIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL (3D) MEMORY DEVICE AND FABRICATION METHOD USING S...
- Publication number 20230133691
- Publication date May 4, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jin PENG
- H01 - BASIC ELECTRIC ELEMENTS

characterised by their behaviour during the process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Forming method of semiconductor structure and semiconductor structure

Method of fabricating semiconductor device

Mask structure, semiconductor structure and methods for manufacturi...

Method for forming pattern

Semiconductor device and manufacturing method thereof

Highly etch selective amorphous carbon film

Double-patterning method to improve sidewall uniformity

Method for forming self-aligned double pattern and semiconductor st...

Active region array formation method

Semiconductor device and method of manufacture

Line-end extension method and device

Method of forming an integrated circuit using a patterned mask layer

Highly etch selective amorphous carbon film

Lithography method to reduce spacing between interconnect wires in...

Semiconductor device with reduced critical dimensions

Method for forming mask pattern, storage medium, and apparatus for...

Semiconductor structure and methods of forming the same

Composition for forming silicon-containing resist underlayer film a...

Patterning methods for semiconductor devices and structures resulti...

Semiconductor structure, method for fabricating thereof, and method...

Two-color self-aligned double patterning (SADP) to yield static ran...

Three-dimensional memory devices and fabricating methods thereof

Pitch reduction technology using alternating spacer depositions dur...

Methods of forming nanostructures utilizing self-assembled nucleic...

Method and structure of middle layer removal

Plasma etching of mask materials

Manufacturing method of semiconductor structure

Semiconductor fabrication method and structure using multiple sacri...

Semiconductor device and method of fabricating the same

Method for manufacturing three-dimensional semiconductor device

Patents Applicationslast 30 patents

METHODS FOR INTEGRATED CIRCUIT DESIGN AND FABRICATION

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

METHOD FOR FORMING MASK PATTERN, STORAGE MEDIUM, AND APPARATUS FOR...

TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RAN...

METHOD OF MANUFACTURING MEMORY DEVICE USING SELF-ALIGNED DOUBLE PAT...

METHOD OF FORMING HIGH VOLTAGE TRANSISTOR AND STRUCTURE RESULTING T...

METHOD OF MANUFACTURING MEMORY DEVICE USING SELF-ALIGNED DOUBLE PAT...

THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF

Pitch Reduction Technology Using Alternating Spacer Depositions Dur...

SEMICONDUCTOR STRUCTURE, METHOD FOR FABRICATING THEREOF, AND METHOD...

METHOD OF MANUFACTURING MEMORY DEVICE USING SELF-ALIGNED DOUBLE PAT...

METHOD OF MANUFACTURING MEMORY DEVICE USING SELF-ALIGNED DOUBLE PAT...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF FABRICATING SEMICONDUCTOR DEVICE

LINE-END EXTENSION METHOD AND DEVICE

TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RAN...

METAL HARD MASK FOR PRECISE TUNING OF MANDRELS

CARBON HARDMASK OPENING USING BORON NITRIDE MASK

SEMICONDUCTOR STRUCTURE

METHOD FOR FORMING PHOTORESIST PATTERN AND METHOD FOR FORMING PATTE...

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...

LITHOGRAPHY METHOD TO REDUCE SPACING BETWEEN INTERCONNECT WIRES IN...

ULTRA-HIGH MODULUS AND ETCH SELECTIVITY BORON-CARBON HARDMASK FILMS

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

METHODS FOR PREPARING SMALL FEATURES ON A SUBSTRATE

Pitch Scaling in Microfabrication

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

MATERIAL FOR FORMING ORGANIC FILM, SUBSTRATE FOR MANUFACTURING SEMI...

THREE DIMENSIONAL (3D) MEMORY DEVICE AND FABRICATION METHOD USING S...