Cleaning after the substrates have been singulated

Industry

CPC
H01L21/02076

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/02076Cleaning after the substrates have been singulated

Industries

Patents Grantslast 30 patents

Information Patent Grant
Die cleaning systems and related methods
- Patent number 11,854,889
- Issue date Dec 26, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods, systems, and apparatus for tape-frame substrate cleaning a...
- Patent number 11,837,464
- Issue date Dec 5, 2023
- Applied Materials, Inc.
- Ying Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disposing protective cover film and underfill layer over singulated...
- Patent number 11,784,092
- Issue date Oct 10, 2023
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask-integrated surface protective tape
- Patent number 11,707,804
- Issue date Jul 25, 2023
- Furukawa Electric Co., Ltd.
- Hirotoki Yokoi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Automated transfer and drying tool for process chamber
- Patent number 11,699,619
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Sheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processed stacked dies
- Patent number 11,652,083
- Issue date May 16, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing protective film agent
- Patent number 11,637,033
- Issue date Apr 25, 2023
- Disco Corporation
- Senichi Ryo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing method of wafer
- Patent number 11,600,513
- Issue date Mar 7, 2023
- Disco Corporation
- Masaru Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary bonding scheme
- Patent number 11,328,972
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wan-Yu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective film agent for laser dicing
- Patent number 11,322,383
- Issue date May 3, 2022
- Disco Corporation
- Senichi Ryo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic cleaning system and method
- Patent number 11,286,849
- Issue date Mar 29, 2022
- General Electric Company
- Bernard Patrick Bewlay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-absorbing mask for hybrid laser scribing and plasma etch wafe...
- Patent number 11,158,540
- Issue date Oct 26, 2021
- Applied Materials, Inc.
- Wenguang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Saw assisted facet etch dicing
- Patent number 11,150,409
- Issue date Oct 19, 2021
- GenXComm, Inc.
- Brian Mattis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge cut debond using a temporary filler material with no adhesive...
- Patent number 11,094,684
- Issue date Aug 17, 2021
- Micron Technology, Inc.
- Chandra S. Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cleaning method for cleaning frame unit
- Patent number 11,090,691
- Issue date Aug 17, 2021
- Disco Corporation
- Yukito Akutagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask-integrated surface protective tape
- Patent number 11,056,388
- Issue date Jul 6, 2021
- Furukawa Electric Co., Ltd.
- Yusuke Goto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method of semiconductor chip and bonding apparatus of semic...
- Patent number 11,018,112
- Issue date May 25, 2021
- Kabushiki Kaisha Toshiba
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated transfer and drying tool for process chamber
- Patent number 10,991,625
- Issue date Apr 27, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Sheng Kuo
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Mask-integrated surface protective film
- Patent number 10,916,439
- Issue date Feb 9, 2021
- Furukawa Electric Co., Ltd.
- Hirotoki Yokoi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of dicing a semiconductor wafer using a protective film form...
- Patent number 10,896,849
- Issue date Jan 19, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidehiko Karasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processed stacked dies
- Patent number 10,879,212
- Issue date Dec 29, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post etch defluorination process
- Patent number 10,872,761
- Issue date Dec 22, 2020
- Mattson Technology Inc.
- Vijay Vaniapura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method of semiconductor chip and bonding apparatus of semic...
- Patent number 10,847,497
- Issue date Nov 24, 2020
- Kabushiki Kaisha Toshiba
- Yoichiro Kurita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece-separating device and workpiece-separating method
- Patent number 10,840,141
- Issue date Nov 17, 2020
- Shin-Etsu Engineering Co., Ltd.
- Yoshikazu Ohtani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for cutting element chip by laser scribing
- Patent number 10,818,553
- Issue date Oct 27, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shogo Okita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die tray with channels
- Patent number 10,796,936
- Issue date Oct 6, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for monitoring treatment of microelectronic subst...
- Patent number 10,748,788
- Issue date Aug 18, 2020
- Tel FSI, Inc.
- Brent D. Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device wafer processing method
- Patent number 10,679,897
- Issue date Jun 9, 2020
- Disco Corporation
- Koichi Shigematsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated transfer and drying tool for process chamber
- Patent number 10,665,507
- Issue date May 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Sheng Kuo
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of manufacturing element chip
- Patent number 10,607,846
- Issue date Mar 31, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidehiko Karasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DIE CLEANING SYSTEMS AND RELATED METHODS
- Publication number 20240079274
- Publication date Mar 7, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS, SYSTEMS, AND APPARATUS FOR TAPE-FRAME SUBSTRATE CLEANING A...
- Publication number 20240071745
- Publication date Feb 29, 2024
- Ying WANG
- B08 - CLEANING
Information Patent Application
COATING COMPOSITION FOR WAFER PROTECTION AND METHOD OF MANUFACTURIN...
- Publication number 20240038551
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Woojung PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFE...
- Publication number 20240038536
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- YONGIN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WAFER PROCESSING METHOD
- Publication number 20240006239
- Publication date Jan 4, 2024
- Disco Corporation
- Naoko YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WAFER PROCESSING METHOD AND PROCESSING APPARATUS
- Publication number 20240006240
- Publication date Jan 4, 2024
- Disco Corporation
- Naoko YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING METHOD
- Publication number 20230377938
- Publication date Nov 23, 2023
- Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
- Wanli GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20230298940
- Publication date Sep 21, 2023
- Disco Corporation
- Masaru Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSED STACKED DIES
- Publication number 20230282610
- Publication date Sep 7, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME
- Publication number 20230230882
- Publication date Jul 20, 2023
- Taiwan Semiconductor Manufacturing CO.,LTD.
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, AND APPARATUS FOR TAPE-FRAME SUBSTRATE CLEANING A...
- Publication number 20230215722
- Publication date Jul 6, 2023
- Ying WANG
- B08 - CLEANING
Information Patent Application
HYBRID BOND METHOD FOR FIXING DIES
- Publication number 20220367232
- Publication date Nov 17, 2022
- SAULTECH TECHNOLOGY CO., LTD.
- YEN HAO LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CLEANING APPARATUS AND METHOD OF CONTROLLING THE SAME
- Publication number 20220344194
- Publication date Oct 27, 2022
- ZEUS CO., LTD.
- Seung Dae BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CLEANING APPARATUS
- Publication number 20220344195
- Publication date Oct 27, 2022
- ZEUS CO., LTD.
- Seung Dae BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE FILM AGENT FOR LASER DICING
- Publication number 20220139754
- Publication date May 5, 2022
- Disco Corporation
- Senichi RYO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20220084886
- Publication date Mar 17, 2022
- Disco Corporation
- Minoru Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonding Apparatus, Cleaning Head and Manufacturing Method for S...
- Publication number 20220055077
- Publication date Feb 24, 2022
- Fasford Technology Co., Ltd.
- Itsuki IKARASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPOSING PROTECTIVE COVER FILM AND UNDERFILL LAYER OVER SINGULATED...
- Publication number 20210272846
- Publication date Sep 2, 2021
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED TRANSFER AND DRYING TOOL FOR PROCESS CHAMBER
- Publication number 20210242085
- Publication date Aug 5, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Sheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Post Etch Defluorination Process
- Publication number 20210111017
- Publication date Apr 15, 2021
- Mattson Technology, Inc.
- Vijay Vaniapura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSED STACKED DIES
- Publication number 20210104487
- Publication date Apr 8, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Cyprian Emeka UZOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CLEANING SYSTEMS AND RELATED METHODS
- Publication number 20200350208
- Publication date Nov 5, 2020
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WORKPIECE-SEPARATING DEVICE AND WORKPIECE-SEPARATING METHOD
- Publication number 20200312716
- Publication date Oct 1, 2020
- SHIN-ETSU ENGINEERING CO., LTD
- Yoshikazu OHTANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
AUTOMATED TRANSFER AND DRYING TOOL FOR PROCESS CHAMBER
- Publication number 20200243393
- Publication date Jul 30, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Tsung-Sheng Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE FILM AGENT FOR LASER DICING
- Publication number 20200234994
- Publication date Jul 23, 2020
- Disco Corporation
- Senichi RYO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SAW ASSISTED FACET ETCH DICING
- Publication number 20200209476
- Publication date Jul 2, 2020
- GenXComm, Inc.
- Brian Mattis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD OF SEMICONDUCTOR CHIP AND BONDING APPARATUS OF SEMIC...
- Publication number 20200051953
- Publication date Feb 13, 2020
- Kabushiki Kaisha Toshiba
- Yoichiro KURITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Post Etch Defluorination Process
- Publication number 20190393027
- Publication date Dec 26, 2019
- Mattson Technology, Inc.
- Vijay Vaniapura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CLEANING SYSTEMS AND RELATED METHODS
- Publication number 20190363018
- Publication date Nov 28, 2019
- Semiconductor Components Industries, LLC
- Michael J. SEDDON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Edge Cut Debond Using a Temporary Filler Material With No Adhesive...
- Publication number 20190341378
- Publication date Nov 7, 2019
- Micron Technology, Inc.
- Chandra S. Tiwari
- H01 - BASIC ELECTRIC ELEMENTS

Cleaning after the substrates have been singulated

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Die cleaning systems and related methods

Methods, systems, and apparatus for tape-frame substrate cleaning a...

Disposing protective cover film and underfill layer over singulated...

Mask-integrated surface protective tape

Automated transfer and drying tool for process chamber

Processed stacked dies

Method of manufacturing protective film agent

Processing method of wafer

Temporary bonding scheme

Protective film agent for laser dicing

Ultrasonic cleaning system and method

Light-absorbing mask for hybrid laser scribing and plasma etch wafe...

Saw assisted facet etch dicing

Edge cut debond using a temporary filler material with no adhesive...

Cleaning method for cleaning frame unit

Mask-integrated surface protective tape

Bonding method of semiconductor chip and bonding apparatus of semic...

Automated transfer and drying tool for process chamber

Mask-integrated surface protective film

Method of dicing a semiconductor wafer using a protective film form...

Processed stacked dies

Post etch defluorination process

Bonding method of semiconductor chip and bonding apparatus of semic...

Workpiece-separating device and workpiece-separating method

Method for cutting element chip by laser scribing

Die tray with channels

System and method for monitoring treatment of microelectronic subst...

Device wafer processing method

Automated transfer and drying tool for process chamber

Method of manufacturing element chip

Patents Applicationslast 30 patents

DIE CLEANING SYSTEMS AND RELATED METHODS

METHODS, SYSTEMS, AND APPARATUS FOR TAPE-FRAME SUBSTRATE CLEANING A...

COATING COMPOSITION FOR WAFER PROTECTION AND METHOD OF MANUFACTURIN...

PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFE...

DEVICE WAFER PROCESSING METHOD

DEVICE WAFER PROCESSING METHOD AND PROCESSING APPARATUS

CHIP BONDING METHOD

WAFER PROCESSING METHOD

PROCESSED STACKED DIES

SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME

METHODS, SYSTEMS, AND APPARATUS FOR TAPE-FRAME SUBSTRATE CLEANING A...

HYBRID BOND METHOD FOR FIXING DIES

WAFER CLEANING APPARATUS AND METHOD OF CONTROLLING THE SAME

WAFER CLEANING APPARATUS

PROTECTIVE FILM AGENT FOR LASER DICING

WAFER PROCESSING METHOD

Die Bonding Apparatus, Cleaning Head and Manufacturing Method for S...

DISPOSING PROTECTIVE COVER FILM AND UNDERFILL LAYER OVER SINGULATED...

AUTOMATED TRANSFER AND DRYING TOOL FOR PROCESS CHAMBER

Post Etch Defluorination Process

PROCESSED STACKED DIES

DIE CLEANING SYSTEMS AND RELATED METHODS

WORKPIECE-SEPARATING DEVICE AND WORKPIECE-SEPARATING METHOD

AUTOMATED TRANSFER AND DRYING TOOL FOR PROCESS CHAMBER

PROTECTIVE FILM AGENT FOR LASER DICING

SAW ASSISTED FACET ETCH DICING

BONDING METHOD OF SEMICONDUCTOR CHIP AND BONDING APPARATUS OF SEMIC...

Post Etch Defluorination Process

DIE CLEANING SYSTEMS AND RELATED METHODS

Edge Cut Debond Using a Temporary Filler Material With No Adhesive...