Cleaning of wafer backside

Industry

CPC
H01L21/0209

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/0209Cleaning of wafer backside

Industries

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 12,230,515
- Issue date Feb 18, 2025
- Tokyo Electron Limited
- Nobuhiko Mouri
- B08 - CLEANING
Information Patent Grant
Apparatus and method of brush cleaning using periodic chemical trea...
- Patent number 12,224,186
- Issue date Feb 11, 2025
- Applied Materials, Inc.
- Brian J. Brown
- B08 - CLEANING
Information Patent Grant
Metal-compound-removing solvent and method in lithography
- Patent number 12,210,286
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- An-Ren Zi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of wafer thinning
- Patent number 12,154,783
- Issue date Nov 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer cleaning method
- Patent number 12,087,602
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Shu Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing system
- Patent number 12,051,571
- Issue date Jul 30, 2024
- Tokyo Electron Limited
- Kazuya Ichiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate cleaning device and substrate cleaning method
- Patent number 12,002,688
- Issue date Jun 4, 2024
- Ebara Corporation
- Haiyang Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of coating a semiconductor wafer wi...
- Patent number 11,994,801
- Issue date May 28, 2024
- STATS ChipPAC Pte. Ltd.
- Giwoong Nam
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Substrate cleaning device and substrate cleaning method
- Patent number 11,996,303
- Issue date May 28, 2024
- Ebara Corporation
- Haiyang Xu
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for treating substrate
- Patent number 11,972,939
- Issue date Apr 30, 2024
- Semes Co., Ltd.
- Ohyeol Kwon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate processing apparatus, substrate processing method, and st...
- Patent number 11,967,509
- Issue date Apr 23, 2024
- Tokyo Electron Limited
- Osamu Miyahara
- B08 - CLEANING
Information Patent Grant
Laminate of aluminum nitride single-crystal substrate
- Patent number 11,952,677
- Issue date Apr 9, 2024
- Tokuyama Corporation
- Masao Ariyuki
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor fabricating system having hybrid brush assembly
- Patent number 11,908,681
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsuan-Ying Mai
- B08 - CLEANING
Information Patent Grant
Polishing apparatus
- Patent number 11,865,665
- Issue date Jan 9, 2024
- Ebara Corporation
- Kenichi Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus and system for treating substrate
- Patent number 11,869,763
- Issue date Jan 9, 2024
- Semes Co., Ltd.
- Jun Keon Ahn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Subnanometer-level light-based substrate cleaning mechanism
- Patent number 11,830,726
- Issue date Nov 28, 2023
- Planar Semiconductor Corporation Pte. Ltd.
- Rubinder S. Randhawa
- B08 - CLEANING
Information Patent Grant
Substrate cleaning method and substrate cleaning apparatus
- Patent number 11,817,311
- Issue date Nov 14, 2023
- Ebara Corporation
- Tomoatsu Ishibashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate cleaning equipment, substrate treatment system including...
- Patent number 11,791,173
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Seung Hoon Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing device
- Patent number 11,764,055
- Issue date Sep 19, 2023
- SCREEN Holdings Co., Ltd.
- Nobuyuki Shibayama
- B08 - CLEANING
Information Patent Grant
Treating a silicon on insulator wafer in preparation for manufactur...
- Patent number 11,749,558
- Issue date Sep 5, 2023
- QUANTUM SILICON INC.
- Bruno Vieira Da Cunha Martins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry cleaning apparatus and dry cleaning method
- Patent number 11,742,221
- Issue date Aug 29, 2023
- Samsung Electronics Co., Ltd.
- Seung-Min Shin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer cleaning system and method
- Patent number 11,742,227
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Shu Tseng
- B08 - CLEANING
Information Patent Grant
Brush cleaning apparatus, chemical-mechanical polishing (CMP) syste...
- Patent number 11,694,909
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid material post-CMP brushes and methods for forming the same
- Patent number 11,684,144
- Issue date Jun 27, 2023
- Illinois Tool Works Inc.
- Bradley Scott Withers
- B08 - CLEANING
Information Patent Grant
Metal-compound-removing solvent and method in lithography
- Patent number 11,681,226
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- An-Ren Zi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate cleaning device, substrate processing apparatus, substrat...
- Patent number 11,676,811
- Issue date Jun 13, 2023
- SCREEN Holdings Co., Ltd.
- Koji Nishiyama
- B08 - CLEANING
Information Patent Grant
Device and method for cleaning a printing device
- Patent number 11,575,064
- Issue date Feb 7, 2023
- Applied Materials Italia S.R.L.
- Davide Colla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a display apparatus
- Patent number 11,569,087
- Issue date Jan 31, 2023
- Samsung Display Co., Ltd.
- Horyun Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Substrate support with edge seal
- Patent number 11,508,610
- Issue date Nov 22, 2022
- Applied Materials, Inc.
- Chang Ke
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Optimal exposure of a bottom surface of a substrate material and/or...
- Patent number 11,495,451
- Issue date Nov 8, 2022
- Thanh Truong
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING
- Publication number 20250062114
- Publication date Feb 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. SEDDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250050462
- Publication date Feb 13, 2025
