characterized by laminating only or mainly similar single-sided circuit boards

Industry

CPC
H05K3/4617

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4617characterized by laminating only or mainly similar single-sided circuit boards

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bent laminated printed circuit board
- Patent number 12,108,524
- Issue date Oct 1, 2024
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,917,768
- Issue date Feb 27, 2024
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multilayer substrate and method for manufacturing the same
- Patent number 11,735,346
- Issue date Aug 22, 2023
- Murata Manufacturing Co., Ltd.
- Shingo Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buildup board structure
- Patent number 11,495,390
- Issue date Nov 8, 2022
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing circuit board
- Patent number 11,457,532
- Issue date Sep 27, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer substrate and method of producing multilayer substrate
- Patent number 11,443,886
- Issue date Sep 13, 2022
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,266,027
- Issue date Mar 1, 2022
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for producing resin multilayer board
- Patent number 11,212,923
- Issue date Dec 28, 2021
- Murata Manufacturing Co., Ltd.
- Jun Wakiyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of printed board
- Patent number 11,212,913
- Issue date Dec 28, 2021
- Murata Manufacturing Co., Ltd.
- Toshikazu Harada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,032,915
- Issue date Jun 8, 2021
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed wiring board and method for manufacturing the same
- Patent number 10,905,013
- Issue date Jan 26, 2021
- TDK Corporation
- Takaaki Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component, electronic device, and method for mounting el...
- Patent number 10,772,216
- Issue date Sep 8, 2020
- Murata Manufacturing Co., Ltd.
- Shingo Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 10,757,820
- Issue date Aug 25, 2020
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed wiring board, semiconductor package and method for manufact...
- Patent number 10,745,819
- Issue date Aug 18, 2020
- Ibiden Co., Ltd.
- Toshiki Furutani
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Resin multilayer substrate and method of manufacturing the same
- Patent number 10,743,414
- Issue date Aug 11, 2020
- Murata Manufacturing Co., Ltd.
- Toshiro Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-embedded substrate and method for manufacturing component...
- Patent number 10,709,020
- Issue date Jul 7, 2020
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio-frequency antenna, radio-frequency substrate with radio-frequ...
- Patent number 10,602,606
- Issue date Mar 24, 2020
- Schweizer Electronic AG
- Thomas Gottwald
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductor-structure element having an internal layer substrate lami...
- Patent number 10,555,419
- Issue date Feb 4, 2020
- Schweizer Electronic AG
- Thomas Gottwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered substrate and method for manufacturing the same
- Patent number 10,455,708
- Issue date Oct 22, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seok-Hwan Ahn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor package having a parallel plate waveguide
- Patent number 10,453,742
- Issue date Oct 22, 2019
- Infineon Technologies AG
- Reinhold Bayerer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate and electronic device
- Patent number 10,448,510
- Issue date Oct 15, 2019
- Murata Manufacturing Co., Ltd.
- Isamu Morita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Parallel plate waveguide for power semiconductor package
- Patent number 10,319,631
- Issue date Jun 11, 2019
- Infineon Technologies AG
- Reinhold Bayerer
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Multilayer substrate and manufacturing method for the multilayer su...
- Patent number 10,285,269
- Issue date May 7, 2019
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Buildup board structure
- Patent number 10,256,028
- Issue date Apr 9, 2019
- Kinsus Interconnect Technology Corp.
- Ting-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser diode chip on printed circuit board
- Patent number 10,257,932
- Issue date Apr 9, 2019
- Microsoft Technology Licensing, LLC
- David Mandelboum
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Component built-in multilayer substrate fabricating method
- Patent number 10,237,978
- Issue date Mar 19, 2019
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board using laser direct structuring additive
- Patent number 10,123,414
- Issue date Nov 6, 2018
- Murata Manufacturing Co., Ltd.
- Kuniaki Yosui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip component-embedded resin multilayer substrate and manufacturin...
- Patent number 10,083,887
- Issue date Sep 25, 2018
- Murata Manufacturing Co., Ltd.
- Yoichi Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable circuit board and method for manufacturing the same
- Patent number 10,076,025
- Issue date Sep 11, 2018
- Nippon Mektron, Ltd.
- Masayuki Iwase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of multilayer printed wiring board
