Chemical mechanical polishing [CMP]

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CPC
H01L2224/11845

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/11845Chemical mechanical polishing [CMP]

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Metal bonding structure and manufacturing method thereof
- Patent number 12,113,042
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Liang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 12,074,106
- Issue date Aug 27, 2024
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for preparing the same
- Patent number 11,973,046
- Issue date Apr 30, 2024
- SJ Semiconductor (Jiangyin) Corporation
- Jiashan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,842,992
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder based hybrid bonding for fine pitch and thin BLT interconnec...
- Patent number 11,810,882
- Issue date Nov 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect integration processes and structures
- Patent number 11,699,651
- Issue date Jul 11, 2023
- Applied Materials, Inc.
- Richard W. Plavidal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 11,342,322
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,257,776
- Issue date Feb 22, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature hybrid bonding structures and manufacturing method...
- Patent number 11,205,635
- Issue date Dec 21, 2021
- Shun-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of integrated fan-out package
- Patent number 10,867,953
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ai-Tee Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 10,727,218
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structures and methods of forming same
- Patent number 10,453,832
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 10,276,537
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ai-Tee Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laterally extended conductive bump buffer
- Patent number 10,276,530
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsiang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 10,262,959
- Issue date Apr 16, 2019
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing solder pad topology differences by planarization
- Patent number 9,935,069
- Issue date Apr 3, 2018
- Lumileds LLC
- Jipu Lei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing an electronic device, and electronic device...
- Patent number 9,911,642
- Issue date Mar 6, 2018
- Fujitsu Limited
- Taiji Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices and methods of forming thereof
- Patent number 9,484,316
- Issue date Nov 1, 2016
- Infineon Technologies AG
- Evelyn Napetschnig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode body, wiring substrate, and semiconductor device
- Patent number 9,425,135
- Issue date Aug 23, 2016
- Olympus Corporation
- Chihiro Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC chip package and chip-on-glass structure using the same
- Patent number 9,236,360
- Issue date Jan 12, 2016
- Novatek Microelectronics Corp.
- Tai-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor device packages
- Patent number 9,202,714
- Issue date Dec 1, 2015
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structure and method for forming the same
- Patent number 9,159,685
- Issue date Oct 13, 2015
- ChipMOS Technologies Inc.
- Geng-Shin Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-wafer bonding method and bonding device, and structure comp...
- Patent number 9,142,532
- Issue date Sep 22, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly apparatus and associated methods
- Patent number 9,040,348
- Issue date May 26, 2015
- Altera Corporation
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive resin composition, photosensitive resin composition...
- Patent number 8,946,852
- Issue date Feb 3, 2015
- Toray Industries, Inc.
- Hiroyuki Niwa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Carbon nanotube structures for enhancement of thermal dissipation f...
- Patent number 8,933,559
- Issue date Jan 13, 2015
- International Business Machines Corporation
- Veeraraghavan S. Basker
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Electronic device having electrodes bonded with each other
- Patent number 8,922,027
- Issue date Dec 30, 2014
- Fujitsu Limited
- Taiji Sakai
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Grant
Method for bonding semiconductor substrates and devices obtained th...
- Patent number 8,912,044
- Issue date Dec 16, 2014
- IMEC
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having electrodes bonded with each other
- Patent number 8,860,232
- Issue date Oct 14, 2014
- Fujitsu Limited
- Taiji Sakai
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Grant
Semiconductor device, method for manufacturing semiconductor device...
- Patent number 8,610,269
- Issue date Dec 17, 2013
- NEC Corporation
- Kenji Nanba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379611
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED METAL PADS
- Publication number 20240088072
- Publication date Mar 14, 2024
- Micron Technology, Inc.
- Tsung Han Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20240071973
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...
- Publication number 20230282605
- Publication date Sep 7, 2023
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220310550
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Liang LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING THE SAME
- Publication number 20220077092
- Publication date Mar 10, 2022
- SJ Semiconductor(Jiangyin) Corporation
- Jiashan Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE HYBRID BONDING STRUCTURES AND MANUFACTURING METHOD...
- Publication number 20210242166
- Publication date Aug 5, 2021
- SHUN-PING HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210082853
- Publication date Mar 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF INTEGRATED FAN-OUT PACKAGE
- Publication number 20190252339
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ai-Tee Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING STRUCTURES AND METHODS OF FORMING SAME
- Publication number 20190109125
- Publication date Apr 11, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuo-Ming Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190096840
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ai-Tee Ang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING SOLDER PAD TOPOLOGY DIFFERENCES BY PLANARIZATION
- Publication number 20160181216
- Publication date Jun 23, 2016
- Koninklijke Philips N.V.
- Jipu Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20150011082
- Publication date Jan 8, 2015
- CHIPMOS TECHNOLOGIES INC.
- Geng-Shin SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...
- Publication number 20140342504
- Publication date Nov 20, 2014
- FUJITSU LIMITED
- Taiji SAKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20140175655
- Publication date Jun 26, 2014
- Jui-Chin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR SUBSTRATES AND DEVICES OBTAINED TH...
- Publication number 20140170813
- Publication date Jun 19, 2014
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PACKAGING POWER DEVICES AT WAFER LEVEL
- Publication number 20140147973
- Publication date May 29, 2014
- Hyuk-soon CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20130280861
- Publication date Oct 24, 2013
- Micron Technology, Inc.
- Zhaohui Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE BODY, WIRING SUBSTRATE, AND SEMICONDUCTOR DEVICE
- Publication number 20130256880
- Publication date Oct 3, 2013
- OLYMPUS CORPORATION
- Chihiro Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE, CHIP BONDING STRUCTURE USING THE SAME, AND MANUFACT...
- Publication number 20130249086
- Publication date Sep 26, 2013
- Raydium Semiconductor Corporation
- Ching-San Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION...
- Publication number 20130214379
- Publication date Aug 22, 2013
- TORAY INDUSTRIES, INC.
- Hiroyuki Niwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...
- Publication number 20130187293
- Publication date Jul 25, 2013
- Fujitsu Limited
- Taiji SAKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20130127047
- Publication date May 23, 2013
- CHIPMOS TECHNOLOGIES INC.
- Geng-Shin SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC CHIP PACKAGE AND CHIP-ON-GLASS STRUCTURE USING THE SAME
- Publication number 20130093081
- Publication date Apr 18, 2013
- NOVATEK MICROELECTRONICS CORP.
- Tai-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY APPARATUS AND ASSOCIATED METHODS
- Publication number 20130069230
- Publication date Mar 21, 2013
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY APPARATUS AND ASSOCIATED METHODS
- Publication number 20130071969
- Publication date Mar 21, 2013
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING RECONSTITUTED WAFERS AND METHOD FOR PRODUCING...
- Publication number 20120315710
- Publication date Dec 13, 2012
- Kazuyuki Hozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON NANOTUBE STRUCTURES FOR ENHANCEMENT OF THERMAL DISSIPATION F...
- Publication number 20120168931
- Publication date Jul 5, 2012
- International Business Machines Corporation
- Veeraraghavan S. Basker
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20120104602
- Publication date May 3, 2012
- Kenji Nanba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-CHIP STRUCTURE AND MANUFACTURING METHOD THEROF
- Publication number 20120104597
- Publication date May 3, 2012
- Kabushiki Kaisha Toshiba
- Tatsuji Ishiduka
- H01 - BASIC ELECTRIC ELEMENTS

