Chromium (Cr) as principal constituent

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H01L2224/85471

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/85471Chromium (Cr) as principal constituent

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Patents Grantslast 30 patents

Information Patent Grant
Light emitting device and light emitting module
- Patent number 10,297,716
- Issue date May 21, 2019
- LG Innotek Co., Ltd
- Shuhei Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, semiconductor package, and electronic device...
- Patent number 10,083,136
- Issue date Sep 25, 2018
- Samsung Electronics Co., Ltd.
- Nam-ho Song
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor die package including embedded flip chip
- Patent number 7,768,108
- Issue date Aug 3, 2010
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 5,939,783
- Issue date Aug 17, 1999
- International Business Machines Corporation
- Eric Herman Laine
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE PACKAGE INCLUDING EMBEDDED FLIP CHIP
- Publication number 20090230537
- Publication date Sep 17, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS