characterized by the construction of the load-lock chamber

Industry

CPC
H01L21/67201

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67201characterized by the construction of the load-lock chamber

Industries

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus
- Patent number 11,967,513
- Issue date Apr 23, 2024
- Kokusai Electric Corporation
- Teruo Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate transfer device and substrate processing system
- Patent number 11,948,822
- Issue date Apr 2, 2024
- Tokyo Electron Limited
- Dongwei Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for processing substrates or wafers
- Patent number 11,948,810
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Chao Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Particle beam inspection apparatus
- Patent number 11,942,340
- Issue date Mar 26, 2024
- ASML Netherlands B.V.
- Jeroen Gerard Gosen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular mainframe layout for supporting multiple semiconductor proc...
- Patent number 11,935,770
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Randy A. Harris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for load-locked printing
- Patent number 11,926,902
- Issue date Mar 12, 2024
- Kateeva, Inc.
- Sass Somekh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for workpiece processing
- Patent number 11,923,215
- Issue date Mar 5, 2024
- Beijing E-Town Semiconductor Technology Co., Ltd.
- Michael Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing system having a front opening unified pod (FOUP) load lock
- Patent number 11,923,217
- Issue date Mar 5, 2024
- Applied Materials, Inc.
- Jacob Newman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer robot for reduced footprint platform architecture
- Patent number 11,908,714
- Issue date Feb 20, 2024
- Lam Research Corporation
- Richard H. Gould
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods, systems, and apparatus for conducting a radical treatment...
- Patent number 11,901,195
- Issue date Feb 13, 2024
- Applied Materials, Inc.
- Pradeep Sampath Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vapor deposition device
- Patent number 11,898,246
- Issue date Feb 13, 2024
- Sumco Corporation
- Naoyuki Wada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate inspection system and method of use thereof
- Patent number 11,901,202
- Issue date Feb 13, 2024
- JNK TECH
- Youngjin Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate retaining apparatus, system including the apparatus, and...
- Patent number 11,885,023
- Issue date Jan 30, 2024
- ASM IP Holding B.V.
- Shiva K. T. Rajavelu Muralidhar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-chamber substrate processing platform
- Patent number 11,860,528
- Issue date Jan 2, 2024
- Applied Materials, Inc.
- Ribhu Gautam
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing system, vacuum substrate transfer module, and...
- Patent number 11,862,506
- Issue date Jan 2, 2024
- Tokyo Electron Limited
- Norihiko Amikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing apparatus and method utilizing electrostat...
- Patent number 11,854,860
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsai-Hao Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,856,655
- Issue date Dec 26, 2023
- Tokyo Electron Limited
- Hirofumi Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer handling chamber with moisture reduction
- Patent number 11,837,483
- Issue date Dec 5, 2023
- ASM IP Holding B.V.
- Petri Raisanen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Control of wafer bow in multiple stations
- Patent number 11,823,928
- Issue date Nov 21, 2023
- Lam Research Corporation
- Edward Augustyniak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Calibration of an aligner station of a processing system
- Patent number 11,823,937
- Issue date Nov 21, 2023
- Applied Materials, Inc.
- Nicholas Michael Bergantz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-wafer volume single transfer chamber facet
- Patent number 11,817,332
- Issue date Nov 14, 2023
- Applied Materials, Inc.
- William T. Weaver
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
UHV in-situ cryo-cool chamber
- Patent number 11,802,340
- Issue date Oct 31, 2023
- Applied Materials, Inc.
- Bharath Swaminathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for load-locked printing
- Patent number 11,802,331
- Issue date Oct 31, 2023
- Kateeva, Inc.
- Sass Somekh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate transfer system and load lock module
- Patent number 11,791,180
- Issue date Oct 17, 2023
- Tokyo Electron Limited
- Norihiko Amikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate transfer mechanism to reduce back-side substrate contact
- Patent number 11,784,076
- Issue date Oct 10, 2023
- Applied Materials, Inc.
- Masato Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum processing device
- Patent number 11,776,828
- Issue date Oct 3, 2023
- Tokyo Electron Limited
- Hiromitsu Sakaue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate treating apparatus
- Patent number 11,756,813
- Issue date Sep 12, 2023
- Semes Co., Ltd.
- Yong Seok Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PECVD apparatus for in-situ deposition of film stacks
- Patent number 11,746,420
- Issue date Sep 5, 2023
- Novellus Systems, Inc.
- Pramod Subramonium
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Auto-calibration to a station of a process module that spins a wafer
- Patent number 11,742,229
- Issue date Aug 29, 2023
- Lam Research Corporation
- Jacob L. Hiester
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Equipment front end module
- Patent number 11,715,659
- Issue date Aug 1, 2023
- PICO & TERA CO., LTD.
- Bum Je Woo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WORKPIECE HANDLING ARCHITECTURE FOR HIGH WORKPIECE THROUGHPUT