Chemical mechanical polishing [CMP]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Metal bonding structure and manufacturing method thereof

Fan-out interconnect integration processes and structures

Semiconductor structure and method for preparing the same

Seal ring structures and methods of forming same

Solder based hybrid bonding for fine pitch and thin BLT interconnec...

Fan-out interconnect integration processes and structures

Seal ring structures and methods of forming same

Semiconductor package structure and method for manufacturing the same

Low temperature hybrid bonding structures and manufacturing method...

Manufacturing method of integrated fan-out package

Seal ring structures and methods of forming same

Seal ring structures and methods of forming same

Integrated fan-out package and manufacturing method thereof

Laterally extended conductive bump buffer

Semiconductor devices and methods of forming thereof

Reducing solder pad topology differences by planarization

Method of manufacturing an electronic device, and electronic device...

Semiconductor devices and methods of forming thereof

Electrode body, wiring substrate, and semiconductor device

IC chip package and chip-on-glass structure using the same

Methods for forming semiconductor device packages

Conductive structure and method for forming the same

Chip-on-wafer bonding method and bonding device, and structure comp...

Electronic assembly apparatus and associated methods

Photosensitive resin composition, photosensitive resin composition...

Carbon nanotube structures for enhancement of thermal dissipation f...

Electronic device having electrodes bonded with each other

Method for bonding semiconductor substrates and devices obtained th...

Electronic device having electrodes bonded with each other

Semiconductor device, method for manufacturing semiconductor device...

Patents Applicationslast 30 patents

METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

EMBEDDED METAL PADS

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

SOLDER BASED HYBRID BONDING FOR FINE PITCH AND THIN BLT INTERCONNEC...

METAL BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING THE SAME

LOW TEMPERATURE HYBRID BONDING STRUCTURES AND MANUFACTURING METHOD...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

MANUFACTURING METHOD OF INTEGRATED FAN-OUT PACKAGE

SEAL RING STRUCTURES AND METHODS OF FORMING SAME

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

REDUCING SOLDER PAD TOPOLOGY DIFFERENCES BY PLANARIZATION

CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SAME

ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...

CHIP BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD FOR BONDING SEMICONDUCTOR SUBSTRATES AND DEVICES OBTAINED TH...

METHOD OF PACKAGING POWER DEVICES AT WAFER LEVEL

METHODS FOR FORMING SEMICONDUCTOR DEVICE PACKAGES

ELECTRODE BODY, WIRING SUBSTRATE, AND SEMICONDUCTOR DEVICE

CHIP STRUCTURE, CHIP BONDING STRUCTURE USING THE SAME, AND MANUFACT...

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION...

ELECTRONIC DEVICE, METHOD OF MANUFACTURING, AND ELECTRONIC DEVICE M...

CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SAME

IC CHIP PACKAGE AND CHIP-ON-GLASS STRUCTURE USING THE SAME

ELECTRONIC ASSEMBLY APPARATUS AND ASSOCIATED METHODS

ELECTRONIC ASSEMBLY APPARATUS AND ASSOCIATED METHODS

METHOD FOR PRODUCING RECONSTITUTED WAFERS AND METHOD FOR PRODUCING...

CARBON NANOTUBE STRUCTURES FOR ENHANCEMENT OF THERMAL DISSIPATION F...

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

CHIP-ON-CHIP STRUCTURE AND MANUFACTURING METHOD THEROF