Patent Application
20180374770
This invention relates to an electrical assembly. The electrical assembly may include a plurality of semiconductor devices arranged in a stack with associated heat sinks. The invention also relates to a converter including the electrical assembly and a kit of parts for the electrical assembly.
According to a first aspect we provide an electrical assembly comprising; a primary electrical component comprising a semiconductor device; a primary heat sink having the primary electrical component mounted thereon to provide a heat sink for said primary electrical component; a secondary electrical component electrically connected or coupled with the primary electrical component; a secondary heat sink having the secondary electrical component mounted thereon to provide a heat sink for said secondary electrical component; wherein the primary heat sink and the secondary heat sink are physically releasably couplable to one another and, when coupled, the primary and secondary heat sinks are thermally coupled by abutment of respective heat transfer surfaces of the primary and secondary heat sinks.
This is advantageous as the heat sink for each “module”, which comprises the first and second electrical components, is releasably separable into two parts. Maintenance of the assembly is easy as the secondary heat sink can be detached from the first heat sink, with its electrical components attached thereto. For example, if a faulty secondary electrical component is identified, the secondary heat sink can be replaced as a complete unit along with the faulty electrical components. Further, the thermal coupling between the primary and secondary heat sinks allows for heat transfer between the two heat sinks to provide for efficient heat dissipation over both heat sinks rather than the two (primary and secondary) heat sinks individually.
Optionally, the primary heat sink is configured to receive a flow of a heat transfer fluid to actively cool said primary heat sink. Thus, the primary heat sink may include conduits therethrough configured such that the heat transfer fluid or coolant can be flowed through the primary heat sink. The heat transfer fluid may comprise water or glycol, such as ethylene glycol or propylene glycol, or a mixture of water and glycol. The water may be deionized which may prevent problems associated with electrolytic corrosion. Thus, the primary heat sink may form part of a coolant circuit in which heat transfer fluid is flowed through the primary heat sink and then through a radiator to dissipate the heat received by the primary heat sink, which may be from the secondary heat sink via the heat transfer surfaces.
Optionally, the secondary heat sink is configured to passively cool the secondary electrical component without a flow of heat transfer fluid at least by virtue of its thermal coupling with the primary heat sink. Thus, the heat transfer surfaces of the primary heat sink and the secondary heat sink over which the two heat sinks are coupled may be free from heat transfer fluid flow ports. Accordingly, heat generated by the secondary electrical component may be dissipated by the secondary heat sink to atmosphere, via fins and/or radiatively, and also to the primary heat sink and to the heat transfer fluid that flows therethrough. The passive nature of the secondary heat sink may allow for easy decoupling of the secondary heat sink from the primary heat sink as few connections require disconnection. For example, a mechanical retention element and/or an electrical connection may be the only disconnections required to decouple the primary and secondary heat sinks.
Optionally, the primary heat sink and the secondary heat sink include complementary parts of a releasable physical retention element configured to physically hold the primary and secondary heat sinks together when coupled. The physical retention element may be provided any one of; a clip and a detent; a magnetic coupling; an interference fit; a bolt and aperture; or releasable adhesive pads.
Optionally, the primary heat sink includes one of a projecting plug part and a complementary socket part and the secondary heat sink includes the other, the plug part configured to be received by the socket part when the primary heat sink and the secondary heat sink are coupled, the plug part and socket part each comprising the respective heat transfer surface to transfer heat between the secondary heat sink and the primary heat sink. The physical retention element may be provided by the plug and socket. The primary heat sink may include the plug part and the secondary heat sink may include the socket part. This arrangement may be advantageous as the plug part may be easier to clean and maintain while the secondary heat sink is removed, particularly if the primary heat sink is part of a clamped assembly. The clamped assembly may comprise a plurality of primary heat sinks interleaved with the primary electrical components and clamped together. The projection may be received wholly within the socket or the socket may receive only part of the projection. The plug may be tapered from a proximal end to a narrower distal end. A plurality of plugs or “projections” may extend from the heat transfer surface to be received by a complimentary plurality of sockets or “recesses”. Further, each heat transfer surface may comprise a combination of projections and recesses. The plug and socket may be embodied as a wedge shape that contacts a further wedge shape wherein the heat transfer surfaces are provided by the wedge shaped plug and socket.
One or more of the plug(s) or projection(s) of the first heat sink may include a conduit for receiving the heat transfer fluid. Likewise, a socket or recess of the first heat sink and the conduit for the heat transfer fluid may be arranged such that the conduit extends around side walls of the socket.
