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Chemical vapour deposition [CVD]
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H01L2224/03827
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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/03827
Chemical vapour deposition [CVD]
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device with metal film on surface between passivation...
Patent number
12,057,416
Issue date
Aug 6, 2024
Sumitomo Electric Industries, Ltd.
Mitsuhiko Sakai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package, method of forming a chip package and method of formin...
Patent number
12,033,972
Issue date
Jul 9, 2024
Infineon Technologies AG
Joachim Mahler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure including buffer layer
Patent number
11,810,879
Issue date
Nov 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Gulbagh Singh
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor package and method for manufacturing the same
Patent number
11,430,761
Issue date
Aug 30, 2022
Advanced Semiconductor Engineering, Inc.
Yun-Ching Hung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of designing a layout, method of making a semiconductor stru...
Patent number
11,309,268
Issue date
Apr 19, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Gulbagh Singh
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Bonded assembly containing a dielectric bonding pattern definition...
Patent number
11,094,653
Issue date
Aug 17, 2021
SanDisk Technologies LLC
Chen Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming an electrical contact and method of forming a chi...
Patent number
10,978,418
Issue date
Apr 13, 2021
Infineon Technologies AG
Joachim Mahler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die structure, die stack structure and method of fabricating the same
Patent number
10,867,943
Issue date
Dec 15, 2020
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Hsiu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication of solder balls with injection molded solder
Patent number
10,741,514
Issue date
Aug 11, 2020
International Business Machines Corporation
Toyohiro Aoki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with post passivation structure
Patent number
10,727,191
Issue date
Jul 28, 2020
Taiwan Semiconductor Manufacturing Company, Ltd
Gulbagh Singh
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Chip package and method of forming a chip package with a metal cont...
Patent number
10,461,056
Issue date
Oct 29, 2019
Infineon Technologies AG
Joachim Mahler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices and methods of manufacture thereof
Patent number
10,269,743
Issue date
Apr 23, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuei-Sung Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with post passivation structure and fabricatio...
Patent number
10,163,831
Issue date
Dec 25, 2018
Taiwan Semiconductor Manufacturing Company, Ltd
Gulbagh Singh
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
9,607,962
Issue date
Mar 28, 2017
Renesas Electronics Corporation
Kentaro Saito
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnet assisted alignment method for wafer bonding and wafer level...
Patent number
9,012,265
Issue date
Apr 21, 2015
Ge Yi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR ELEMENT WITH BONDING LAYER HAVING LOW-K DIELECTRIC MA...
Publication number
20240332227
Publication date
Oct 3, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THICK REDISTRIBUTION LAYER FEATURES
Publication number
20240088074
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Feng Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20220181279
Publication date
Jun 9, 2022
Sumitomo Electric Industries, Ltd.
Mitsuhiko SAKAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20210257331
Publication date
Aug 19, 2021
Advanced Semiconductor Engineering, Inc.
Yun-Ching HUNG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED ASSEMBLY CONTAINING A DIELECTRIC BONDING PATTERN DEFINITION...
Publication number
20210143115
Publication date
May 13, 2021
SANDISK TECHNOLOGIES LLC
Chen WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
Publication number
20210082861
Publication date
Mar 18, 2021
INFINEON TECHNOLOGIES AG
Joachim Mahler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER
Publication number
20200075522
Publication date
Mar 5, 2020
International Business Machines Corporation
Toyohiro Aoki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE WITH A METAL CONT...
Publication number
20200013749
Publication date
Jan 9, 2020
INFINEON TECHNOLOGIES AG
Joachim Mahler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE STRUCTURE, DIE STACK STRUCTURE AND METHOD OF FABRICATING THE SAME
Publication number
20190385963
Publication date
Dec 19, 2019
Taiwan Semiconductor Manufacturing Co., Ltd.
Yi-Hsiu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
Publication number
20190244919
Publication date
Aug 8, 2019
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuei-Sung Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH POST PASSIVATION STRUCTURE AND FABRICATIO...
Publication number
20180315723
Publication date
Nov 1, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Gulbagh SINGH
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE AND METHOD OF FORMIN...
Publication number
20170338169
Publication date
Nov 23, 2017
INFINEON TECHNOLOGIES AG
Joachim Mahler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
Publication number
20170221843
Publication date
Aug 3, 2017
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuei-Sung Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...
Publication number
20140054800
Publication date
Feb 27, 2014
INFINEON TECHNOLOGIES AG
Johann Gatterbauer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Magnet Assisted Alignment Method for Wafer Bonding and Wafer Level...
Publication number
20130252375
Publication date
Sep 26, 2013
Ge Yi
H01 - BASIC ELECTRIC ELEMENTS