characterised by thermal path or place of attachment of heatsink

Industry

CPC
H01L2023/4037

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2023/4037characterised by thermal path or place of attachment of heatsink

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Back plate assembly and electronic device
- Patent number 11,894,285
- Issue date Feb 6, 2024
- Tyco Electronics (Shanghai) Co., Ltd.
- Jiefeng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Card-type connector having heat conductive members extending over t...
- Patent number 11,444,405
- Issue date Sep 13, 2022
- Japan Aviation Electronics Industry, Limited
- Tomohiro Nakamura
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi layer thermal interface material
- Patent number 11,037,860
- Issue date Jun 15, 2021
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fixing structure of electronic component
- Patent number 10,939,585
- Issue date Mar 2, 2021
- Yazaki Corporation
- Chiaki Chida
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Fabricating an integrated circuit chip module with stiffening frame...
- Patent number 10,892,170
- Issue date Jan 12, 2021
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heart dissipator structure
- Patent number 10,721,841
- Issue date Jul 21, 2020
- YU QIN TECHNOLOGY, LTD.
- Chia-Sheng Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Case and electronic device having the same
- Patent number 10,643,923
- Issue date May 5, 2020
- SUNGROW POWER SUPPLY CO., LTD.
- Qu'e Cai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a chip module with stiffening frame and ortho...
- Patent number 10,566,215
- Issue date Feb 18, 2020
- International Business Machines Corporation
- Evan G. Colgan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus
- Patent number 10,553,520
- Issue date Feb 4, 2020
- Sony Interactive Entertainment Inc.
- Hitomi Iizuka
- A63 - SPORTS GAMES AMUSEMENTS
Information Patent Grant
Bonded body, substrate for power module with heat sink, heat sink,...
- Patent number 10,497,637
- Issue date Dec 3, 2019
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor memory device and a chip stack package having the same
- Patent number 10,211,123
- Issue date Feb 19, 2019
- Samsung Electronics Co., Ltd.
- Jong-Pil Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink with integrated threaded lid
- Patent number 10,002,819
- Issue date Jun 19, 2018
- International Business Machines Corporation
- William J. Anderl
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lightweight liquid-cooling-plate assembly having plastic frame and...
- Patent number 9,984,955
- Issue date May 29, 2018
- Enzotechnology Corp.
- Kuo-An Liang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat sink coupling using flexible heat pipes for multi-surface comp...
- Patent number 9,935,033
- Issue date Apr 3, 2018
- Intel Corporation
- Susan F. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board assembly including conductive heat transfer
- Patent number 9,818,669
- Issue date Nov 14, 2017
- Honeywell International Inc.
- Kirk Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface materials with thin film or metallization
- Patent number 9,795,059
- Issue date Oct 17, 2017
- Laird Technologies, Inc.
- Jason L. Strader
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Heat-dissipating socket for lighting fixtures
- Patent number 9,441,825
- Issue date Sep 13, 2016
- Jonathan Leeper
- F21 - LIGHTING
Information Patent Grant
Fan-out wafer level package
- Patent number 9,269,645
- Issue date Feb 23, 2016
- United Microelectronics Corp.
- Chu-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die integrated circuit structure with heat sink
- Patent number 9,082,633
- Issue date Jul 14, 2015
- Xilinx, Inc.
- Douglas M. Grant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation methods and structures for semiconductor device
- Patent number 8,759,157
- Issue date Jun 24, 2014
- Spansion LLC
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation methods and structures for semiconductor device
- Patent number 8,531,019
- Issue date Sep 10, 2013
- Spansion LLC
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation device for semiconductor package module, and semic...
- Patent number 7,796,395
- Issue date Sep 14, 2010
- Hynix Semiconductor Inc.
- Moon Su Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC BOARD EQUIPPED WITH A HEAT DISSIPATION DEVICE AND APPARA...
- Publication number 20240431017
- Publication date Dec 26, 2024
- BULL SAS
- Bernard TENEZE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK PLATE ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20210143083
- Publication date May 13, 2021
- Tyco Electronics (Shanghai) Co. Ltd.
- Jiefeng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION DEVICE AND ELECTRONIC DEVICE
- Publication number 20200373218
- Publication date Nov 26, 2020
- Huawei Technologies Co., Ltd
- Ye GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL ASSEMBLY
- Publication number 20180374770
- Publication date Dec 27, 2018
- General Electric Technology GmbH
- Colin Charnock DAVIDSON
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
ADDITIVE MANUFACTURED PASSIVE THERMAL ENCLOSURE
- Publication number 20180321720
- Publication date Nov 8, 2018
- Microsoft Technology Licensing, LLC
- Kurt Jenkins
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Apparatus
- Publication number 20180247881
- Publication date Aug 30, 2018
- Sony Interactive Entertainment Inc.
- Hitomi Iizuka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHTWEIGHT LIQUID-COOLING-PLATE ASSEMBLY HAVING PLASTIC FRAME AND...
- Publication number 20180151473
- Publication date May 31, 2018
- ENZOTECHNOLOGY CORP.
- Kuo-An Liang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
BONDED BODY, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, HEAT SINK,...
- Publication number 20180108593
- Publication date Apr 19, 2018
- MITSUBISHI MATERIALS CORPORATION
- Nobuyuki Terasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CASE AND ELECTRONIC DEVICE HAVING THE SAME
- Publication number 20180096911
- Publication date Apr 5, 2018
- Sungrow Power Supply Co., Ltd.
- Qu'e CAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK WITH INTEGRATED THREADED LID
- Publication number 20170229374
- Publication date Aug 10, 2017
- International Business Machines Corporation
- WILLIAM J. ANDERL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING DEVICE AND DEVICE
- Publication number 20160284623
- Publication date Sep 29, 2016
- NEC Corporation
- TOMOYUKI MITSUI
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Thermal mgmt. device for high-heat flux electronics
- Publication number 20140293542
- Publication date Oct 2, 2014
- Jan Vetrovec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION METHODS AND STRUCTURES FOR SEMICONDUCTOR DEVICE
- Publication number 20130337612
- Publication date Dec 19, 2013
- SPANSION LLC
- Masanori ONODERA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE INTEGRATED CIRCUIT STRUCTURE WITH HEAT SINK
- Publication number 20130093074
- Publication date Apr 18, 2013
- Xilinx, Inc.
- Douglas M. Grant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP MODULE, PRINTED WIRING BOARD, METHOD FOR MANUFACTURING MU...
- Publication number 20130021769
- Publication date Jan 24, 2013
- Fujitsu Limited
- Kenji FUKUZONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DUMMY PATTERN AND DESIGN METHOD THEREOF
- Publication number 20120306106
- Publication date Dec 6, 2012
- Elpida Memory, Inc.
- Yorio Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION DEVICE FOR SEMICONDUCTOR PACKAGE MODULE, AND SEMIC...
- Publication number 20090168364
- Publication date Jul 2, 2009
- Moon Soo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat dissipation methods and structures for semiconductor device
- Publication number 20080211079
- Publication date Sep 4, 2008
- Masanori Onodera
- H01 - BASIC ELECTRIC ELEMENTS

