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H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L21/00
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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H01L21/4864
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Patents Grants
last 30 patents
Information
Patent Grant
Package structure and fabrication methods
Patent number
11,887,934
Issue date
Jan 30, 2024
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for isolating a conductive via from a glass substrate
Patent number
11,798,816
Issue date
Oct 24, 2023
University of Central Florida Research Foundation, Inc.
Omar Saad Ahmed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,798,893
Issue date
Oct 24, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Yung-Chi Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for removing resist layer, and method of manufacturing semic...
Patent number
11,789,366
Issue date
Oct 17, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hung-Jui Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
Patent number
11,715,700
Issue date
Aug 1, 2023
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical devices and methods of manufacture
Patent number
11,621,230
Issue date
Apr 4, 2023
Faraday Semi, Inc.
Martin Standing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and fabrication methods
Patent number
11,521,935
Issue date
Dec 6, 2022
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package device
Patent number
11,488,899
Issue date
Nov 1, 2022
Innolux Corporation
Hsueh-Hsuan Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
Patent number
11,476,202
Issue date
Oct 18, 2022
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Prevention of bridging between solder joints
Patent number
11,456,269
Issue date
Sep 27, 2022
International Business Machines Corporation
Risa Miyazawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power amplifier systems with control interface and bias circuit
Patent number
11,451,199
Issue date
Sep 20, 2022
Skyworks Solutions, Inc.
David Steven Ripley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reconstituted substrate for radio frequency applications
Patent number
11,417,605
Issue date
Aug 16, 2022
Applied Materials, Inc.
Guan Huei See
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
Patent number
11,398,433
Issue date
Jul 26, 2022
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for removing resist layer, and method of manufacturing semic...
Patent number
11,378,886
Issue date
Jul 5, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Hung-Jui Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of fabricating the same
Patent number
11,348,876
Issue date
May 31, 2022
Samsung Electronics Co., Ltd.
Kyoung Lim Suk
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding with pre-deoxide process and apparatus for performing the same
Patent number
11,342,302
Issue date
May 24, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing inductor built-in substrate
Patent number
11,322,301
Issue date
May 3, 2022
Ibiden Co., Ltd.
Hiroaki Kodama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,289,426
Issue date
Mar 29, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Yung-Chi Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure, assembly structure and method for manufacturing...
Patent number
11,282,772
Issue date
Mar 22, 2022
Advanced Semiconductor Engineering, Inc.
Hsu-Nan Fang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reconstituted substrate structure and fabrication methods for heter...
Patent number
11,264,333
Issue date
Mar 1, 2022
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and fabrication methods
Patent number
11,264,331
Issue date
Mar 1, 2022
Applied Materials, Inc.
Han-Wen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Control of under-fill using a film during fabrication for a dual-si...
Patent number
11,244,835
Issue date
Feb 8, 2022
Skyworks Solutions, Inc.
Robert Francis Darveaux
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Galvanic corrosion protection for semiconductor packages
Patent number
11,217,534
Issue date
Jan 4, 2022
Intel Corporation
Cheng Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Control of under-fill using a dam on a packaging substrate for a du...
Patent number
11,201,066
Issue date
Dec 14, 2021
Skyworks Solutions, Inc.
Robert Francis Darveaux
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Module
Patent number
11,121,054
Issue date
Sep 14, 2021
Murata Manufacturing Co., Ltd.
Issei Yamamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Controlling of height of high-density interconnection structure on...
Patent number
11,114,308
Issue date
Sep 7, 2021
International Business Machines Corporation
Keishi Okamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical devices and methods of manufacture
Patent number
11,069,624
Issue date
Jul 20, 2021
Faraday Semi, Inc.
Martin Standing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Articles having vias with geometry attributes and methods for fabri...
Patent number
11,062,986
Issue date
Jul 13, 2021
Corning Incorporated
Tian Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Prevention of bridging between solder joints
Patent number
11,004,819
Issue date
May 11, 2021
International Business Machines Corporation
Risa Miyazawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for producing laminate and substrate for mounting a semicon...
Patent number
10,964,552
Issue date
Mar 30, 2021
Mitsubishi Gas Chemical Company, Inc.
Yoshihiro Kato
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
Publication number
20240138071
Publication date
Apr 25, 2024
IBIDEN CO., LTD.
Shogo FUKUI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL DEVICES AND METHODS OF MANUFACTURE
Publication number
20240055360
Publication date
Feb 15, 2024
FARADAY SEMI, INC.
Martin Standing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240038674
Publication date
Feb 1, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Chi Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
Publication number
20240021533
Publication date
Jan 18, 2024
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS
Publication number
20240006300
Publication date
Jan 4, 2024
Intel Corporation
Yi Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ASYMMETRICAL DIELECTRIC-TO-METAL ADHESION ARCHITECTURE FOR ELECTRON...
