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H01L21/0335

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/0335characterised by their behaviour during the process

Industries

Patents Grantslast 30 patents

Information Patent Grant
Pitch reduction technology using alternating spacer depositions dur...
- Patent number 11,935,756
- Issue date Mar 19, 2024
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming nanostructures utilizing self-assembled nucleic...
- Patent number 11,923,197
- Issue date Mar 5, 2024
- Micron Technology, Inc.
- Gurtej S. Sandhu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and structure of middle layer removal
- Patent number 11,923,199
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Nai-Chia Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching of mask materials
- Patent number 11,915,932
- Issue date Feb 27, 2024
- Applied Materials, Inc.
- Toi Yue Becky Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 11,915,933
- Issue date Feb 27, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Qiang Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor fabrication method and structure using multiple sacri...
- Patent number 11,894,231
- Issue date Feb 6, 2024
- Semiconductor Manufacturing International (Shanghai) Corporation
- Haiyang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,887,977
- Issue date Jan 30, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Yifei Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing three-dimensional semiconductor device
- Patent number 11,862,464
- Issue date Jan 2, 2024
- Unisantis Electronics Singapore Pte. Ltd.
- Fujio Masuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Line-end extension method and device
- Patent number 11,854,807
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Min Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,848,210
- Issue date Dec 19, 2023
- Winbond Electronics Corp.
- Chih-Yu Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of patterning small features
- Patent number 11,837,471
- Issue date Dec 5, 2023
- Tokyo Electron Limited
- Katie Lutker-Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,830,737
- Issue date Nov 28, 2023
- Samsung Electronics Co., Ltd.
- Hanhum Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underlayer material for photoresist
- Patent number 11,796,918
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- An-Ren Zi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-high modulus and etch selectivity boron-carbon hardmask films
- Patent number 11,728,168
- Issue date Aug 15, 2023
- Applied Materials, Inc.
- Prashant Kumar Kulshreshtha
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Lithography method to reduce spacing between interconnect wires in...
- Patent number 11,728,209
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 11,728,166
- Issue date Aug 15, 2023
- Tokyo Electron Limited
- Sho Kumakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method of semiconductor device using mask layer and sidew...
- Patent number 11,721,553
- Issue date Aug 8, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning method
- Patent number 11,710,637
- Issue date Jul 25, 2023
- Imec VZW
- Frederic Lazzarino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-color self-aligned double patterning (SADP) to yield static ran...
- Patent number 11,699,591
- Issue date Jul 11, 2023
- TESSERA LLC
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for pitch split patterning using sidewall image transfer
- Patent number 11,676,817
- Issue date Jun 13, 2023
- Tokyo Electron Limited
- Akiteru Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 11,664,227
- Issue date May 30, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Qian Jiang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for capping of cores for self-aligned multiple pa...
- Patent number 11,651,965
- Issue date May 16, 2023
- Tokyo Electron Limited
- Eric Chih-Fang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 11,621,166
- Issue date Apr 4, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Nan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Computer storage medium to perform a substrate treatment method usi...
- Patent number 11,574,812
- Issue date Feb 7, 2023
- Tokyo Electron Limited
- Makoto Muramatsu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor structure and fabrication method thereof
- Patent number 11,557,480
- Issue date Jan 17, 2023
- Semiconductor Manufacturing International (Shanghai) Corporation
- Bin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,538,686
- Issue date Dec 27, 2022
- Semiconductor Manufacturing International (Beijing) Corporation
- Zhu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,538,685
- Issue date Dec 27, 2022
- Semiconductor Manufacturing International (Shanghai) Corporation
- Xiamei Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact slots forming method applying photoresists
- Patent number 11,527,409
- Issue date Dec 13, 2022
- United Microelectronics Corp.
- Wei-Lin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cut first self-aligned litho-etch patterning
- Patent number 11,521,857
- Issue date Dec 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Film for application to three-dimensional sample, method for manufa...
- Patent number 11,520,232
- Issue date Dec 6, 2022
- Toyota School Foundation
- Minoru Sasaki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240128082
