Charge transfer devices

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CPC
H01L29/66946

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier

Current Industry

H01L29/66946Charge transfer devices

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a solid-state image capturing apparatus
- Patent number 7,867,810
- Issue date Jan 11, 2011
- Sharp Kabushiki Kaisha
- Tetsuya Hatai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
CCD with improved charge transfer
- Patent number 7,807,514
- Issue date Oct 5, 2010
- Eastman Kodak Company
- Christopher Parks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of solid-state imaging device
- Patent number 7,585,694
- Issue date Sep 8, 2009
- Panasonic Corporation
- Akira Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging apparatus and manufacturing method thereof
- Patent number 7,422,925
- Issue date Sep 9, 2008
- Matsushita Electric Industrial Co. Ltd.
- Toshihiro Kuriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, a manufacturing method thereof, and a camera
- Patent number 7,411,229
- Issue date Aug 12, 2008
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image pickup device and fabrication method thereof
- Patent number 7,230,288
- Issue date Jun 12, 2007
- Sony Corporation
- Junji Yamane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image pickup device and fabrication method thereof
- Patent number 7,125,740
- Issue date Oct 24, 2006
- Sony Corporation
- Junji Yamane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, a manufacturing method thereof, and a camera
- Patent number 7,061,030
- Issue date Jun 13, 2006
- Matsushita Electric Industrial Co., Ltd.
- Hiroshi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and method for producing the same
- Patent number 6,963,093
- Issue date Nov 8, 2005
- Matsushita Electric Industrial Co., Ltd.
- Tohru Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state image pickup device and fabrication method thereof
- Patent number 6,784,469
- Issue date Aug 31, 2004
- Sony Corporation
- Junji Yamane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation-hard silicon cryo-CMOS process suitable for charge-couple...
- Patent number 6,440,782
- Issue date Aug 27, 2002
- Hughes Electronics
- Chen-Chi P. Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charge transfer device and solid image pickup apparatus using the same
- Patent number 6,426,238
- Issue date Jul 30, 2002
- NEC Corporation
- Michihiro Morimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming three-dimensional features on substrates with adj...
- Patent number 5,202,286
- Issue date Apr 13, 1993
- Mitsubishi Denki Kabushiki Kaisha
- Mitsunori Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned, high resolution resonant dielectric lithography
- Patent number 5,040,020
- Issue date Aug 13, 1991
- Cornell Research Foundation, Inc.
- Kurt Rauschenbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated gate MESFET and method of trimming
- Patent number 5,010,377
- Issue date Apr 23, 1991
- Harris Corporation
- James D. Beasom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolated gate MESFET and method of making and trimming
- Patent number 4,948,746
- Issue date Aug 14, 1990
- Harris Corporation
- James D. Beasom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned, high resolution resonant dielectric lithography
- Patent number 4,898,804
- Issue date Feb 6, 1990
- Cornell Research Foundation
- Kurt Rauschenbach
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for manufacturing a solid-state image capturing apparatus, a...
- Publication number 20090258456
- Publication date Oct 15, 2009
- Sharp Kabushiki Kaisha
- Tetsuya Hatai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Manufacturing Method of Solid-State Imaging Device
- Publication number 20080213935
- Publication date Sep 4, 2008
- Akira Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CCD with improved charge transfer
- Publication number 20070254413
- Publication date Nov 1, 2007
- Eastman Kodak Company
- Christopher Parks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of semiconductor device and semiconductor device
- Publication number 20070235820
- Publication date Oct 11, 2007
- FUJIFILM Corporation
- Yasuo Ohtsuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid-state image pickup device and fabrication method thereof
- Publication number 20070004077
- Publication date Jan 4, 2007
- Sony Corporation
- Junji Yamane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, a manufacturing method thereof, and a camera
- Publication number 20060186439
- Publication date Aug 24, 2006
- Hiroshi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device, a manufacturing method thereof, and a camera
- Publication number 20050051811
- Publication date Mar 10, 2005
- Hiroshi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid-state image pickup device and manufacturing method thereof
- Publication number 20050036052
- Publication date Feb 17, 2005
- Sony Corporation
- Katsunori Kokubun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid-state image pickup device and fabrication method thereof
- Publication number 20040259280
- Publication date Dec 23, 2004
- Sony Corporation
- Junji Yamane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid-state imaging apparatus and manufacturing method thereof
- Publication number 20040233314
- Publication date Nov 25, 2004
- Toshihiro Kuriyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solid-state imaging device and method for producing the same
- Publication number 20040129956
- Publication date Jul 8, 2004
- Matsushita Electric Industrial Co., Ltd.
- Tohru Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Charge transfer device and solid image pickup apparatus using the same
- Publication number 20020022293
- Publication date Feb 21, 2002
- NEC Corporation
- Michihiro Morimoto
- H01 - BASIC ELECTRIC ELEMENTS

Charge transfer devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing a solid-state image capturing apparatus

CCD with improved charge transfer

Manufacturing method of solid-state imaging device

Solid-state imaging apparatus and manufacturing method thereof

Semiconductor device, a manufacturing method thereof, and a camera

Solid-state image pickup device and fabrication method thereof

Solid-state image pickup device and fabrication method thereof

Semiconductor device, a manufacturing method thereof, and a camera

Solid-state imaging device and method for producing the same

Solid-state image pickup device and fabrication method thereof

Radiation-hard silicon cryo-CMOS process suitable for charge-couple...

Charge transfer device and solid image pickup apparatus using the same

Method of forming three-dimensional features on substrates with adj...

Self-aligned, high resolution resonant dielectric lithography

Isolated gate MESFET and method of trimming

Isolated gate MESFET and method of making and trimming

Self-aligned, high resolution resonant dielectric lithography

Patents Applicationslast 30 patents

Method for manufacturing a solid-state image capturing apparatus, a...

Manufacturing Method of Solid-State Imaging Device

CCD with improved charge transfer

Manufacturing method of semiconductor device and semiconductor device

Solid-state image pickup device and fabrication method thereof

Semiconductor device, a manufacturing method thereof, and a camera

Semiconductor device, a manufacturing method thereof, and a camera

Solid-state image pickup device and manufacturing method thereof

Solid-state image pickup device and fabrication method thereof

Solid-state imaging apparatus and manufacturing method thereof

Solid-state imaging device and method for producing the same

Charge transfer device and solid image pickup apparatus using the same