Optionally, the assembly includes a plurality of primary heat sinks and associated primary electrical components arranged in a stack wherein, in the stack, a second primary heat sink positioned adjacent a first primary heat sink in the stack is arranged such that the primary electrical component of the first primary heat sink is clamped between the first primary heat sink and the second primary heat sink by a clamping arrangement. Thus, the primary heat sinks may be interleaved with the primary electrical components and clamped together. This arrangement may be advantageous as each primary electrical component has two surfaces in contact with a heat sink (i.e. its associated primary heat sink and an adjacent primary heat sink in the stack). The stack may include a tertiary heat sink for contacting a second side of a primary electrical component located at an end of the stack, where the first side, opposed to the second side, contacts its associated primary heat sink. Thus, the tertiary heat sink may be substantially similar to a primary heat sink but does not carry its own primary electrical component as it is configured to provide a “second” heat sink for a “top-most” primary electrical component in the stack. The tertiary heat sink may be configured to receive a heat transfer fluid, similar to that described for the primary heat sink.
Optionally, the secondary heat sinks of the stack are arranged relative to the primary heat sinks such that they are individually removable from their associated primary heat sink without unclamping of the clamping arrangement of the primary heat sinks in the stack. Thus, while the secondary heat sinks can be considered to be an extension of the primary heat sinks, they are arranged such that they are not subject to the clamping force of the clamping arrangement such that they are conveniently removable from the clamped primary heat sinks.
Optionally, the semiconductor device comprises one or more of; a thyristor, an insulated-gate bipolar transistor (IGBT), a gate-turn-off thyristor (GTO), a Gate Commutated Thyristor (GCT), an Integrated Gate Commutated Thyristor (IGCT) and an Injection Enhanced Gate Transistor (IEGT). It will be appreciated that the semiconductor device may comprise a plurality of semiconductor devices. Further, in other aspects, the first electrical component may not necessarily comprise a semiconductor device.
Optionally, the secondary electrical component comprises at least one of; a grading resistor comprising a resistor configured to improve the distribution (grading) of voltage amongst series connected semiconductor devices in the electrical assembly; a snubber capacitor comprising a capacitor configured to suppress voltage transients during switching of the semiconductor device; a damping circuit such as a Resistor-Capacitor circuit configured to damp any oscillatory behaviour experienced at switching of the semiconductor device; a controller configured to control, monitor or provide feedback from the semiconductor device.
Thus, the secondary electrical component may comprise a component part of a switching circuit of which the primary electrical component forms a switching element. In one embodiment, the semiconductor device comprises a three terminal device (such as anode, cathode and gate for a thyristor) and all three terminals are configured to be electrically connected to one or more secondary electrical components of the secondary heat sink.
Optionally, the secondary heat sink includes at least one heat pipe having a working fluid therein for transferring thermal energy from an evaporator end to a condensing end, the condensing end arranged adjacent the heat transfer surface of the secondary heat sink. The condensing end may be arranged adjacent the heat transfer surface of the secondary heat sink and the evaporator end may be arranged spaced from the heat transfer surface and extending into the body of the secondary heat sink, such as towards the secondary electrical component. This may aid efficient transfer of heat from the secondary electrical component to the primary heat sink.
Optionally, the primary heat sink comprises an elongate body (in section) having a plurality of elongate sides separating two end faces wherein the primary electrical component is mounted to at least one of the elongate sides and the secondary heat sink is thermally coupled to one of the end faces. In one example, the primary heat sink is plate shaped and may be substantially cuboidal in which the width of the primary heat sink, which extends into and out of the page in
Optionally, the electrical assembly includes an electrical connector comprising a first electrical connector part and a second electrical connector part for providing an electrical connection between the semiconductor device and the secondary electrical component, the first electrical connector part associated with the primary heat sink and the second electrical connector part associated with the secondary heat sink. The electrical connector parts may be mounted on their respective heat sinks. The electrical connector may additionally provide the physical retention element.
Optionally, the primary heat sink and the secondary heat sink are of an electrically conductive material and the coupling between them provides for an electrical connection therebetween, wherein an electrical terminal of the primary electrical component and an electrical terminal of the secondary electrical component are connected together via the primary and secondary heat sinks such that a current path between the electrical components is provided by the heat sinks. Thus, a terminal of the primary electrical component may be electrically coupled to the primary heat sink and a terminal of the secondary electrical component may be electrically coupled to the secondary heat sink.