characterised by thermal path or place of attachment of heatsink

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Back plate assembly and electronic device

Card-type connector having heat conductive members extending over t...

Multi layer thermal interface material

Fixing structure of electronic component

Fabricating an integrated circuit chip module with stiffening frame...

Heart dissipator structure

Case and electronic device having the same

Method of fabricating a chip module with stiffening frame and ortho...

Electronic apparatus

Bonded body, substrate for power module with heat sink, heat sink,...

Semiconductor memory device and a chip stack package having the same

Heat sink with integrated threaded lid

Lightweight liquid-cooling-plate assembly having plastic frame and...

Heat sink coupling using flexible heat pipes for multi-surface comp...

Printed circuit board assembly including conductive heat transfer

Thermal interface materials with thin film or metallization

Heat-dissipating socket for lighting fixtures

Fan-out wafer level package

Multi-die integrated circuit structure with heat sink

Heat dissipation methods and structures for semiconductor device

Heat dissipation methods and structures for semiconductor device

Heat dissipation device for semiconductor package module, and semic...

Patents Applicationslast 30 patents

ELECTRONIC BOARD EQUIPPED WITH A HEAT DISSIPATION DEVICE AND APPARA...

BACK PLATE ASSEMBLY AND ELECTRONIC DEVICE

HEAT DISSIPATION DEVICE AND ELECTRONIC DEVICE

ELECTRICAL ASSEMBLY

ADDITIVE MANUFACTURED PASSIVE THERMAL ENCLOSURE

Electronic Apparatus

LIGHTWEIGHT LIQUID-COOLING-PLATE ASSEMBLY HAVING PLASTIC FRAME AND...

BONDED BODY, SUBSTRATE FOR POWER MODULE WITH HEAT SINK, HEAT SINK,...

CASE AND ELECTRONIC DEVICE HAVING THE SAME

HEAT SINK WITH INTEGRATED THREADED LID

COOLING DEVICE AND DEVICE

Thermal mgmt. device for high-heat flux electronics

HEAT DISSIPATION METHODS AND STRUCTURES FOR SEMICONDUCTOR DEVICE

MULTI-DIE INTEGRATED CIRCUIT STRUCTURE WITH HEAT SINK

MULTICHIP MODULE, PRINTED WIRING BOARD, METHOD FOR MANUFACTURING MU...

SEMICONDUCTOR DEVICE HAVING DUMMY PATTERN AND DESIGN METHOD THEREOF

HEAT DISSIPATION DEVICE FOR SEMICONDUCTOR PACKAGE MODULE, AND SEMIC...

Heat dissipation methods and structures for semiconductor device