- Patent number 10,004,148
- Issue date Jun 19, 2018
- Nippon Mektron, Ltd.
- Shoji Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER BOARD AND METHOD FOR MANUFACTURING MULTILAYER BOARD
- Publication number 20240147613
- Publication date May 2, 2024
- FICT LIMITED
- Takashi Nakagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20220394859
- Publication date Dec 8, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- FU-YUN SHEN
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...
- Publication number 20220151081
- Publication date May 12, 2022
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF PRINTED BOARD
- Publication number 20220087011
- Publication date Mar 17, 2022
- MURATA MANUFACTURING CO., LTD.
- Toshikazu HARADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20200137894
- Publication date Apr 30, 2020
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- FU-YUN SHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200029433
- Publication date Jan 23, 2020
- Unimicron Technology Corp.
- Chien-Chen LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER DIODE CHIP ON PRINTED CIRCUIT BOARD
- Publication number 20190208630
- Publication date Jul 4, 2019
- Microsoft Technology Licensing, LLC
- David MANDELBOUM
- F21 - LIGHTING
Information Patent Application
BUILDUP BOARD STRUCTURE
- Publication number 20190189335
- Publication date Jun 20, 2019
- KINSUS INTERCONNECT TECHNOLOGY CORP.
- Ting-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND METHOD FOR MOUNTING EL...
- Publication number 20190090359
- Publication date Mar 21, 2019
- Murata Manufacturing Co., Ltd.
- Shingo ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF PRINTED BOARD
- Publication number 20190053369
- Publication date Feb 14, 2019
- Denso Corporation
- Toshikazu HARADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACT...
- Publication number 20180237934
- Publication date Aug 23, 2018
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Radio-frequency antenna, radio-frequency substrate with radio-frequ...
- Publication number 20180220526
- Publication date Aug 2, 2018
- Schweizer Electronic AG
- Thomas GOTTWALD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING LAYERED ELECTRONIC DEVICES
- Publication number 20180054894
- Publication date Feb 22, 2018
- HAMILTON SUNDSTRAND CORPORATION
- Slade R. Culp
- B32 - LAYERED PRODUCTS
Information Patent Application
COMPOSITE WIRING BOARD AND METHOD FOR MANUFACTURING COMPOSITE WIRIN...
- Publication number 20170374742
- Publication date Dec 28, 2017
- IBIDEN CO., LTD.
- Takahisa HIRASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILA...
- Publication number 20170367197
- Publication date Dec 21, 2017
- NIPPON MEKTRON, LTD.
- Shoji Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN FILM COMPONENT SHEET, BOARD WITH BUILT-IN ELECTRONIC COMPONENT...
- Publication number 20170290165
- Publication date Oct 5, 2017
- TDK Corporation
- Hitoshi SAITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING LAYERED CIRCUIT BOARD, LAYERED CIRCUIT BOA...
- Publication number 20160360617
- Publication date Dec 8, 2016
- Fujitsu Limited
- Takashi Kanda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED CIRCUIT SUBSTRATE
- Publication number 20150296621
- Publication date Oct 15, 2015
- Murata Manufacturing Co., Ltd.
- Kuniaki YOSUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20140374153
- Publication date Dec 25, 2014
- ZHEN DING TECHNOLOGY CO., LTD.
- YU-HSIEN LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-Layer Printed Circuit Board and Method for Fabricating Multi-...
- Publication number 20140345932
- Publication date Nov 27, 2014
- Mingli Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE
- Publication number 20140321086
- Publication date Oct 30, 2014
- Toshiro Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE
- Publication number 20140321085
- Publication date Oct 30, 2014
- Toshiro Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUITRY WITH HIGH ASPECT RATIO TRACES
- Publication number 20140262444
- Publication date Sep 18, 2014
- George Gregoire
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE
- Publication number 20140264737
- Publication date Sep 18, 2014
- Murata Manufacturing Co., Ltd.
- Naoki GOUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT BUILT-IN BOARD MOUNTING BODY AND METHOD OF MANUFACTURING...
- Publication number 20140211437
- Publication date Jul 31, 2014
- FUJIKURA LTD.
- Nobuki Ueta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible Printed Circuit
- Publication number 20140190729
- Publication date Jul 10, 2014
- Drew Stone Briggs
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140166346
- Publication date Jun 19, 2014
- NGK Spark Plug Co., Ltd.
- Yuma OTSUKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140158408
- Publication date Jun 12, 2014
- FUJIKURA LTD.
- Kumi Onodera
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT-EMBEDDED BOARD AND METHOD OF MANUFACTURING SAME
- Publication number 20140133118
- Publication date May 15, 2014
- FUJIKURA LTD.
- Yoshinori SANO
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CHIP COMPONENT-EMBEDDED RESIN MULTILAYER SUBSTRATE AND MANUFACTURIN...
- Publication number 20140029222
- Publication date Jan 30, 2014
- Murata Manufacturing Co., Ltd.
- Yoichi Saito
- H01 - BASIC ELECTRIC ELEMENTS

characterized by laminating only or mainly similar single-sided circuit boards

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bent laminated printed circuit board

Single-layer circuit board, multi-layer circuit board, and manufact...

Multilayer substrate and method for manufacturing the same

Buildup board structure

Method of manufacturing circuit board

Multilayer substrate and method of producing multilayer substrate

Single-layer circuit board, multi-layer circuit board, and manufact...

Method for producing resin multilayer board

Manufacturing method of printed board

Single-layer circuit board, multi-layer circuit board, and manufact...

Printed wiring board and method for manufacturing the same

Electronic component, electronic device, and method for mounting el...

Single-layer circuit board, multi-layer circuit board, and manufact...

Printed wiring board, semiconductor package and method for manufact...

Resin multilayer substrate and method of manufacturing the same

Component-embedded substrate and method for manufacturing component...

Radio-frequency antenna, radio-frequency substrate with radio-frequ...

Conductor-structure element having an internal layer substrate lami...

Multilayered substrate and method for manufacturing the same

Power semiconductor package having a parallel plate waveguide

Multilayer substrate and electronic device

Parallel plate waveguide for power semiconductor package

Multilayer substrate and manufacturing method for the multilayer su...

Buildup board structure

Laser diode chip on printed circuit board

Component built-in multilayer substrate fabricating method

Multilayer circuit board using laser direct structuring additive

Chip component-embedded resin multilayer substrate and manufacturin...

Stretchable circuit board and method for manufacturing the same

Manufacturing method of multilayer printed wiring board

Patents Applicationslast 30 patents

MULTILAYER BOARD AND METHOD FOR MANUFACTURING MULTILAYER BOARD

METHOD OF MANUFACTURING CIRCUIT BOARD

SINGLE-LAYER CIRCUIT BOARD, MULTI-LAYER CIRCUIT BOARD, AND MANUFACT...

MANUFACTURING METHOD OF PRINTED BOARD

METHOD OF MANUFACTURING CIRCUIT BOARD

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

LASER DIODE CHIP ON PRINTED CIRCUIT BOARD

BUILDUP BOARD STRUCTURE

ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND METHOD FOR MOUNTING EL...

MANUFACTURING METHOD OF PRINTED BOARD

PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACT...

Radio-frequency antenna, radio-frequency substrate with radio-frequ...

METHOD FOR MANUFACTURING LAYERED ELECTRONIC DEVICES

COMPOSITE WIRING BOARD AND METHOD FOR MANUFACTURING COMPOSITE WIRIN...

MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILA...

THIN FILM COMPONENT SHEET, BOARD WITH BUILT-IN ELECTRONIC COMPONENT...

METHOD FOR MANUFACTURING LAYERED CIRCUIT BOARD, LAYERED CIRCUIT BOA...

LAMINATED CIRCUIT SUBSTRATE

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

Multi-Layer Printed Circuit Board and Method for Fabricating Multi-...

COMPONENT-EMBEDDED SUBSTRATE

COMPONENT-EMBEDDED SUBSTRATE

CIRCUITRY WITH HIGH ASPECT RATIO TRACES

COMPONENT-EMBEDDED SUBSTRATE

COMPONENT BUILT-IN BOARD MOUNTING BODY AND METHOD OF MANUFACTURING...

Flexible Printed Circuit

CERAMIC SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME

MULTI-LAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

COMPONENT-EMBEDDED BOARD AND METHOD OF MANUFACTURING SAME

CHIP COMPONENT-EMBEDDED RESIN MULTILAYER SUBSTRATE AND MANUFACTURIN...