According to a further aspect of the invention we provide a converter, for transferring power between AC and DC electrical networks, comprising a converter limb portion connected between AC and DC terminals, the AC terminal being connectable to an AC electrical network and the DC terminal being connectable to a DC electrical network, the converter limb portion including the electrical assembly of the first aspect wherein the semiconductor device comprises a switching element operable to facilitate power transfer between the AC and DC terminals during operation of the converter.
The converter may comprise a voltage source converter wherein the primary electrical component comprises a switching element thereof. The converter may comprise a Line Commutated Converter (LCC) HVDC converter. Accordingly, the semiconductor device may comprise a thyristor. It will be appreciated that, typically but not exclusively, the converter includes two limb portions for each phase of the AC electrical network and one or more of the limb portions may be formed in accordance with the electrical assembly of the first aspect.
According to a further aspect of the invention we provide a kit of parts for providing the electrical assembly of the first aspect.
According to a further aspect of the invention, we provide a method of maintaining or replacing a secondary electrical component of an electrical assembly, the electrical assembly comprising a primary electrical component comprising a semiconductor device; a primary heat sink having the primary electrical component mounted thereon to provide a heat sink for said primary electrical component; a secondary electrical component electrically connected or coupled with the primary electrical component; a secondary heat sink having the secondary electrical component mounted thereon to provide a heat sink for said secondary electrical component; wherein the primary heat sink and the secondary heat sink are physically releasably couplable to one another and, when coupled, the primary and secondary heat sinks are thermally coupled by abutment of respective heat transfer surfaces of the primary and secondary heat sinks and wherein the assembly includes a plurality of primary heat sinks and associated primary electrical components arranged in a stack wherein, in the stack, a second primary heat sink positioned adjacent a first primary heat sink in the stack is arranged such the primary electrical component of the first primary heat sink is clamped between the first primary heat sink and the second primary heat sink by a clamping arrangement, the method comprising; removing a secondary heat sink from the primary heat sink without unclamping the clamping arrangement; performing maintenance or replacement of the secondary electrical components; refitting the, or fitting a different, secondary heat sink to the primary heat sink.
The different secondary heat sink may include a protective layer over its heat transfer surface that requires removal prior to fitting onto the primary heat sink. The protective layer may comprise a sheet of plastic. The plastic may also cover a layer of thermal grease.
To replace a primary electrical component the method may comprise unclamping the clamping arrangement, separating adjacent primary heat sinks, performing maintenance or replacement of the primary electrical components, re-clamping the clamping arrangement.
The method is particularly applicable when the electrical assembly comprises a stack of a power converter, as described above.
There now follows, by way of example only, a detailed description of embodiments of the invention with reference to the following figures, in which:
Electrical components may require cooling to operate efficiently and/or reliably. Cooling of electrical components may also be important when a plurality of electrical components are mounted together in an assembly where each electrical component comprises a source of heat, particularly when the assembly is compact. Heat sinks can be used to conduct heat or thermal energy away from the electrical components. Heat sinks may be passive in that they provide a radiative surface to transfer heat to atmosphere or they may be active whereby power is used to drive a fan or a pump to move a working fluid through the heat sink. The working fluid may transfer the heat to a radiator located with or separate to the heat sink. The assembly may be part of a larger apparatus such as a power converter.
Power converters are used to exchange energy between electrical networks, such as alternating current networks and direct current networks or networks operating at different voltages or frequencies. Often power converters comprise arrays of semiconductor devices or switches, each of which may require cooling. Further, each semiconductor device may be configured to operate in association with other electrical components that also require cooling. Thus, it will be appreciated that providing temperature control for an electrical assembly of interconnected electrical components can be complicated. This is particularly so when access to individual components for maintenance may be required.
The following examples describe a heat sink arrangement for a semiconductor device, such as a thyristor, that is typically arranged in a stack, known as a clamped assembly, comprising a plurality of semiconductor devices arranged together. In particular, the electrical assembly described below has particular application when applied to a plurality of thyristors electrically connected together and that are interleaved by heat sinks, where the thyristor/heat sink stack are secured together by a clamping arrangement. The stack may form part of a power converter. Each thyristor may form part of a thyristor valve with other electrical components (such as secondary electrical components as described below). It will, however, be appreciated that the electrical assembly has wider application and may be used to provide an efficiently cooled electrical assembly comprising arrays of semiconductor devices that is space efficient and easy to maintain.
The primary heat sink 2 has a primary electrical component 4 mounted thereon comprising a semiconductor device, such as a thyristor. Thus, the primary heat sink 2 is thermally connected to the primary electrical component 4 such that heat generated by the primary electrical component 4 during use is conducted away by the primary heat sink 4. Although the primary electrical component 4 comprises a thyristor in this example, it may comprise other semiconductor devices such as an insulated-gate bipolar transistor (IGBT), a gate-turn-off thyristor (GTO), a Gate Commutated Thyristor (GCT), an Integrated Gate Commutated Thyristor (IGCT) and an Injection Enhanced Gate Transistor (IEGT).
The secondary heat sink 3 has a secondary electrical component 5 mounted thereon, such as a resistor. Thus, the secondary heat sink 3 is thermally connected to the secondary electrical component 5 such that heat generated by the secondary electrical component 5 during use is conducted away by the secondary heat sink 3. In this example, a plurality of electrical components are mounted on the secondary heat sink 3.
The primary heat sink 2 and the secondary heat sink 3 are physically releasably couplable to one another. Thus, when brought into contact a retention arrangement may physically hold the primary heat sink 2 and the secondary heat sink 3 in thermal contact. Thus, thermal energy received by the heat sinks can flow between them by virtue of the thermal contact therebetween. Accordingly, each heat sink 2, 3 includes a heat transfer surface 6, 7 through which heat is transferred to the other heat sink when the surfaces 6, 7 abut (shown in
This arrangement is particularly advantageous for forming a stack of semiconductor devices such as for use in a power converter.
The primary heat sink 2 comprises a plate shaped body 8. The plate is substantially cuboidal having at least a larger, top, face 9 and a second larger, bottom, face 10 that separate four smaller faces 11, 12 (the other two smaller faces are not visible in the sectional view of
The primary heat sink 2 may be actively cooled by a heat transfer fluid that is pumped through the primary heat sink 2. Thus, the primary heat sink 2 includes part of a cooling circuit 14 to receive a flow of heat transfer fluid. The smaller face 11 includes a first port 15 to provide for flow into the cooling circuit part 14 and a second port 16 for flow out of the cooling circuit part 14. The ports 15, 16 may connect to a pump (not shown) and a heat exchanger (not shown). Thus, a heat transfer fluid that enters via one of the ports 15, 16 is transferred around the internal structure of the primary heat sink 2 to absorb the thermal energy of the primary heat sink 2 and then flows back out of the primary heat sink 2. In this example, the heat transfer fluid may be water, although other heat transfer fluids, such as glycol or a mixture of water and glycol may be used.
In this example, the cooling circuit part 14 remains solely within the primary heat sink 2 and does not extend to the secondary heat sink 3. However, in other embodiments, the cooling circuit 14 may include ports to circulate heat transfer fluid from the primary heat sink 2 around the secondary heat sink 3. In still further embodiments, the secondary heat sink 3 is actively cooled by a separate heat transfer fluid circuit, which may utilise the same or different pump and/or the same or different heat exchanger.
The smaller face 12 comprises the heat transfer surface 6 of the primary heat sink 2. Given that the primary heat sink 2 is plate shaped, the faces 11, 12 have a relatively smaller area than the larger faces 9, 10. Thus, in order to provide a larger surface area for heat transfer between the secondary heat sink 3 and the primary heat sink 2, the face 12 may include one or more projections or recesses. The projections or recesses are complementary to the other of a projection or recess formed on the secondary heat sink 3. The projection and recess thus comprise a plug and socket configuration comprising a male plug part and a female socket part. In this example, the heat transfer surface of the primary heat sink 6 comprises one projection 17, although more projections could be provided. The projection may be wedge shaped such that it tapers to a narrower portion at its distal end. A tapering shape makes mounting of the secondary heat sink 3 to the primary heat sink 2 easier. The projection 17 has a length of more than 10%, 20%, 30%, 40% or 50% of the length of the primary heat sink measured between the face 11 and the base of the projection 17. This increases the area of the heat transfer surface so that the passive, secondary heat sink 3 is able to rely on the cooling effect of the primary heat sink 2 in addition to any direct heat transfer to atmosphere. Further, the cooling circuit part 14 follows a path that extends into the internal volume of the projection 17. In other embodiments the path does not extend into the projection 17. A layer of thermal grease may be provided between the projection and recess to provide for effective thermal coupling.
The secondary heat sink 3, in this example, is also flat and substantially plate shaped and therefore also includes two larger faces separated by four smaller faces and is connected to the primary heat sink via the smaller face 18. The face 18 includes a recess 19 complementary to the projection 17. The heat transfer surface 7 is provided over the internal surface of the recess 19. The secondary electrical component 5 is mounted on at least one of the larger faces 20 or one of the smaller faces 21, opposite the face 18 that connects to the primary heat sink 2. The secondary heat sink 3 can be considered to be a detachable extension of the primary heat sink 2. The secondary heat sink may be of a thermally conductive material such as copper or aluminium. The secondary heat sink may also be of a metal or other electrically conductive material.
The primary heat sink 2 and the secondary heat sink 3 are held in contact with one another by a mechanical retention arrangement. In this example, an interference fit between the projection 17 and the recess 19 provides for the mechanical retention. The thermal coupling is provided by the surface 7 being in close contact with the surface 6 when the primary and secondary heat sinks are coupled together.
The heat sinks 2, 3 described above are plate shaped although they may be any shape. When the semiconductor device 4 is a switching device for a high voltage power converter it is advantageous for a plurality of primary heat sinks to be arranged interleaved with a corresponding plurality of semiconductor devices and for the secondary heat sinks to project from the primary heat sinks such that they can be decoupled from their associated primary heat sink without disassembly of the interleaved primary heat sink arrangement.
Electrical connections between the primary electrical component 4 and the secondary electrical component 5 may also be provided. In some examples, the electrical conductivity of the primary and secondary heat sinks may be utilised to provide an electrical connection between the components.
The secondary electrical components 5 may comprise components electrically arranged with the semiconductor device 4 to form a circuit, such as a switching circuit of a power converter. In this example, the secondary electrical components 5 comprise one or more grading resistors to improve the distribution (grading) of voltage amongst the series connected semiconductor devices in the circuit. However, in other examples, the secondary electrical component may comprise a capacitor, such as a snubber capacitor configured to suppress voltage transients during switching of the semiconductor device; a controller configured to control, monitor or provide feedback from the semiconductor device. Thus, the controller may be configured to control one or more of the semiconductor devices of the primary heat sink. The controller may be configured to provide a turn-on signal to the semiconductor device; a turn-off signal to the semiconductor device; and/or a feedback signal based on the conduction state of the semiconductor device.
Each individual arrangement of primary and secondary heat sink 2, 3 and primary and secondary electrical component 4, 5 is substantially the same as described for
A clamping arrangement (not shown) is configured to clamp groups of heat sink/electrical component arrangements, 2, 4 together. The clamping arrangement may provide physical integrity to the stack and may ensure good thermal coupling between the primary electrical components 4 and the primary heat sinks 2 that surround them.
Electrical connections between the primary and secondary electrical components may be provided. Further electrical connections between secondary electrical components of adjacent (but could be elsewhere in the stack) arrangements 22, 23 may be provided. A gate electrical connection 25 comprising an electrical cable or an optical cable is provided between a controller that forms part of the electrical components 5e and the gate terminal of the primary electrical component (thyristor) 4. An anode electrical connection 26 is provided between the secondary electrical components 5e of the first arrangement 22 and the secondary electrical components 5e of the second arrangement 23. The anode connection may comprise an electrical cable. A cathode electrode connection is provided for by the conductivity of the primary heat sink 2 and the secondary heat sink 3. Accordingly, a cathode terminal of the primary electrical component 4 is connected to a terminal of one or more of the secondary electrical components via the electrical connection provided by the body of the heat sinks 2, 3.
In other embodiments, a plurality of primary electrical components may be provided on said primary heat sink. In other embodiments, the secondary heat sink may include at least one heat pipe having a working fluid therein for transferring thermal energy from an evaporator end to a condensing end, the condensing end arranged adjacent the heat transfer surface of the secondary heat sink. Thus, a heat pipe comprises a sealed body including a phase-change working fluid that absorbs heat at one end, evaporates, and transfers the heat to the condensing end. The working fluid is transferred back to the evaporator end by a wick within the heat pipe.
In other embodiments, the stack may comprise a stack of thyristors that may or may not be interleaved with primary heat sinks and the primary heat sinks may attach to the thyristors on any available thyristor surface.
A power converter 70 comprising, a LCC or VSC, may include a stack wherein the semiconductor devices 4 are configured to provide switching of a voltage between an AC network 71 and DC electrical network represented by DC terminals 72, 73. The assembly 1, comprising a stack, may form part of a limb of the converter 70 for switching a voltage of an electrical phase of the AC network or the voltage of the DC network, as will be understood by those skilled in the art.
This written description uses examples to disclose the invention, including the preferred embodiments, and also to enable any person skilled in the art to practice the invention, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the invention is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal languages of the claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 15275097.2 | Mar 2015 | EP | regional |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/EP2016/056821 | 3/29/2016 | WO | 00 |