- EBARA CORPORATION
- Makoto KASHIWAGI
- B24 - GRINDING POLISHING
Information Patent Application
WAFER BACKSIDE CLEANING METHOD
- Publication number 20250046598
- Publication date Feb 6, 2025
- ACM RESEARCH (SHANGHAI), INC.
- Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD AND PROCESSING SYSTEM
- Publication number 20240404852
- Publication date Dec 5, 2024
- TOKYO ELECTRON LIMITED
- Yohei YAMASHITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR CLEANING A SEMICONDUCTOR FABRICATION CHAMBER
- Publication number 20240379345
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Jeongmin Hwang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER CLEANING SYSTEM
- Publication number 20240371667
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Shu TSENG
- B08 - CLEANING
Information Patent Application
APPARATUS AND METHOD OF BRUSH CLEANING USING PERIODIC CHEMICAL TREA...
- Publication number 20240332037
- Publication date Oct 3, 2024
- Applied Materials, Inc.
- Brian J. BROWN
- B08 - CLEANING
Information Patent Application
SINGLE WAFER-TYPE WAFER CLEANING DEVICE AND METHOD FOR CONTROLLING...
- Publication number 20240304469
- Publication date Sep 12, 2024
- SK SILTRON CO., LTD.
- Gun Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Coating a Semiconductor Wafer wi...
- Publication number 20240272555
- Publication date Aug 15, 2024
- STATS ChipPAC Pte Ltd.
- Giwoong Nam
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PURGE SYSTEM TO CLEAN WAFER BACKSIDE FOR RING SUSCEPTOR
- Publication number 20240258097
- Publication date Aug 1, 2024
- Applied Materials, Inc.
- Aniketnitin PATIL
- B08 - CLEANING
Information Patent Application
SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUS
- Publication number 20240258098
- Publication date Aug 1, 2024
- SCREEN Holdings Co., Ltd.
- Wataru YANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER CLEANING DEVICE, SEMICONDUCTOR WAFER CLEANING M...
- Publication number 20240258126
- Publication date Aug 1, 2024
- SUMCO CORPORATION
- Kaito NODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FABRICATING SYSTEM HAVING HYBRID BRUSH ASSEMBLY
- Publication number 20240177988
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsuan-Ying MAI
- B08 - CLEANING
Information Patent Application
Laminates for Cleaning Substrate Surfaces and Methods of Use Thereof
- Publication number 20240110084
- Publication date Apr 4, 2024
- 3M Innovative Properties Company
- Uma Rames Krishna Lagudu
- B08 - CLEANING
Information Patent Application
BRUSHES, SYSTEMS, AND METHODS FOR DISPENSING MULTIPLE FLUIDS DURING...
- Publication number 20240112925
- Publication date Apr 4, 2024
- Illinois Tool Works Inc.
- Bradley Scott Withers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO-LEAD INTEGRATED CIRCUIT HAVING AN ABLATED MOLD COMPOUND AND EXTR...
- Publication number 20240105557
- Publication date Mar 28, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Laura May Antoinette Clemente
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING APPARATUS
- Publication number 20240091899
- Publication date Mar 21, 2024
- EBARA CORPORATION
- Kenichi KOBAYASHI
- B24 - GRINDING POLISHING
Information Patent Application
METHODS OF SEPARATING SEMICONDUCTOR DIES
- Publication number 20240071828
- Publication date Feb 29, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Michael Todd Wyant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL WAFER CLEANING METHOD
- Publication number 20230411143
- Publication date Dec 21, 2023
- Shin-Etsu Handotai Co., Ltd.
- Norimichi TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFECT REMOVAL DEVICE, DEFECT REMOVAL METHOD, PATTERN FORMING METHO...
- Publication number 20230395366
- Publication date Dec 7, 2023
- FUJIFILM CORPORATION
- Akihiko OHTSU
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MANUFACTURING WAFER HAVING FUNCTIONAL FILM
- Publication number 20230369037
- Publication date Nov 16, 2023
- NISSAN CHEMICAL CORPORATION
- Tomoya OHASHI
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
WAFER CLEANING METHOD
- Publication number 20230360938
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Shu TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CLEANING DEVICE AND SUBSTRATE CLEANING METHOD
- Publication number 20230326770
- Publication date Oct 12, 2023
- EBARA CORPORATION
- Haiyang Xu
- B08 - CLEANING
Information Patent Application
Metal-Compound-Removing Solvent And Method In Lithography
- Publication number 20230324806
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- An-Ren Zi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CLEANING DEVICE AND SUBSTRATE CLEANING METHOD
- Publication number 20230307259
- Publication date Sep 28, 2023
- EBARA CORPORATION
- Haiyang Xu
- B08 - CLEANING
Information Patent Application
SUBSTRATE CLEANING METHOD AND SUBSTRATE PROCESSING METHOD
- Publication number 20230268174
- Publication date Aug 24, 2023
- SCREEN Holdings Co., Ltd.
- Koji NISHIYAMA
- B08 - CLEANING
Information Patent Application
Semiconductor Device and Method of Coating a Semiconductor Wafer wi...
- Publication number 20220365436
- Publication date Nov 17, 2022
- STATS ChipPAC Pte Ltd.
- Giwoong Nam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FABRICATING SYSTEM HAVIND HYBRID BURSH ASSEMBLY
- Publication number 20220351957
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsuan-Ying MAI
- B08 - CLEANING
Information Patent Application
MACHINE LEARNING DEVICE, SUBSTRATE PROCESSING DEVICE, TRAINED MODEL...
- Publication number 20220344164
- Publication date Oct 27, 2022
- EBARA CORPORATION
- Akira NAKAMURA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Treatment Liquid for Semiconductor Wafers, Which Contains Hypochlor...
- Publication number 20220325205
- Publication date Oct 13, 2022
- Tokuyama Corporation
- Takafumi Shimoda
- H01 - BASIC ELECTRIC ELEMENTS

