characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports

Industry

CPC
H01L21/67346

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67346characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports

Industries

Patents Grantslast 30 patents

Information Patent Grant
Magazine supporting equipment and semiconductor manufacturing appar...
- Patent number 11,955,359
- Issue date Apr 9, 2024
- Samsung Electronics Co., Ltd.
- Jun Young Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated guided vehicle with multistage loading structure
- Patent number 11,891,254
- Issue date Feb 6, 2024
- Samsung Electronics Co., Ltd.
- Bosung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic-layer-deposition equipment and atomiclayer-deposition method...
- Patent number 11,891,694
- Issue date Feb 6, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate holding and rotation mechanism and substrate processing a...
- Patent number 11,837,482
- Issue date Dec 5, 2023
- Ebara Corporation
- Shuichi Suemasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking apparatus and stacking method
- Patent number 11,823,935
- Issue date Nov 21, 2023
- Nikon Corporation
- Hajime Mitsuishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Frames stacked on substrate encircling devices and manufacturing me...
- Patent number 11,823,991
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tray module, tray assembly including the same, and method for manuf...
- Patent number 11,810,806
- Issue date Nov 7, 2023
- Samsung Display Co., Ltd.
- Jahuem Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming dice and structure of die
- Patent number 11,810,804
- Issue date Nov 7, 2023
- Vanguard International Semiconductor Corporation
- Hsiu-Mei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transport apparatus and control method
- Patent number 11,791,188
- Issue date Oct 17, 2023
- HIRATA CORPORATION
- Hirofumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch substrate support with warped substrate capability
- Patent number 11,784,075
- Issue date Oct 10, 2023
- Applied Materials, Inc.
- Shashidhara Patel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate transfer mechanism to reduce back-side substrate contact
- Patent number 11,784,076
- Issue date Oct 10, 2023
- Applied Materials, Inc.
- Masato Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier FOUP and a method of placing a carrier
- Patent number 11,756,816
- Issue date Sep 12, 2023
- Applied Materials, Inc.
- Steven Trey Tindel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate storage container
- Patent number 11,735,449
- Issue date Aug 22, 2023
- Shin-Etsu Polymer Co., Ltd.
- Kazumasa Onuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask arrangement for masking a substrate in a processing chamber, a...
- Patent number 11,718,904
- Issue date Aug 8, 2023
- Applied Materials, Inc.
- Stefan Bangert
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dynamic interface for providing a symmetric radio frequency return...
- Patent number 11,664,247
- Issue date May 30, 2023
- Applied Materials, Inc.
- Ravikumar Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin material handling carrier
- Patent number 11,658,059
- Issue date May 23, 2023
- II-VI DELAWARE, INC.
- John W. Stayt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier device
- Patent number 11,587,808
- Issue date Feb 21, 2023
- Powertech Technology Inc.
- Shih-Chun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer supporting mechanism and method for wafer dicing
- Patent number 11,587,809
- Issue date Feb 21, 2023
- Advanced Semiconductor Engineering, Inc.
- Bo Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer separating method
- Patent number 11,551,934
- Issue date Jan 10, 2023
- Kioxia Corporation
- Sho Kawadahara
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Tensioning device, base, clamp and method for clamping mask plate
- Patent number 11,535,925
- Issue date Dec 27, 2022
- BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
- Jianpeng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate storing container
- Patent number 11,501,990
- Issue date Nov 15, 2022
- Miraial Co., Ltd.
- Chiaki Matsutori
- E05 - LOCKS KEYS WINDOW OR DOOR FITTINGS SAFES
Information Patent Grant
Substrate processing apparatus for producing mixed processing liquid
- Patent number 11,437,251
- Issue date Sep 6, 2022
- TOKYO ELECTRON LIMI TED
- Hiroki Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor devices and apparatuses for...
- Patent number 11,430,665
- Issue date Aug 30, 2022
- Samsung Electronics Co., Ltd.
- Taisoo Lim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wafer supporting mechanism, chemical vapor deposition apparatus, an...
- Patent number 11,427,929
- Issue date Aug 30, 2022
- Showa Denko K.K.
- Jia Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate transfer mechanism to reduce back-side substrate contact
- Patent number 11,424,149
- Issue date Aug 23, 2022
- Applied Materials, Inc.
- Masato Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch substrate support with warped substrate capability
- Patent number 11,361,981
- Issue date Jun 14, 2022
- Applied Materials, Inc.
- Shashidhara Patel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus
- Patent number 11,328,910
- Issue date May 10, 2022
- Tokyo Electron Limited
- Eiichi Sugawara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacking structure applicable to manufacturing circuit board
- Patent number 11,322,377
- Issue date May 3, 2022
- Unimicron Technology Corp.
- Po-Hsuan Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrying apparatus and carrying method
- Patent number 11,315,814
- Issue date Apr 26, 2022
- BOE Technology Group Co., Ltd.
- Lankai Yeh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate holder and method for bonding two substrates
- Patent number 11,315,813
- Issue date Apr 26, 2022
- EV Group E. Thallner GmbH