Publication number
20230420353
Publication date
Dec 28, 2023
Intel Corporation
Suddhasattwa Nad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CLEANED PACKAGING SUBSTRATE AND CLEANED PACKAGING SUBSTRATE MANUFAC...
Publication number
20230411172
Publication date
Dec 21, 2023
ABSOLICS INC.
Sungjin KIM
B08 - CLEANING
Information
Patent Application
METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...
Publication number
20230384684
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Hung-Jui Kuo
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Application
PACKAGE STRUCTURE AND FABRICATION METHODS
Publication number
20230187370
Publication date
Jun 15, 2023
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE DEVICE
Publication number
20230027220
Publication date
Jan 26, 2023
InnoLux Corporation
Hsueh-Hsuan Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER AMPLIFIER MODULES INCLUDING SEMICONDUCTOR RESISTOR AND TANTAL...
Publication number
20220393653
Publication date
Dec 8, 2022
Skyworks Solutions, Inc.
Peter J. Zampardi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECONSTITUTED SUBSTRATE FOR RADIO FREQUENCY APPLICATIONS
Publication number
20220359409
Publication date
Nov 10, 2022
Applied Materials, Inc.
Guan Huei SEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...
Publication number
20220299880
Publication date
Sep 22, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Hung-Jui Kuo
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Application
Bonding with Pre-Deoxide Process and Apparatus for Performing the Same
Publication number
20220285310
Publication date
Sep 8, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITION FOR REMOVING PHOTORESIST
Publication number
20220285172
Publication date
Sep 8, 2022
Mitsubishi Gas Chemical Company, Inc.
Yukihide NAITO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20220216159
Publication date
Jul 7, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Chi Chu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONTROL OF UNDER-FILL USING AN ENCAPSULANT AND A TRENCH OR DAM FOR...
Publication number
20220130686
Publication date
Apr 28, 2022
Skyworks Solutions, Inc.
Robert Francis DARVEAUX
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...
Publication number
20220100097
Publication date
Mar 31, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Hung-Jui Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL DEVICES AND METHODS OF MANUFACTURE
Publication number
20220068823
Publication date
Mar 3, 2022
FARADAY SEMI, INC.
Martin Standing
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR ISOLATING A CONDUCTIVE VIA FROM A GLASS SUBSTRATE
Publication number
20210407820
Publication date
Dec 30, 2021
University of Central Florida Research Foundation, Inc.
Omar Saad Ahmed
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONTROLLING OF HEIGHT OF HIGH-DENSITY INTERCONNECTION STRUCTURE ON...
Publication number
20210343545
Publication date
Nov 4, 2021
International Business Machines Corporation
Keishi Okamoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND FABRICATION METHODS
Publication number
20210257306
Publication date
Aug 19, 2021
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RECONSTITUTED SUBSTRATE STRUCTURE AND FABRICATION METHODS FOR HETER...
Publication number
20210257307
Publication date
Aug 19, 2021
Applied Materials, Inc.
Han-Wen CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PREVENTION OF BRIDGING BETWEEN SOLDER JOINTS
Publication number
20210210454
Publication date
Jul 8, 2021
International Business Machines Corporation
Risa Miyazawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER-LEVEL SIP MODULE STRUCTURE AND METHOD FOR PREPARING THE SAME
Publication number
20210202338
Publication date
Jul 1, 2021
SJ Semiconductor (Jiangyin) Corporation
Chengtar WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INDUCTOR BUILT-IN SUBSTRATE
Publication number
20210183562
Publication date
Jun 17, 2021
IBIDEN CO., LTD.
Satoru Kawai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INDUCTOR BUILT-IN SUBSTRATE AND METHOD FOR MANUFACTURING INDUCTOR B...
Publication number
20210159010
Publication date
May 27, 2021
IBIDEN CO., LTD.
Satoru KAWAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONTROL OF UNDER-FILL USING A FILM DURING FABRICATION FOR A DUAL-SI...
Publication number
20210143024
Publication date
May 13, 2021
Skyworks Solutions, Inc.
Robert Francis DARVEAUX
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE, ASSEMBLY STRUCTURE AND METHOD FOR MANUFACTURING...
Publication number
20210134711
Publication date
May 6, 2021
Advanced Semiconductor Engineering, Inc.
Hsu-Nan FANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20210111128
Publication date
Apr 15, 2021
Samsung Electronics Co., Ltd.
KYOUNG LIM SUK
H01 - BASIC ELECTRIC ELEMENTS