Cleaning of wafer backside

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate processing apparatus and substrate processing method

Apparatus and method of brush cleaning using periodic chemical trea...

Metal-compound-removing solvent and method in lithography

Semiconductor wafer and method of wafer thinning

Wafer cleaning method

Substrate processing method and substrate processing system

Substrate cleaning device and substrate cleaning method

Semiconductor device and method of coating a semiconductor wafer wi...

Substrate cleaning device and substrate cleaning method

Method and apparatus for treating substrate

Substrate processing apparatus, substrate processing method, and st...

Laminate of aluminum nitride single-crystal substrate

Semiconductor fabricating system having hybrid brush assembly

Polishing apparatus

Apparatus and system for treating substrate

Subnanometer-level light-based substrate cleaning mechanism

Substrate cleaning method and substrate cleaning apparatus

Substrate cleaning equipment, substrate treatment system including...

Substrate processing method and substrate processing device

Treating a silicon on insulator wafer in preparation for manufactur...

Dry cleaning apparatus and dry cleaning method

Wafer cleaning system and method

Brush cleaning apparatus, chemical-mechanical polishing (CMP) syste...

Hybrid material post-CMP brushes and methods for forming the same

Metal-compound-removing solvent and method in lithography

Substrate cleaning device, substrate processing apparatus, substrat...

Device and method for cleaning a printing device

Method of fabricating a display apparatus

Substrate support with edge seal

Optimal exposure of a bottom surface of a substrate material and/or...

Patents Applicationslast 30 patents

SEMICONDUCTOR WAFER AND METHOD OF WAFER THINNING

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

WAFER BACKSIDE CLEANING METHOD

PROCESSING METHOD AND PROCESSING SYSTEM

APPARATUS FOR CLEANING A SEMICONDUCTOR FABRICATION CHAMBER

WAFER CLEANING SYSTEM

APPARATUS AND METHOD OF BRUSH CLEANING USING PERIODIC CHEMICAL TREA...

SINGLE WAFER-TYPE WAFER CLEANING DEVICE AND METHOD FOR CONTROLLING...

Semiconductor Device and Method of Coating a Semiconductor Wafer wi...

PURGE SYSTEM TO CLEAN WAFER BACKSIDE FOR RING SUSCEPTOR

SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUS

SEMICONDUCTOR WAFER CLEANING DEVICE, SEMICONDUCTOR WAFER CLEANING M...

SEMICONDUCTOR FABRICATING SYSTEM HAVING HYBRID BRUSH ASSEMBLY

Laminates for Cleaning Substrate Surfaces and Methods of Use Thereof

BRUSHES, SYSTEMS, AND METHODS FOR DISPENSING MULTIPLE FLUIDS DURING...

NO-LEAD INTEGRATED CIRCUIT HAVING AN ABLATED MOLD COMPOUND AND EXTR...

POLISHING APPARATUS

METHODS OF SEPARATING SEMICONDUCTOR DIES

EPITAXIAL WAFER CLEANING METHOD

DEFECT REMOVAL DEVICE, DEFECT REMOVAL METHOD, PATTERN FORMING METHO...

METHOD FOR MANUFACTURING WAFER HAVING FUNCTIONAL FILM

WAFER CLEANING METHOD

SUBSTRATE CLEANING DEVICE AND SUBSTRATE CLEANING METHOD

Metal-Compound-Removing Solvent And Method In Lithography

SUBSTRATE CLEANING DEVICE AND SUBSTRATE CLEANING METHOD

SUBSTRATE CLEANING METHOD AND SUBSTRATE PROCESSING METHOD

Semiconductor Device and Method of Coating a Semiconductor Wafer wi...

SEMICONDUCTOR FABRICATING SYSTEM HAVIND HYBRID BURSH ASSEMBLY

MACHINE LEARNING DEVICE, SUBSTRATE PROCESSING DEVICE, TRAINED MODEL...

Treatment Liquid for Semiconductor Wafers, Which Contains Hypochlor...