- Thomas Wagenleitner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE TRANSFER MECHANISM TO REDUCE BACK-SIDE SUBSTRATE CONTACT
- Publication number 20230420279
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Masato ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230386991
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER FILM FRAME CARRIER
- Publication number 20230360940
- Publication date Nov 9, 2023
- Applied Materials, Inc.
- Jason A. Rye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY SEMICONDUCTOR STORAGE SYSTEM
- Publication number 20230343621
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Rong Syuan FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STAGE APPARATUS, CHARGED PARTICLE BEAM APPARATUS, AND OPTICAL INSPE...
- Publication number 20230343622
- Publication date Oct 26, 2023
- HITACHI HIGH-TECH CORPORATION
- Takanori KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC INTERFACE FOR PROVIDING A SYMMETRIC RADIO FREQUENCY RETURN...
- Publication number 20230298911
- Publication date Sep 21, 2023
- Applied Materials, Inc.
- Ravikumar Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CARRIER WITH RETICLE TEMPLATE FOR MARKING RETICLE FIELDS ON A...
- Publication number 20230282502
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Gabe Glass
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SUBSTRATE TRANSFER DOOR ASSEMBLIES WITH RADIATING ELEMENTS FOR SUBS...
- Publication number 20230253217
- Publication date Aug 10, 2023
- LAM RESEARCH CORPORATION
- John DREWERY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin Material Handling Carrier
- Publication number 20230253235
- Publication date Aug 10, 2023
- II-VI Delaware, Inc.
- John W. Stayt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC-LAYER-DEPOSITION EQUIPMENT AND ATOMICLAYER-DEPOSITION METHOD...
- Publication number 20230203653
- Publication date Jun 29, 2023
- SKY TECH INC.
- JING-CHENG LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WAFER SUPPORTING MECHANISM AND METHOD FOR WAFER DICING
- Publication number 20230197487
- Publication date Jun 22, 2023
- Advanced Semiconductor Engineering, Inc.
- Bo Hua CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Lifting Apparatus and Substrate Transferring Method
- Publication number 20230163010
- Publication date May 25, 2023
- ULVAC TECHNO, LTD.
- Katsunori Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-JIG WAFER CARRIER DISC INSTALLATION/UNINSTALLATION DEVICE AND M...
- Publication number 20230016132
- Publication date Jan 19, 2023
- KINGTEK ELECTRONICS TECHNOLOGY CORP.
- MAO-YEN SUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATORS FOR HANDLING, TRANSPORTING, OR STORING SEMICONDUCTOR WAFERS
- Publication number 20230005771
- Publication date Jan 5, 2023
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20220375768
- Publication date Nov 24, 2022
- TOKYO ELECTRON LIMITED
- Hiroki SAKURAI
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Method for Producing an Optoelectronic Semiconductor Component and...
- Publication number 20220376133
- Publication date Nov 24, 2022
- Osram Opto Semiconductors GmbH
- Ivar Tangring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSFER MECHANISM TO REDUCE BACK-SIDE SUBSTRATE CONTACT
- Publication number 20220351999
- Publication date Nov 3, 2022
- Applied Materials, Inc.
- Masato ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Rotating Disk Reactor with Split Substrate Carrier
- Publication number 20220243325
- Publication date Aug 4, 2022
- VEECO INSTRUMENTS, INC.
- Sandeep Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS
- Publication number 20220230857
- Publication date Jul 21, 2022
- TOKYO ELECTRON LIMITED
- Eiichi SUGAWARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STICKING AND BREAKAGE MITIGATION
- Publication number 20220220627
- Publication date Jul 14, 2022
- LAM RESEARCH CORPORATION
- Aaron Berke
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
SUBSTRATE STORING AND ALIGNING APPARATUS IN SUBSTRATE BONDING EQUIP...
- Publication number 20220208586
- Publication date Jun 30, 2022
- SEMES CO., LTD.
- Ho Cheon BANG
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Method of forming dice and structure of die
- Publication number 20220199438
- Publication date Jun 23, 2022
- Vanguard International Semiconductor Corporation
- Hsiu-Mei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION PLATE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
- Publication number 20220172947
- Publication date Jun 2, 2022
- SEMES CO., LTD.
- Dong Mok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC INTERFACE FOR PROVIDING A SYMMETRIC RADIO FREQUENCY RETURN...
- Publication number 20220122857
- Publication date Apr 21, 2022
- Applied Materials, Inc.
- Ravikumar Patil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING APPARATUS
- Publication number 20220108903
- Publication date Apr 7, 2022
- Disco Corporation
- Yoshinobu SAITO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER SUPPORTING MECHANISM AND METHOD FOR WAFER DICING
- Publication number 20220102176
- Publication date Mar 31, 2022
- Advanced Semiconductor Engineering, Inc.
- Bo Hua CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTING SHELF MODULE AND WAFER CONTAINER USING SAME
- Publication number 20220093434
- Publication date Mar 24, 2022
- GUDENG PRECISION INDUSTRIAL CO., LTD.
- MING-CHIEN CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HOLDING AND ROTATION MECHANISM AND SUBSTRATE PROCESSING A...
- Publication number 20220059378
- Publication date Feb 24, 2022
- EBARA CORPORATION
- Shuichi SUEMASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING UNIT FOR SUBSTRATES
- Publication number 20220037179
- Publication date Feb 3, 2022
- Heraeus Deutschland GmbH & Co. KG
- Hans-Jürgen Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...
- Publication number 20220002873
- Publication date Jan 6, 2022
- Kokusai Electric Corporation
- Kazuki NONOMURA
- H01 - BASIC ELECTRIC ELEMENTS

characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Magazine supporting equipment and semiconductor manufacturing appar...

Automated guided vehicle with multistage loading structure

Atomic-layer-deposition equipment and atomiclayer-deposition method...

Substrate holding and rotation mechanism and substrate processing a...

Stacking apparatus and stacking method

Frames stacked on substrate encircling devices and manufacturing me...

Tray module, tray assembly including the same, and method for manuf...

Method of forming dice and structure of die

Transport apparatus and control method

Batch substrate support with warped substrate capability

Substrate transfer mechanism to reduce back-side substrate contact

Carrier FOUP and a method of placing a carrier

Substrate storage container

Mask arrangement for masking a substrate in a processing chamber, a...

Dynamic interface for providing a symmetric radio frequency return...

Thin material handling carrier

Chip carrier device

Wafer supporting mechanism and method for wafer dicing

Wafer separating method

Tensioning device, base, clamp and method for clamping mask plate

Substrate storing container

Substrate processing apparatus for producing mixed processing liquid

Methods of manufacturing semiconductor devices and apparatuses for...

Wafer supporting mechanism, chemical vapor deposition apparatus, an...

Substrate transfer mechanism to reduce back-side substrate contact

Batch substrate support with warped substrate capability

Substrate processing apparatus

Stacking structure applicable to manufacturing circuit board

Carrying apparatus and carrying method

Substrate holder and method for bonding two substrates

Patents Applicationslast 30 patents

SUBSTRATE TRANSFER MECHANISM TO REDUCE BACK-SIDE SUBSTRATE CONTACT

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

WAFER FILM FRAME CARRIER

HIGH DENSITY SEMICONDUCTOR STORAGE SYSTEM

STAGE APPARATUS, CHARGED PARTICLE BEAM APPARATUS, AND OPTICAL INSPE...

DYNAMIC INTERFACE FOR PROVIDING A SYMMETRIC RADIO FREQUENCY RETURN...

WAFER CARRIER WITH RETICLE TEMPLATE FOR MARKING RETICLE FIELDS ON A...

SUBSTRATE TRANSFER DOOR ASSEMBLIES WITH RADIATING ELEMENTS FOR SUBS...

Thin Material Handling Carrier

ATOMIC-LAYER-DEPOSITION EQUIPMENT AND ATOMICLAYER-DEPOSITION METHOD...

WAFER SUPPORTING MECHANISM AND METHOD FOR WAFER DICING

Substrate Lifting Apparatus and Substrate Transferring Method

PRE-JIG WAFER CARRIER DISC INSTALLATION/UNINSTALLATION DEVICE AND M...

SEPARATORS FOR HANDLING, TRANSPORTING, OR STORING SEMICONDUCTOR WAFERS

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Method for Producing an Optoelectronic Semiconductor Component and...

SUBSTRATE TRANSFER MECHANISM TO REDUCE BACK-SIDE SUBSTRATE CONTACT

Rotating Disk Reactor with Split Substrate Carrier

SUBSTRATE PROCESSING APPARATUS

SUBSTRATE STICKING AND BREAKAGE MITIGATION

SUBSTRATE STORING AND ALIGNING APPARATUS IN SUBSTRATE BONDING EQUIP...

Method of forming dice and structure of die

INSULATION PLATE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME

DYNAMIC INTERFACE FOR PROVIDING A SYMMETRIC RADIO FREQUENCY RETURN...

PROCESSING APPARATUS

WAFER SUPPORTING MECHANISM AND METHOD FOR WAFER DICING

SUPPORTING SHELF MODULE AND WAFER CONTAINER USING SAME

SUBSTRATE HOLDING AND ROTATION MECHANISM AND SUBSTRATE PROCESSING A...

PACKAGING UNIT FOR SUBSTRATES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING...