Cleaning the bonding area

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H01L2224/81022

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/81022Cleaning the bonding area

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for assembling components implementing a pre-treatment of th...
- Patent number 11,855,038
- Issue date Dec 26, 2023
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Olivier Castany
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,848,346
- Issue date Dec 19, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device and electronic device...
- Patent number 11,594,512
- Issue date Feb 28, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Hwan Kyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,476,229
- Issue date Oct 18, 2022
- Kioxia Corporation
- Chikara Miyazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,152,295
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Hao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic device and electronic device...
- Patent number 10,943,884
- Issue date Mar 9, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Hwan Kyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,930,695
- Issue date Feb 23, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Satoru Wakiyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting Method of a semiconductor device using a colored auxiliary...
- Patent number 10,786,876
- Issue date Sep 29, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing an electronic device and electronic device...
- Patent number 10,600,755
- Issue date Mar 24, 2020
- Amkor Technology, Inc.
- Hwan Kyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Jig for bonding a semiconductor chip, apparatus for bonding a semic...
- Patent number 10,410,990
- Issue date Sep 10, 2019
- Samsung Electronics Co., Ltd.
- Man-Hee Han
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing semiconductor chip
- Patent number 10,354,973
- Issue date Jul 16, 2019
- TDK Corporation
- Makoto Orikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rework process and tool design for semiconductor package
- Patent number 10,269,762
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih Ting Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for bonding a chip to a wafer
- Patent number 10,249,593
- Issue date Apr 2, 2019
- Agency for Science, Technology and Research
- Sunil Wickramanayaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor package
- Patent number 10,163,847
- Issue date Dec 25, 2018
- TDK Corporation
- Makoto Orikasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and semiconductor device
- Patent number 10,109,580
- Issue date Oct 23, 2018
- Shinko Electric Industries Co., Ltd.
- Shunichiro Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-strike process for bonding packages and the packages thereof
- Patent number 10,068,868
- Issue date Sep 4, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die bonding with liquid phase solder
- Patent number 10,014,272
- Issue date Jul 3, 2018
- ASM Technology Singapore Pte. Ltd.
- Dewen Tian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide and semiconductor packaging
- Patent number 9,960,204
- Issue date May 1, 2018
- Northrop Grumman Systems Corporation
- Chunbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 9,905,529
- Issue date Feb 27, 2018
- Renesas Electronics Corporation
- Kenji Sakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging structures
- Patent number 9,698,113
- Issue date Jul 4, 2017
- Semiconductor Manufacturing International (Shanghai) Corporation
- Qifeng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced volume interconnect for three-dimensional chip stack
- Patent number 9,679,875
- Issue date Jun 13, 2017
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-strike process for bonding
- Patent number 9,576,929
- Issue date Feb 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Liang Shao
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 9,536,818
- Issue date Jan 3, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide and semiconductor packaging
- Patent number 9,478,458
- Issue date Oct 25, 2016
- Northrop Grumman Systems Corporation
- Chunbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode body, wiring substrate, and semiconductor device
- Patent number 9,425,135
- Issue date Aug 23, 2016
- Olympus Corporation
- Chihiro Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intermetallic compound layer on a pillar between a chip and substrate
- Patent number 9,293,433
- Issue date Mar 22, 2016
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Machida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making bumpless flipchip interco...
- Patent number 9,240,331
- Issue date Jan 19, 2016
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Al bond pad clean method
- Patent number 9,082,828
- Issue date Jul 14, 2015
- Applied Materials, Inc.
- Mei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and substrate bonding method
- Patent number 8,916,449
- Issue date Dec 23, 2014
- Asia Pacific Microsystems, Inc.
- Hung-Lin Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming vertically offset conduc...
- Patent number 8,896,133
- Issue date Nov 25, 2014
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POST-PLASMA CLEAN INFRARED IMAGE INSPECTION FOR OXIDELESS BONDING A...
- Publication number 20250006690
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Amram Eitan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...
- Publication number 20240404988
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...
- Publication number 20240404989
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Wafer Oxide Removal and Reflow Treatment
- Publication number 20240282734
- Publication date Aug 22, 2024
- Air Products and Chemicals, Inc.
- Liang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION PAD WITH ENHANCED SOLDERABILITY AND CORRESPON...
- Publication number 20220369455
- Publication date Nov 17, 2022
- TECHNISCHE HOCHSCHULE ASCHAFFENBURG
- Stefan Rung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ASSEMBLING COMPONENTS IMPLEMENTING A PRE-TREATMENT OF TH...
- Publication number 20220173069
- Publication date Jun 2, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Olivier CASTANY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210225921
- Publication date Jul 22, 2021
- Sony Semiconductor Solutions Corporation
- Satoru WAKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...
- Publication number 20210225802
- Publication date Jul 22, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Hwan Kyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20200294960
- Publication date Sep 17, 2020
- Toshiba Memory Corporation
- Chikara MIYAZAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...
- Publication number 20200227378
- Publication date Jul 16, 2020
- Amkor Technology, Inc.
- Hwan Kyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190318987
- Publication date Oct 17, 2019
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-HAO LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Jig for Bonding a Semiconductor Chip, Apparatus for Bonding a Semic...
- Publication number 20190103376
- Publication date Apr 4, 2019
- Samsung Electronics Co., Ltd.
- Man-Hee Han
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...
- Publication number 20190051629
- Publication date Feb 14, 2019
- Amkor Technology, Inc.
- Hwan Kyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR CHIP
- Publication number 20190013293
- Publication date Jan 10, 2019
- TDK Corporation
- Makoto ORIKASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
- Publication number 20180254255
- Publication date Sep 6, 2018
- TDK Corporation
- Makoto ORIKASA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME
- Publication number 20180236613
- Publication date Aug 23, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- Teppei Kojio
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
A METHOD FOR BONDING A CHIP TO A WAFER
- Publication number 20170084570
- Publication date Mar 23, 2017
- Agency for Science, Technology and Research
- Sunil Wickramanayaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160260680
- Publication date Sep 8, 2016
- RENESAS ELECTRONICS CORPORATION
- Kenji SAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVEGUIDE AND SEMICONDUCTOR PACKAGING
- Publication number 20140254979
- Publication date Sep 11, 2014
- Northrop Grumman Systems Corporation
- Chunbo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making Bumpless Flipchip Interco...
- Publication number 20140175661
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- KyungMoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AL BOND PAD CLEAN METHOD
- Publication number 20140113445
- Publication date Apr 24, 2014
- Applied Materials, Inc.
- Mei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Substrate Bonding Method
- Publication number 20130285248
- Publication date Oct 31, 2013
- ASIA PACIFIC MICROSYSTEMS, INC.
- Hung-Lin Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRODE BODY, WIRING SUBSTRATE, AND SEMICONDUCTOR DEVICE
- Publication number 20130256880
- Publication date Oct 3, 2013
- OLYMPUS CORPORATION
- Chihiro Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Vertically Offset Conduc...
- Publication number 20130234324
- Publication date Sep 12, 2013
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20130093076
- Publication date Apr 18, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTING METHOD
- Publication number 20120329182
- Publication date Dec 27, 2012
- Teppei Kojio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION LAYER FOR SEMICONDUCTOR DEVICE PACKAGING
- Publication number 20120208321
- Publication date Aug 16, 2012
- Nordson Corporation
- David Keating Foote
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Vertically Offset Conduc...
- Publication number 20120043672
- Publication date Feb 23, 2012
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Preventing UBM Oxidation in Bump Formation Processes
- Publication number 20110092064
- Publication date Apr 21, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080251914
- Publication date Oct 16, 2008
- Shinichi Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS

Cleaning the bonding area

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for assembling components implementing a pre-treatment of th...

Semiconductor device and method of manufacturing the same

Method of manufacturing an electronic device and electronic device...

Semiconductor device manufacturing method

Semiconductor package structure and method for manufacturing the same

Method of manufacturing an electronic device and electronic device...

Semiconductor device and method of manufacturing the same

Mounting Method of a semiconductor device using a colored auxiliary...

Method of manufacturing an electronic device and electronic device...

Jig for bonding a semiconductor chip, apparatus for bonding a semic...

Method for producing semiconductor chip

Rework process and tool design for semiconductor package

Method for bonding a chip to a wafer

Method for producing semiconductor package

Wiring board and semiconductor device

Multi-strike process for bonding packages and the packages thereof

Die bonding with liquid phase solder

Waveguide and semiconductor packaging

Method for manufacturing semiconductor device

Chip packaging structures

Reduced volume interconnect for three-dimensional chip stack

Multi-strike process for bonding

Semiconductor package and method of forming the same

Waveguide and semiconductor packaging

Electrode body, wiring substrate, and semiconductor device

Intermetallic compound layer on a pillar between a chip and substrate

Semiconductor device and method of making bumpless flipchip interco...

Al bond pad clean method

Package structure and substrate bonding method

Semiconductor device and method of forming vertically offset conduc...

Patents Applicationslast 30 patents

POST-PLASMA CLEAN INFRARED IMAGE INSPECTION FOR OXIDELESS BONDING A...

FLUXLESS DIE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS F...

PARALLEL PLASMA TREATMENT AND THERMOCOMPRESSION BONDING AND APPARAT...

Apparatus and Method for Wafer Oxide Removal and Reflow Treatment

ELECTRICAL CONNECTION PAD WITH ENHANCED SOLDERABILITY AND CORRESPON...

METHOD FOR ASSEMBLING COMPONENTS IMPLEMENTING A PRE-TREATMENT OF TH...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Jig for Bonding a Semiconductor Chip, Apparatus for Bonding a Semic...

METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE...

METHOD FOR PRODUCING SEMICONDUCTOR CHIP

METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE

AUXILIARY JOINING AGENT AND METHOD FOR PRODUCING THE SAME

A METHOD FOR BONDING A CHIP TO A WAFER

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

WAVEGUIDE AND SEMICONDUCTOR PACKAGING

Semiconductor Device and Method of Making Bumpless Flipchip Interco...

AL BOND PAD CLEAN METHOD

Package Structure and Substrate Bonding Method

ELECTRODE BODY, WIRING SUBSTRATE, AND SEMICONDUCTOR DEVICE

Semiconductor Device and Method of Forming Vertically Offset Conduc...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE MOUNTING METHOD

PASSIVATION LAYER FOR SEMICONDUCTOR DEVICE PACKAGING

Semiconductor Device and Method of Forming Vertically Offset Conduc...

Preventing UBM Oxidation in Bump Formation Processes

SEMICONDUCTOR DEVICE