DYNAMIC INTERFACE FOR PROVIDING A SYMMETRIC RADIO FREQUENCY RETURN PATH

Abstract

Exemplary substrate processing system may include a chamber body that defines a processing region. The systems may include a liner positioned atop the chamber body. The liner may include first disconnect members. The systems may include a faceplate that is positioned atop the liner. The systems may include a support disposed within the chamber body. The support may include a plate comprising a heater. The plate may include second disconnect members. The support may include a shaft coupled with the plate. The support may include a dynamic plate disposed about the shaft below the plate. The support may include metallic straps that couple the plate with the dynamic plate. The dynamic plate may include inner disconnect members and outer disconnect members. Inner disconnect members may be engageable with second disconnect members in a transfer position. Outer disconnect members may be engageable with first disconnect members in a process position.

Description

Claims

1. A substrate processing system, comprising: a chamber body that defines a processing region;a liner positioned atop the chamber body, wherein a bottom surface of the liner comprises a first plurality of quick disconnect members;a faceplate that is positioned atop the liner;a substrate support disposed within the chamber body, the substrate support comprising: a support plate comprising a heater;a shaft that is coupled with a bottom of the support plate;a dynamic plate disposed about the shaft and spaced a distance below the support plate; andat least one flexible member that couples a bottom of the support plate with the dynamic plate, wherein: a top surface of the dynamic plate comprises a second plurality of quick disconnect members; andeach of the second plurality of quick disconnect members is engageable with a respective one of the first plurality of quick disconnect members when the substrate support is in a process position.

2. The substrate processing system of claim 1, wherein: each of the second plurality of quick disconnect members is disengaged from the respective one of the first plurality of quick disconnect members when the substrate support is in a transfer position.

3. The substrate processing system of claim 1, further comprising: one or more springs that extend between and couple a bottom surface of the dynamic plate and a top surface of a bottom of the chamber body.

4. The substrate processing system of claim 3, wherein: each of the one or more springs is positioned about a guide pin.

5. The substrate processing system of claim 3, wherein: each of the one or more springs comprises a compression spring.

6. The substrate processing system of claim 3, further comprising: one or more isolators that isolate the one or more springs from RF current flowing through the dynamic plate.

7. The substrate processing system of claim 1, wherein: each of the at least one flexible member comprises one or both of a flexible bellow and a metallic strap.

8. The substrate processing system of claim 1, further comprising: a linear actuator that raises and lowers the dynamic plate between a process position and a transfer position.

9. The substrate processing system of claim 8, wherein: the linear actuator comprises one or both of a pneumatic lift and an electromechanical lift.

10. A substrate processing system, comprising: a chamber body that defines a processing region;a liner positioned atop the chamber body, wherein a bottom surface of the liner comprises a first plurality of quick disconnect members;a faceplate that is positioned atop the liner;a substrate support disposed within the chamber body, the substrate support comprising: a support plate comprising a heater;a shaft that is coupled with a bottom of the support plate;a dynamic plate disposed about the shaft and spaced a distance below the support plate, wherein the dynamic plate comprises an RF gasket that is engageable with the liner when the substrate support is in a process position; andat least one flexible member that couples a bottom of the support plate with the dynamic plate, wherein: a top surface of the dynamic plate comprises a second plurality of quick disconnect members; andeach of the second plurality of quick disconnect members is engageable with a respective one of the first plurality of quick disconnect members when the substrate support is in the process position.

11. The substrate processing system of claim 10, wherein: a bottom surface of the support plate comprises a third plurality of quick disconnect members;the top surface of the dynamic plate comprises a fourth plurality of quick disconnect members that are radially inward from the second plurality of quick disconnect members; and each of the third plurality of quick disconnect members is engaged with a respective one of the fourth plurality of quick disconnect members when the substrate support is in a transfer position.

12. The substrate processing system of claim 11, wherein: each of the third plurality of quick disconnect members is disengaged from the respective one of the fourth plurality of quick disconnect members when the substrate support is in the process position.

13. The substrate processing system of claim 11, further comprising: one or more springs that extend between and couple a bottom surface of the dynamic plate and a top surface of a bottom of the chamber body.

14. The substrate processing system of claim 13, further comprising: one or more isolators that isolate the one or more springs from RF current flowing through the dynamic plate.

15. The substrate processing system of claim 10, wherein: each of the at least one flexible member comprises one or both of a flexible bellow and a metallic strap.

16. The substrate processing system of claim 10, further comprising: a radio frequency source coupled with the substrate support, wherein in the process position, a closed radio frequency circuit is formed between the radio frequency source, the substrate support, the flexible member, the liner, and the faceplate.

17. The substrate processing system of claim 10, further comprising: a linear actuator that raises and lowers the dynamic plate between a process position and a transfer position.

18. A processing method, comprising: moving a substrate support upward within a semiconductor processing chamber from a transfer position to a process position to engage a plurality of quick disconnect members, wherein: when engaged, the plurality of disconnect members couple a liner of the semiconductor processing chamber with a dynamic plate of a substrate support; andthe support plate comprises a heater;delivering one or more precursors to the semiconductor processing chamber; andsupplying a radio frequency current to the heater via a radio frequency source, the liner, the dynamic plate, and at least one flexible member that is coupled with the heater.

19. The processing method of claim 18, wherein: in the process position an RF gasket couples the liner and the dynamic plate.

20. The processing method of claim 19, further comprising: moving the dynamic plate upward to the process position using one or more springs or a linear actuator.