Chromium (Cr) as principal constituent

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CPC
H01L2224/48871

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/48871Chromium (Cr) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Device including a semiconductor chip and wires
- Patent number 9,305,876
- Issue date Apr 5, 2016
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging methods and packaged semiconductor devices
- Patent number 9,263,412
- Issue date Feb 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor chip having two metal layers on one face
- Patent number 8,643,176
- Issue date Feb 4, 2014
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level processing method and structure to manufacture semicond...
- Patent number 8,431,977
- Issue date Apr 30, 2013
- Megica Corporation
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having contact elements with a specified cross se...
- Patent number 8,227,908
- Issue date Jul 24, 2012
- Infineon Technologies AG
- Ralf Otremba
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having improved contact interface reliability...
- Patent number 8,193,624
- Issue date Jun 5, 2012
- Amkor Technology, Inc.
- Eun Sook Sohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package including embedded flip chip
- Patent number 7,768,108
- Issue date Aug 3, 2010
- Fairchild Semiconductor Corporation
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method of manufacture
- Patent number 6,164,523
- Issue date Dec 26, 2000
- Semiconductor Components Industries, LLC
- Joseph K. Fauty
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for obtaining metallurgical stability in integrated circuit...
- Patent number 5,455,195
- Issue date Oct 3, 1995
- Texas Instruments Incorporated
- Thomas H. Ramsey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Packaging Methods and Packaged Semiconductor Devices
- Publication number 20140367867
- Publication date Dec 18, 2014
- Wei-Hung Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...
- Publication number 20140327018
- Publication date Nov 6, 2014
- Kohei Tatsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Including a Semiconductor Chip and Wires
- Publication number 20140218885
- Publication date Aug 7, 2014
- Infineon Technologies Austria AG
- Khalil Hosseini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR DEVICE
- Publication number 20140103537
- Publication date Apr 17, 2014
- PANASONIC CORPORATION
- Kazuhiro KAIBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Chip Having Two Metal Layers on One Face
- Publication number 20130027113
- Publication date Jan 31, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including a Contact Clip Having Protrusions an...
- Publication number 20130009295
- Publication date Jan 10, 2013
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING THEREOF
- Publication number 20120286293
- Publication date Nov 15, 2012
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
WAFER LEVEL PROCESSING METHOD AND STRUCTURE TO MANUFACTURE SEMICOND...
- Publication number 20110304008
- Publication date Dec 15, 2011
- Magica Corporation
- Ping-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING THEREOF
- Publication number 20100001291
- Publication date Jan 7, 2010
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DIE PACKAGE INCLUDING EMBEDDED FLIP CHIP
- Publication number 20090230537
- Publication date Sep 17, 2009
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS

Chromium (Cr) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Device including a semiconductor chip and wires

Packaging methods and packaged semiconductor devices

Power semiconductor chip having two metal layers on one face

Wafer level processing method and structure to manufacture semicond...

Electronic device having contact elements with a specified cross se...

Semiconductor device having improved contact interface reliability...

Semiconductor die package including embedded flip chip

Electronic component and method of manufacture

Method for obtaining metallurgical stability in integrated circuit...

Patents Applicationslast 30 patents

Packaging Methods and Packaged Semiconductor Devices

POWER SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE DEVICE AND...

Device Including a Semiconductor Chip and Wires

NITRIDE SEMICONDUCTOR DEVICE

Power Semiconductor Chip Having Two Metal Layers on One Face

Semiconductor Device Including a Contact Clip Having Protrusions an...

ELECTRONIC DEVICE AND MANUFACTURING THEREOF

WAFER LEVEL PROCESSING METHOD AND STRUCTURE TO MANUFACTURE SEMICOND...

ELECTRONIC DEVICE AND MANUFACTURING THEREOF

SEMICONDUCTOR DIE PACKAGE INCLUDING EMBEDDED FLIP CHIP