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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,233,023
- Issue date Jan 25, 2022
- Kabushiki Kaisha Toshiba
- Hiroaki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging
- Patent number 11,227,852
- Issue date Jan 18, 2022
- Texas Instruments Incorporated
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ion-ion plasma atomic layer etch process
- Patent number 11,101,113
- Issue date Aug 24, 2021
- Applied Materials, Inc.
- Kenneth S. Collins
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 11,024,599
- Issue date Jun 1, 2021
- Renesas Electronics Corporation
- Ryo Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct selective adhesion promotor plating
- Patent number 11,024,565
- Issue date Jun 1, 2021
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,727,146
- Issue date Jul 28, 2020
- Toyota Jidosha Kabushiki Kaisha
- Naoya Take
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection from ESD during the manufacturing process of semiconduct...
- Patent number 10,672,689
- Issue date Jun 2, 2020
- STMicroelectronics, Inc.
- Frederick Ray Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging
- Patent number 10,629,562
- Issue date Apr 21, 2020
- Texas Instruments Incorporated
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection from ESD during the manufacturing process of semiconduct...
- Patent number 10,388,594
- Issue date Aug 20, 2019
- STMicroelectronics, Inc.
- Frederick Ray Gomez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,381,318
- Issue date Aug 13, 2019
- Renesas Electronics Corporation
- Yuki Yagyu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed impedance leads for die packages and method of making the same
- Patent number 10,340,209
- Issue date Jul 2, 2019
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,304,767
- Issue date May 28, 2019
- Renesas Electronics Corporation
- Tatsuya Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct selective adhesion promotor plating
- Patent number 10,297,536
- Issue date May 21, 2019
- Infineon Technologies AG
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Repackaged integrated circuit assembly method
- Patent number 10,177,056
- Issue date Jan 8, 2019
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Repackaged integrated circuit and assembly method
- Patent number 9,870,968
- Issue date Jan 16, 2018
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball bonding metal wire bond wires to metal pads
- Patent number 9,761,554
- Issue date Sep 12, 2017
- Invensas Corporation
- Willmar Subido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device with reflective resin
- Patent number 9,537,065
- Issue date Jan 3, 2017
- Sharp Kabushiki Kaisha
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating wire bonding structure
- Patent number 9,289,846
- Issue date Mar 22, 2016
- Siliconware Precision Industries Co., Ltd.
- Wei-Sheng Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor arrangement, semiconductor module, and method for con...
- Patent number 9,196,562
- Issue date Nov 24, 2015
- Infineon Technologies AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 9,159,656
- Issue date Oct 13, 2015
- Fairchild Semiconductor Corporation
- Oseob Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Reduction of fluorine contamination of bond pads of semiconductor d...
- Patent number 9,059,110
- Issue date Jun 16, 2015
- X-Fab Semiconductor Foundries AG.
- Hyung Sun Yook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for treating a bond pad of a package substrate
- Patent number 9,012,263
- Issue date Apr 21, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of light-emitting device
- Patent number 8,987,021
- Issue date Mar 24, 2015
- Toyoda Gosei Co., Ltd.
- Mineo Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip stacking method to reduce voids between stacked chips
- Patent number 8,815,645
- Issue date Aug 26, 2014
- Walton Advanced Engineering, Inc.
- Kuo-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ambient temperature ball bond
- Patent number 8,767,351
- Issue date Jul 1, 2014
- Seagate Technology LLC
- Leping Li
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor die package and method for making the same
- Patent number 8,664,752
- Issue date Mar 4, 2014
- Fairchild Semiconductor Corporation
- Oseob Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of making chip-on-lead package
- Patent number 8,642,395
- Issue date Feb 4, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Zhe Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for inhibiting corrosion and removing contaminant from a su...
- Patent number 8,580,656
- Issue date Nov 12, 2013
- Air Products and Chemicals, Inc.
- Terence Quintin Collier
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Large panel leadframe
- Patent number 8,535,988
- Issue date Sep 17, 2013
- Carsem (M) Sdn. Bhd.
- Yong Lam Wai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Thin semiconductor package and method for manufacturing same
- Patent number 8,354,739
- Issue date Jan 15, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Yeqing Su
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING DAM STRUCTURE AND METHOD OF FABRICA...
- Publication number 20240395760
