Chemical cleaning

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H01L2224/83011

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/83011Chemical cleaning

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Techniques for processing devices
- Patent number 11,855,064
- Issue date Dec 26, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 11,472,171
- Issue date Oct 18, 2022
- X Display Company Technology Limited
- Christopher Bower
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Techniques for processing devices
- Patent number 11,037,919
- Issue date Jun 15, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding semiconductor substrates
- Patent number 10,886,252
- Issue date Jan 5, 2021
- Imec VZW
- Lan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device and semiconductor device
- Patent number 10,818,581
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Toshiyuki Hata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic interconnect, a method of manufacturing a metallic interco...
- Patent number 10,734,352
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for processing devices
- Patent number 10,727,219
- Issue date Jul 28, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for the fluidic assembly of micro-LEDs utilizing...
- Patent number 10,535,640
- Issue date Jan 14, 2020
- eLux Inc.
- Jong-Jan Lee
- G02 - OPTICS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 10,252,514
- Issue date Apr 9, 2019
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Bonding method using bonding material
- Patent number 10,090,275
- Issue date Oct 2, 2018
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Strong, heat stable junction
- Patent number 10,026,708
- Issue date Jul 17, 2018
- The United States of America as represented by the Secretary of the Army
- Patrick J Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding material and bonding method using the same
- Patent number 10,008,471
- Issue date Jun 26, 2018
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for performing direct bonding between two structures
- Patent number 9,922,954
- Issue date Mar 20, 2018
- Commisariat A l'Energie Atomique et Aux Energies Alternatives
- Hubert Moriceau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Au-based solder die attachment semiconductor device and method for...
- Patent number 9,698,082
- Issue date Jul 4, 2017
- Nissan Motor Co., Ltd.
- Satoshi Tanimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates
- Patent number 9,673,167
- Issue date Jun 6, 2017
- EV Group E. Thallner GmbH
- Markus Wimplinger
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sealing structure for a bonded wafer and method of forming the seal...
- Patent number 9,653,312
- Issue date May 16, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Yuankun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding metallic contact areas with solution of a sacrif...
- Patent number 9,640,510
- Issue date May 2, 2017
- EV Group E. Thallner GmbH
- Bernhard Rebhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded processed semiconductor structures and carriers
- Patent number 9,553,014
- Issue date Jan 24, 2017
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 9,550,353
- Issue date Jan 24, 2017
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Semiconductor device and method of fabricating same
- Patent number 9,536,855
- Issue date Jan 3, 2017
- Mitsubishi Electric Corporation
- Koji Yamazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 9,434,150
- Issue date Sep 6, 2016
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Method of manufacturing light-emitting device and wiring substrate...
- Patent number 9,368,675
- Issue date Jun 14, 2016
- Nichia Corporation
- Yoshikazu Takeuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for micro-transfer-printing
- Patent number 9,358,775
- Issue date Jun 7, 2016
- X-CELEPRINT LIMITED
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Electronic device and method for fabricating an electronic device
- Patent number 9,355,984
- Issue date May 31, 2016
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding material and bonding method using the same
- Patent number 9,240,256
- Issue date Jan 19, 2016
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor composite apparatus, method for manufacturing the sem...
- Patent number 9,093,562
- Issue date Jul 28, 2015
- Oki Data Corporation
- Mitsuhiko Ogihara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Bonded processed semiconductor structures and carriers
- Patent number 9,041,214
- Issue date May 26, 2015
- Soitec
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and substrate bonding method
- Patent number 8,916,449
- Issue date Dec 23, 2014
- Asia Pacific Microsystems, Inc.
- Hung-Lin Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing wafer-bonded semiconductor device
- Patent number 8,889,441
- Issue date Nov 18, 2014
- Hitachi, Ltd.
- Toshiaki Takai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Metal bonding method and metal bonded structure
- Patent number 8,814,029
- Issue date Aug 26, 2014
- Sanyo Electric Co., LTD
- Yasuyuki Yanase
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
TECHNIQUES FOR PROCESSING DEVICES
- Publication number 20240371850
- Publication date Nov 7, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING TECHNIQUES FOR STACKED TRANSISTOR STRUCTURES
- Publication number 20240321855
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-De Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNING BONDING BY HYDROPHILIC CONTRAST
- Publication number 20230420408
- Publication date Dec 28, 2023
- COMMISSARIA À L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- Pierre Montmeat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230115289
- Publication date Apr 13, 2023
- Mitsubishi Electric Corporation
- Koji YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR PROCESSING DEVICES
- Publication number 20210375850
- Publication date Dec 2, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVALENTLY BONDED SEMICONDUCTOR INTERFACES
- Publication number 20210225803
- Publication date Jul 22, 2021
- G-ray Industries SA
- Hans VON KÄNEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR PROCESSING DEVICES
- Publication number 20200365575
- Publication date Nov 19, 2020
- Invensas Bonding Technologies, Inc.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR PROCESSING DEVICES
- Publication number 20190252364
- Publication date Aug 15, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallic Interconnect, a Method of Manufacturing a Metallic Interco...
- Publication number 20190103378
- Publication date Apr 4, 2019
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING SEMICONDUCTOR SUBSTRATES
- Publication number 20180247914
- Publication date Aug 30, 2018
- IMEC vzw
- Lan Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
- Publication number 20180001614
- Publication date Jan 4, 2018
- X-Celeprint Limited
- Christopher Bower
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
- Publication number 20170207193
- Publication date Jul 20, 2017
- X-Celeprint Limited
- Christopher Bower
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD FOR PERFORMING DIRECT BONDING BETWEEN TWO STRUCTURES
- Publication number 20170179073
- Publication date Jun 22, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Hubert MORICEAU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING
- Publication number 20170103964
- Publication date Apr 13, 2017
- X-Celeprint Limited
- Christopher Andrew Bower
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Electrical Connecting Element and Method for Manufacturing the Same
- Publication number 20140217593
- Publication date Aug 7, 2014
- National Chiao Tung University
- Chih CHEN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRONG, HEAT STABLE JUNCTION
- Publication number 20140110848
- Publication date Apr 24, 2014
- U.S. ARMY RESEARCH LABORATORY ATTN: RDRL-LOC-I
- Patrick J. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, A...
- Publication number 20140035167
- Publication date Feb 6, 2014
- ROBERT BOSCH GmbH
- Christoph Schelling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Package Structure and Substrate Bonding Method
- Publication number 20130285248
- Publication date Oct 31, 2013
- ASIA PACIFIC MICROSYSTEMS, INC.
- Hung-Lin Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDED PROCESSED SEMICONDUCTOR STRUCTURES AND CARRIERS
- Publication number 20130256907
- Publication date Oct 3, 2013
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING METHOD AND METAL BONDED STRUCTURE
- Publication number 20130216302
- Publication date Aug 22, 2013
- Sanyo Electric Co., Ltd.
- Yasuyuki YANASE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WAFER-BONDED SEMICONDUCTOR DEVICE
- Publication number 20130029438
- Publication date Jan 31, 2013
- Toshiaki Takai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING THE SAME
- Publication number 20120298009
- Publication date Nov 29, 2012
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METALLIC THERMAL JOINT FOR HIGH POWER DENSITY CHIPS
- Publication number 20120153453
- Publication date Jun 21, 2012
- ORACLE AMERICA, INC.
- Seshasayee Ankireddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR WAFER TO WAFER BONDING IN SEMICONDUCTOR PA...
- Publication number 20120115305
- Publication date May 10, 2012
- Taiwan Semiconductor Manufacturing Co., LTD
- Jung-Huei PENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TEMPORARY SEMICONDUCTOR STRUCTURE BONDING METHODS AND RELATED BONDE...
- Publication number 20120013013
- Publication date Jan 19, 2012
- Mariam Sadaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor composite apparatus, method for manufacturing the sem...
- Publication number 20110081738
- Publication date Apr 7, 2011
- Oki Data Corporation
- Mitsuhiko Ogihara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Semiconductor composite apparatus, method for manufacturing the sem...
- Publication number 20060097354
- Publication date May 11, 2006
- Mitsuhiko Ogihara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Chemical cleaning

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Techniques for processing devices

Apparatus and methods for micro-transfer-printing

Techniques for processing devices

Method of bonding semiconductor substrates

Method of manufacturing semiconductor device and semiconductor device

Metallic interconnect, a method of manufacturing a metallic interco...

Techniques for processing devices

System and method for the fluidic assembly of micro-LEDs utilizing...

Apparatus and methods for micro-transfer-printing

Bonding method using bonding material

Strong, heat stable junction

Bonding material and bonding method using the same

Method for performing direct bonding between two structures

Au-based solder die attachment semiconductor device and method for...

Method for bonding substrates

Sealing structure for a bonded wafer and method of forming the seal...

Method for bonding metallic contact areas with solution of a sacrif...

Bonded processed semiconductor structures and carriers

Apparatus and methods for micro-transfer-printing

Semiconductor device and method of fabricating same

Apparatus and methods for micro-transfer-printing

Method of manufacturing light-emitting device and wiring substrate...

Apparatus and methods for micro-transfer-printing

Electronic device and method for fabricating an electronic device

Bonding material and bonding method using the same

Semiconductor composite apparatus, method for manufacturing the sem...

Bonded processed semiconductor structures and carriers

Package structure and substrate bonding method

Method for manufacturing wafer-bonded semiconductor device

Metal bonding method and metal bonded structure

Patents Applicationslast 30 patents

TECHNIQUES FOR PROCESSING DEVICES

BONDING TECHNIQUES FOR STACKED TRANSISTOR STRUCTURES

SELF-ALIGNING BONDING BY HYDROPHILIC CONTRAST

SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

TECHNIQUES FOR PROCESSING DEVICES

COVALENTLY BONDED SEMICONDUCTOR INTERFACES

TECHNIQUES FOR PROCESSING DEVICES

TECHNIQUES FOR PROCESSING DEVICES

Metallic Interconnect, a Method of Manufacturing a Metallic Interco...

METHOD OF BONDING SEMICONDUCTOR SUBSTRATES

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

METHOD FOR PERFORMING DIRECT BONDING BETWEEN TWO STRUCTURES

APPARATUS AND METHODS FOR MICRO-TRANSFER-PRINTING

Electrical Connecting Element and Method for Manufacturing the Same

STRONG, HEAT STABLE JUNCTION

METHOD FOR PRODUCING A BONDING PAD FOR THERMOCOMPRESSION BONDING, A...

Package Structure and Substrate Bonding Method

BONDED PROCESSED SEMICONDUCTOR STRUCTURES AND CARRIERS

METAL BONDING METHOD AND METAL BONDED STRUCTURE

METHOD FOR MANUFACTURING WAFER-BONDED SEMICONDUCTOR DEVICE

BONDING MATERIAL AND BONDING METHOD USING THE SAME

METALLIC THERMAL JOINT FOR HIGH POWER DENSITY CHIPS

METHOD AND STRUCTURE FOR WAFER TO WAFER BONDING IN SEMICONDUCTOR PA...

TEMPORARY SEMICONDUCTOR STRUCTURE BONDING METHODS AND RELATED BONDE...

Semiconductor composite apparatus, method for manufacturing the sem...

Semiconductor composite apparatus, method for manufacturing the sem...