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Inoue NAOKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20240120329
- Publication date Apr 11, 2024
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Yifei Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINE-END EXTENSION METHOD AND DEVICE
- Publication number 20240087896
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Min HSIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RAN...
- Publication number 20240079247
- Publication date Mar 7, 2024
- TESSERA LLC
- Fee Li Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL HARD MASK FOR PRECISE TUNING OF MANDRELS
- Publication number 20240038535
- Publication date Feb 1, 2024
- International Business Machines Corporation
- Joe Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON HARDMASK OPENING USING BORON NITRIDE MASK
- Publication number 20240014039
- Publication date Jan 11, 2024
- Applied Materials, Inc.
- Jeong Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20240006178
- Publication date Jan 4, 2024
- WINBOND ELECTRONICS CORP.
- Pei-Hsiu Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PHOTORESIST PATTERN AND METHOD FOR FORMING PATTE...
- Publication number 20230386841
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Gyeyoung Kim
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE
- Publication number 20230386843
- Publication date Nov 30, 2023
- WINBOND ELECTRONICS CORP.
- Pin-Han CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...
- Publication number 20230360927
- Publication date Nov 9, 2023
- STMicroelectronics S.r.l
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHY METHOD TO REDUCE SPACING BETWEEN INTERCONNECT WIRES IN...
- Publication number 20230335433
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Nien Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-HIGH MODULUS AND ETCH SELECTIVITY BORON-CARBON HARDMASK FILMS
- Publication number 20230317455
- Publication date Oct 5, 2023
- Applied Materials, Inc.
- Prashant Kumar KULSHRESHTHA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230307435
- Publication date Sep 28, 2023
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Yifei Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PREPARING SMALL FEATURES ON A SUBSTRATE
- Publication number 20230253206
- Publication date Aug 10, 2023
- Applied Materials, Inc.
- Yongan XU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pitch Scaling in Microfabrication
- Publication number 20230245890
- Publication date Aug 3, 2023
- TOKYO ELECTRON LIMITED
- Katie Lutker-Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230230837
- Publication date Jul 20, 2023
- WINBOND ELECTRONICS CORP.
- Chih-Yu Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIAL FOR FORMING ORGANIC FILM, SUBSTRATE FOR MANUFACTURING SEMI...
- Publication number 20230161258
- Publication date May 25, 2023
- Shin-Etsu Chemical Co., Ltd.
- Keisuke NIIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL (3D) MEMORY DEVICE AND FABRICATION METHOD USING S...
- Publication number 20230133691
- Publication date May 4, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jin PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED DOUBLE PATTERNING (SADP) INTEGRATION WITH WIDE LINE SP...
- Publication number 20230136674
- Publication date May 4, 2023
- International Business Machines Corporation
- Shyng-Tsong Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE
- Publication number 20230101884
- Publication date Mar 30, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- ChihCheng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT SYSTEM
- Publication number 20230077937
- Publication date Mar 16, 2023
- TOKYO ELECTRON LIMITED
- Yusuke SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, METHOD FOR FABRICATING THEREOF, AND METHOD...
- Publication number 20230049202
- Publication date Feb 16, 2023
- Fujian Jinhua Integrated Circuit Co., Ltd.
- Gang-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING MASK PATTERN, STORAGE MEDIUM, AND APPARATUS FOR...
- Publication number 20230042982
- Publication date Feb 9, 2023
- TOKYO ELECTRON LIMITED
- Takashi YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGHLY ETCH SELECTIVE AMORPHOUS CARBON FILM
- Publication number 20230041963
- Publication date Feb 9, 2023
- Applied Materials, Inc.
- Rajesh PRASAD
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGHLY ETCH SELECTIVE AMORPHOUS CARBON FILM
- Publication number 20230029929
- Publication date Feb 2, 2023
- Applied Materials, Inc.
- Rajesh PRASAD
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TWO-DIMENSION SELF-ALIGNED SCHEME WITH SUBTRACTIVE METAL ETCH
- Publication number 20230033038
- Publication date Feb 2, 2023
- Applied Materials, Inc.
- Yung-chen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PATTERN
- Publication number 20230013448
- Publication date Jan 19, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Qiang WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SEMICONDUCTOR STRU...
- Publication number 20230015991
- Publication date Jan 19, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Yuanhao GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Forming Memory Device With Reduced Resistivity
- Publication number 20220415651
- Publication date Dec 29, 2022
- Applied Materials, Inc.
- Qixin Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY GATE PATTERNING LINES AND INTEGRATED CIRCUIT STRUCTURES RESUL...
- Publication number 20220415780
- Publication date Dec 29, 2022
- Intel Corporation
- William HSU
- H01 - BASIC ELECTRIC ELEMENTS

characterised by their behaviour during the process

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Pitch reduction technology using alternating spacer depositions dur...

Methods of forming nanostructures utilizing self-assembled nucleic...

Method and structure of middle layer removal

Plasma etching of mask materials

Manufacturing method of semiconductor structure

Semiconductor fabrication method and structure using multiple sacri...

Semiconductor device and method of fabricating the same

Method for manufacturing three-dimensional semiconductor device

Line-end extension method and device

Semiconductor structure and method of forming the same

Methods of patterning small features

Semiconductor device and method of fabricating the same

Underlayer material for photoresist

Ultra-high modulus and etch selectivity boron-carbon hardmask films

Lithography method to reduce spacing between interconnect wires in...

Substrate processing method and substrate processing apparatus

Formation method of semiconductor device using mask layer and sidew...

Patterning method

Two-color self-aligned double patterning (SADP) to yield static ran...

Method for pitch split patterning using sidewall image transfer

Semiconductor structure and fabrication method thereof

Method and system for capping of cores for self-aligned multiple pa...

Semiconductor device and fabrication method thereof

Computer storage medium to perform a substrate treatment method usi...

Semiconductor structure and fabrication method thereof

Semiconductor structure and method for forming the same

Semiconductor structure and method for forming the same

Contact slots forming method applying photoresists

Cut first self-aligned litho-etch patterning

Film for application to three-dimensional sample, method for manufa...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF FABRICATING SEMICONDUCTOR DEVICE

LINE-END EXTENSION METHOD AND DEVICE

TWO-COLOR SELF-ALIGNED DOUBLE PATTERNING (SADP) TO YIELD STATIC RAN...

METAL HARD MASK FOR PRECISE TUNING OF MANDRELS

CARBON HARDMASK OPENING USING BORON NITRIDE MASK

SEMICONDUCTOR STRUCTURE

METHOD FOR FORMING PHOTORESIST PATTERN AND METHOD FOR FORMING PATTE...

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE...

LITHOGRAPHY METHOD TO REDUCE SPACING BETWEEN INTERCONNECT WIRES IN...

ULTRA-HIGH MODULUS AND ETCH SELECTIVITY BORON-CARBON HARDMASK FILMS

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

METHODS FOR PREPARING SMALL FEATURES ON A SUBSTRATE

Pitch Scaling in Microfabrication

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

MATERIAL FOR FORMING ORGANIC FILM, SUBSTRATE FOR MANUFACTURING SEMI...

THREE DIMENSIONAL (3D) MEMORY DEVICE AND FABRICATION METHOD USING S...

SELF-ALIGNED DOUBLE PATTERNING (SADP) INTEGRATION WITH WIDE LINE SP...

FORMING METHOD OF SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE

SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT SYSTEM

SEMICONDUCTOR STRUCTURE, METHOD FOR FABRICATING THEREOF, AND METHOD...

METHOD FOR FORMING MASK PATTERN, STORAGE MEDIUM, AND APPARATUS FOR...

HIGHLY ETCH SELECTIVE AMORPHOUS CARBON FILM

HIGHLY ETCH SELECTIVE AMORPHOUS CARBON FILM

TWO-DIMENSION SELF-ALIGNED SCHEME WITH SUBTRACTIVE METAL ETCH

METHOD FOR FORMING PATTERN

SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SEMICONDUCTOR STRU...

Methods Of Forming Memory Device With Reduced Resistivity

DUMMY GATE PATTERNING LINES AND INTEGRATED CIRCUIT STRUCTURES RESUL...