- Publication number 20240145270
- Publication date May 2, 2024
- Applied Materials, Inc.
- Jason M. Schaller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE HANDLING ARCHITECTURE FOR HIGH WORKPIECE THROUGHPUT
- Publication number 20240145271
- Publication date May 2, 2024
- Applied Materials, Inc.
- Jason M. Schaller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE RETAINING APPARATUS, SYSTEM INCLUDING THE APPARATUS, AND...
- Publication number 20240133035
- Publication date Apr 25, 2024
- ASM IP HOLDING B.V.
- SHIVA K.T. RAJAVELU MURALIDHAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOAD LOCK CHAMBER AND APPARATUS FOR TREATING SUBSTRATE
- Publication number 20240136210
- Publication date Apr 25, 2024
- PSK INC.
- Jong-Chan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CONTROLLING SUBSTRATE TRANSFER SYSTEM
- Publication number 20240128110
- Publication date Apr 18, 2024
- TOKYO ELECTRON LIMITED
- Kosuke KINOSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING APPARATUS
- Publication number 20240120226
- Publication date Apr 11, 2024
- ASM IP HOLDING, B.V.
- Yoshiyuki Umeoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOAD LOCK CHAMBERS AND RELATED METHODS AND STRUCTURES FOR BATCH COO...
- Publication number 20240120220
- Publication date Apr 11, 2024
- Applied Materials, Inc.
- Vishwas Kumar PANDEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND MAINTENANCE METHOD
- Publication number 20240105478
- Publication date Mar 28, 2024
- TOKYO ELECTRON LIMITED
- Takashi DOKAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTAT...
- Publication number 20240087945
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsai-Hao HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-chamber Configuration
- Publication number 20240087924
- Publication date Mar 14, 2024
- HINE AUTOMATION, LLC
- Joseph Arthur Kraus
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
OPERATIONS OF ROBOT APPARATUSES WITHIN RECTANGULAR MAINFRAMES
- Publication number 20240071802
- Publication date Feb 29, 2024
- Applied Materials, Inc.
- Paul Z. Wirth
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
CONTROL OF WAFER BOW IN MULTIPLE STATIONS
- Publication number 20240055285
- Publication date Feb 15, 2024
- LAM RESEARCH CORPORATION
- Edward Augustyniak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240047233
- Publication date Feb 8, 2024
- Kokusai Electric Corporation
- Naofumi OHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOAD PORT AND MULTI-USE CARRIER
- Publication number 20240038559
- Publication date Feb 1, 2024
- Brillian Network & Automation Integrated System Co., Ltd.
- YI-JUN GU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL DEVICE, SUBSTRATE PROCESSING SYSTEM, AND METHOD OF CONTROLL...
- Publication number 20240030046
- Publication date Jan 25, 2024
- TOKYO ELECTRON LIMITED
- Takuya YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TRANSFER APPARATUS CAPABLE OF AUTOMATIC TEACHING AND SEMICOND...
- Publication number 20240021452
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Beomsoo Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CALIBRATION OF AN ALIGNER STATION OF A PROCESSING SYSTEM
- Publication number 20240021458
- Publication date Jan 18, 2024
- Applied Materials, Inc.
- Nicholas Michael Bergantz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHARGED-PARTICLE INSPECTION APPARATUS
- Publication number 20240014053
- Publication date Jan 11, 2024
- ASML NETHERLANDS B.V.
- Dongchi YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR REDUCING PARTICLE CONTAMINATION OF WAFE...
- Publication number 20240006202
- Publication date Jan 4, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Zheng-Hao Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSFER MECHANISM TO REDUCE BACK-SIDE SUBSTRATE CONTACT
- Publication number 20230420279
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Masato ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOAD PORT MODULE
- Publication number 20230411187
- Publication date Dec 21, 2023
- BROOKS AUTOMATION US, LLC
- Radik Sunugatov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EQUIPMENT FRONT END MODULE, OPERATING METHOD THEREOF, AND SUBSTRATE...
- Publication number 20230411186
- Publication date Dec 21, 2023
- SEMES CO., LTD.
- Duk Hyun Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20230402303
- Publication date Dec 14, 2023
- TOKYO ELECTRON LIMITED
- Tsunenaga Nakashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTO-CALIBRATION TO A STATION OF A PROCESS MODULE THAT SPINS A WAFER
- Publication number 20230395410
- Publication date Dec 7, 2023
- LAM RESEARCH CORPORATION
- Jacob L. Hiester
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20230386871
- Publication date Nov 30, 2023
- Kokusai Electric Corporation
- Naoki HARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WET PROCESSING SYSTEM AND SYSTEM AND METHOD FOR MANUFACTURING SEMIC...
- Publication number 20230386870
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- YING-CHIEH MENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TRANSPORT
- Publication number 20230377924
- Publication date Nov 23, 2023
- BOOKS AUTOMATION US, LLC
- Daniel BABBS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PECVD APPARATUS FOR IN-SITU DEPOSITION OF FILM STACKS
- Publication number 20230366094
- Publication date Nov 16, 2023
- Novellus Systems, Inc.
- Jason Dirk Haverkamp
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOAD LOCK FAST PUMP VENT
- Publication number 20230335414
- Publication date Oct 19, 2023
- BROOKS AUTOMATION US, LLC
- Christopher HOFMEISTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFER CHAMBER AND WAFER PROCESSING MODULE COMPRISING TRANSFER CH...
- Publication number 20230317479
- Publication date Oct 5, 2023
- SEMES CO., LTD.
- Shi Hyun PARK
- H01 - BASIC ELECTRIC ELEMENTS

characterized by the construction of the load-lock chamber

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate processing apparatus

Substrate transfer device and substrate processing system

Apparatus for processing substrates or wafers

Particle beam inspection apparatus

Modular mainframe layout for supporting multiple semiconductor proc...

Method and apparatus for load-locked printing

Systems and methods for workpiece processing

Processing system having a front opening unified pod (FOUP) load lock

Transfer robot for reduced footprint platform architecture

Methods, systems, and apparatus for conducting a radical treatment...

Vapor deposition device

Substrate inspection system and method of use thereof

Substrate retaining apparatus, system including the apparatus, and...

Multi-chamber substrate processing platform

Substrate processing system, vacuum substrate transfer module, and...

Semiconductor processing apparatus and method utilizing electrostat...

Substrate processing apparatus and substrate processing method

Wafer handling chamber with moisture reduction

Control of wafer bow in multiple stations

Calibration of an aligner station of a processing system

Multi-wafer volume single transfer chamber facet

UHV in-situ cryo-cool chamber

Method and apparatus for load-locked printing

Substrate transfer system and load lock module

Substrate transfer mechanism to reduce back-side substrate contact

Vacuum processing device

Substrate treating apparatus

PECVD apparatus for in-situ deposition of film stacks

Auto-calibration to a station of a process module that spins a wafer

Equipment front end module

Patents Applicationslast 30 patents

WORKPIECE HANDLING ARCHITECTURE FOR HIGH WORKPIECE THROUGHPUT

WORKPIECE HANDLING ARCHITECTURE FOR HIGH WORKPIECE THROUGHPUT

SUBSTRATE RETAINING APPARATUS, SYSTEM INCLUDING THE APPARATUS, AND...

LOAD LOCK CHAMBER AND APPARATUS FOR TREATING SUBSTRATE

METHOD OF CONTROLLING SUBSTRATE TRANSFER SYSTEM

WAFER PROCESSING APPARATUS

LOAD LOCK CHAMBERS AND RELATED METHODS AND STRUCTURES FOR BATCH COO...

SUBSTRATE PROCESSING SYSTEM AND MAINTENANCE METHOD

SEMICONDUCTOR PROCESSING APPARATUS AND METHOD UTILIZING ELECTROSTAT...

Multi-chamber Configuration

OPERATIONS OF ROBOT APPARATUSES WITHIN RECTANGULAR MAINFRAMES

CONTROL OF WAFER BOW IN MULTIPLE STATIONS

SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...

LOAD PORT AND MULTI-USE CARRIER

CONTROL DEVICE, SUBSTRATE PROCESSING SYSTEM, AND METHOD OF CONTROLL...

WAFER TRANSFER APPARATUS CAPABLE OF AUTOMATIC TEACHING AND SEMICOND...

CALIBRATION OF AN ALIGNER STATION OF A PROCESSING SYSTEM

CHARGED-PARTICLE INSPECTION APPARATUS

APPARATUSES AND METHODS FOR REDUCING PARTICLE CONTAMINATION OF WAFE...

SUBSTRATE TRANSFER MECHANISM TO REDUCE BACK-SIDE SUBSTRATE CONTACT

LOAD PORT MODULE

EQUIPMENT FRONT END MODULE, OPERATING METHOD THEREOF, AND SUBSTRATE...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

AUTO-CALIBRATION TO A STATION OF A PROCESS MODULE THAT SPINS A WAFER

SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCT...

WET PROCESSING SYSTEM AND SYSTEM AND METHOD FOR MANUFACTURING SEMIC...

SUBSTRATE TRANSPORT

PECVD APPARATUS FOR IN-SITU DEPOSITION OF FILM STACKS

LOAD LOCK FAST PUMP VENT

TRANSFER CHAMBER AND WAFER PROCESSING MODULE COMPRISING TRANSFER CH...