- Publication date Nov 28, 2024
- Samsung Electronics Co., LTD
- Daeyoung Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210091021
- Publication date Mar 25, 2021
- Kabushiki Kaisha Toshiba
- Hiroaki TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING
- Publication number 20200251440
- Publication date Aug 6, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Honglin GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20200185353
- Publication date Jun 11, 2020
- RENESAS ELECTRONICS CORPORATION
- Ryo Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION FROM ESD DURING THE MANUFACTURING PROCESS OF SEMICONDUCT...
- Publication number 20190326201
- Publication date Oct 24, 2019
- STMICROELECTRONICS, INC.
- Frederick Ray GOMEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct Selective Adhesion Promotor Plating
- Publication number 20190237396
- Publication date Aug 1, 2019
- Jochen Dangelmaier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING
- Publication number 20190206828
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Honglin GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180315691
- Publication date Nov 1, 2018
- RENESAS ELECTRONICS CORPORATION
- Tatsuya KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Producing Wire Bond Connection And Arrangement For Imple...
- Publication number 20180218996
- Publication date Aug 2, 2018
- F&K Delvotec Bondtechnik GmbH
- Franz Schlicht
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND REAGENT FOR TREATING BARE COPPER WIRE AND SURFACE-TREATE...
- Publication number 20180142358
- Publication date May 24, 2018
- Samsung Electronics Co., Ltd.
- Peng ZHANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Repackaged integrated circuit assembly method
- Publication number 20180005910
- Publication date Jan 4, 2018
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROTECTING BOND PADS FROM CORROSION
- Publication number 20170352639
- Publication date Dec 7, 2017
- KNOWLES ELECTRONICS, LLC
- Peter V. Loeppert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BALL BONDING METAL WIRE BOND WIRES TO METAL PADS
- Publication number 20160329294
- Publication date Nov 10, 2016
- Invensas Corporation
- Willmar SUBIDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Repackaged integrated circuit and assembly method
- Publication number 20160225686
- Publication date Aug 4, 2016
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TREATING A BOND PAD OF A PACKAGE SUBSTRATE
- Publication number 20150118791
- Publication date Apr 30, 2015
- Varughese Mathew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING APPARATUS
- Publication number 20140332583
- Publication date Nov 13, 2014
- SHINKAWA LTD.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING APPARATUS AND METHOD
- Publication number 20140263584
- Publication date Sep 18, 2014
- Jia Lin Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20140167238
- Publication date Jun 19, 2014
- Fairchild Semiconductor Corporation
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE
- Publication number 20140159076
- Publication date Jun 12, 2014
- Sharp Kabushiki Kaisha
- Yoshiki Sota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR CLEANING BOND WIRE
- Publication number 20140110461
- Publication date Apr 24, 2014
- Mohd Rusli Ibrahim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICES AND PROCESSING METHODS
- Publication number 20140110838
- Publication date Apr 24, 2014
- INFINEON TECHNOLOGIES AG
- Michael Rogalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF LIGHT-EMITTING DEVICE
- Publication number 20130330852
- Publication date Dec 12, 2013
- Mineo OKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LARGE PANEL LEADFRAME
- Publication number 20130109137
- Publication date May 2, 2013
- CARSEM (M) SDN. BHD.
- Yong Lam Wai
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR SENSOR DEVICE AND METHOD OF PACKAGING SAME
- Publication number 20120306031
- Publication date Dec 6, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- G01 - MEASURING TESTING
Information Patent Application
REDUCTION OF FLUORINE CONTAMINATION OF BOND PADS OF SEMICONDUCTOR D...
- Publication number 20120241914
- Publication date Sep 27, 2012
- X-FAB SEMICONDUCTOR FOUNDRIES AG.
- Hyung Sun Yook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20120181675
- Publication date Jul 19, 2012
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP STACKING METHOD TO REDUCE VOIDS BETWEEN STACKED CHIPS
- Publication number 20120115277
- Publication date May 10, 2012
- WALTON ADVANCED ENGINEERING INC.
- Kuo-Yuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING ON REACTIVE METAL SURFACES OF A METALLIZATION OF A SEM...
- Publication number 20120009780
- Publication date Jan 12, 2012
- GLOBALFOUNDRIES Inc.
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Arrangement, Semiconductor Module, and Method for Con...
- Publication number 20110316160
- Publication date Dec 29, 2011
- INFINEON TECHNOLOGIES AG
- Dirk Siepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME
- Publication number 20110316130
- Publication date Dec 29, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Yeqing Su
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method of manufacturing semiconductor device

Integrated circuit packaging

Ion-ion plasma atomic layer etch process

Semiconductor device and method of manufacturing thereof

Direct selective adhesion promotor plating

Semiconductor device

Protection from ESD during the manufacturing process of semiconduct...

Integrated circuit packaging

Protection from ESD during the manufacturing process of semiconduct...

Method of manufacturing semiconductor device

Mixed impedance leads for die packages and method of making the same

Semiconductor device

Direct selective adhesion promotor plating

Repackaged integrated circuit assembly method

Repackaged integrated circuit and assembly method

Ball bonding metal wire bond wires to metal pads

Light-emitting device with reflective resin

Method for fabricating wire bonding structure

Semiconductor arrangement, semiconductor module, and method for con...

Semiconductor die package and method for making the same

Reduction of fluorine contamination of bond pads of semiconductor d...

Method for treating a bond pad of a package substrate

Manufacturing method of light-emitting device

Multi-chip stacking method to reduce voids between stacked chips

Ambient temperature ball bond

Semiconductor die package and method for making the same

Method of making chip-on-lead package

Process for inhibiting corrosion and removing contaminant from a su...

Large panel leadframe

Thin semiconductor package and method for manufacturing same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING DAM STRUCTURE AND METHOD OF FABRICA...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT PACKAGING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF

PROTECTION FROM ESD DURING THE MANUFACTURING PROCESS OF SEMICONDUCT...

Direct Selective Adhesion Promotor Plating

INTEGRATED CIRCUIT PACKAGING

SEMICONDUCTOR DEVICE

Method For Producing Wire Bond Connection And Arrangement For Imple...

METHOD AND REAGENT FOR TREATING BARE COPPER WIRE AND SURFACE-TREATE...

Repackaged integrated circuit assembly method

METHOD FOR PROTECTING BOND PADS FROM CORROSION

BALL BONDING METAL WIRE BOND WIRES TO METAL PADS

Repackaged integrated circuit and assembly method

METHOD FOR TREATING A BOND PAD OF A PACKAGE SUBSTRATE

WIRE BONDING APPARATUS

WIRE BONDING APPARATUS AND METHOD

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

LIGHT-EMITTING DEVICE

SYSTEM AND METHOD FOR CLEANING BOND WIRE

SEMICONDUCTOR DEVICES AND PROCESSING METHODS

MANUFACTURING METHOD OF LIGHT-EMITTING DEVICE

LARGE PANEL LEADFRAME

SEMICONDUCTOR SENSOR DEVICE AND METHOD OF PACKAGING SAME

REDUCTION OF FLUORINE CONTAMINATION OF BOND PADS OF SEMICONDUCTOR D...

SEMICONDUCTOR DIE PACKAGE AND METHOD FOR MAKING THE SAME

MULTI-CHIP STACKING METHOD TO REDUCE VOIDS BETWEEN STACKED CHIPS

WIRE BONDING ON REACTIVE METAL SURFACES OF A METALLIZATION OF A SEM...

Semiconductor Arrangement, Semiconductor Module, and Method for Con...

THIN SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME