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H01L2224/1181

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/1181Cleaning

Industries

Patents Grantslast 30 patents

Information Patent Grant
Interconnect structure for semiconductor with ultra-fine pitch and...
- Patent number 11,742,316
- Issue date Aug 29, 2023
- GUANGDONG UNIVERSITY OF TECHNOLOGY
- Yu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,469,202
- Issue date Oct 11, 2022
- Samsung Electronics Co., Ltd.
- Seong-Min Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device and a cleaning compo...
- Patent number 11,380,537
- Issue date Jul 5, 2022
- Samsung Electronics Co., Ltd.
- Hoyoung Kim
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Method of forming vias using silicon on insulator substrate
- Patent number 11,257,744
- Issue date Feb 22, 2022
- Micron Technology, Inc.
- Toshiyuki Maenosono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of high aspect ratio solder bumping with stud bu...
- Patent number 11,181,704
- Issue date Nov 23, 2021
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 11,133,450
- Issue date Sep 28, 2021
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packaging with low-force thermocompression bonding of oxidizable...
- Patent number 11,134,598
- Issue date Sep 28, 2021
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 11,133,451
- Issue date Sep 28, 2021
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of high aspect ratio solder bumping with stud bu...
- Patent number 11,112,570
- Issue date Sep 7, 2021
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of forming same
- Patent number 11,043,463
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tool and method of reflow
- Patent number 11,000,923
- Issue date May 11, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Yen Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate device, electronic apparatus, and method for manufacturin...
- Patent number 10,892,241
- Issue date Jan 12, 2021
- Sony Corporation
- Shigekazu Ishii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanisms for forming hybrid bonding structures with elongated bumps
- Patent number 10,867,957
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-LED module and method for fabricating the same
- Patent number 10,847,504
- Issue date Nov 24, 2020
- LUMENS CO., LTD.
- Taekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flux, solder paste, and method for forming solder bump
- Patent number 10,836,000
- Issue date Nov 17, 2020
- Tamura Corporation
- Masanori Shibasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 10,840,199
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,833,032
- Issue date Nov 10, 2020
- Samsung Electronics Co., Ltd.
- Seong-Min Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hollow metal pillar packaging scheme
- Patent number 10,825,804
- Issue date Nov 3, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,734,567
- Issue date Aug 4, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing chip-on-chip structure comprising sinterted...
- Patent number 10,734,346
- Issue date Aug 4, 2020
- ELPIS TECHNOLOGIES INC.
- Richard S. Graf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bonded cryogenic chip carrier
- Patent number 10,727,391
- Issue date Jul 28, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of forming same
- Patent number 10,714,442
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expanded head pillar for bump bonds
- Patent number 10,636,758
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-component bump metallization
- Patent number 10,629,797
- Issue date Apr 21, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-component bump metallization
- Patent number 10,608,158
- Issue date Mar 31, 2020
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of high aspect ratio solder bumping with stud bu...
- Patent number 10,598,874
- Issue date Mar 24, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- G02 - OPTICS
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 10,515,915
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 10,497,853
- Issue date Dec 3, 2019
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 10,468,579
- Issue date Nov 5, 2019
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip mounted on a packaging substrate
- Patent number 10,418,340
- Issue date Sep 17, 2019
- Sony Corporation
- Makoto Murai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Apparatus and Method for Wafer Oxide Removal and Reflow Treatment
- Publication number 20240282734
- Publication date Aug 22, 2024
- Air Products and Chemicals, Inc.
- Liang Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PASTE, METHOD FOR FORMING SOLDER BUMPS, AND METHOD FOR PRODU...
- Publication number 20240105653
- Publication date Mar 28, 2024
- Resonac Corporation
- Yoshinori EJIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING CHEMICALLY COATED BUMP BONDS
- Publication number 20230123307
- Publication date Apr 20, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...
- Publication number 20230090693
- Publication date Mar 23, 2023
- Fasford Technology Co., Ltd.
- Geonju LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PILLAR, METHOD FOR MANUFACTURING THE SAME, AND METHOD FO...
- Publication number 20230041521
- Publication date Feb 9, 2023
- DIC CORPORATION
- Ryota Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR SEMICONDUCTOR WITH ULTRA-FINE PITCH AND...
- Publication number 20220415846
- Publication date Dec 29, 2022
- Guangdong University of Technology
- Yu ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRINTING SOLDER ONTO A WAFER AND SYSTEM THEREOF
- Publication number 20220216170
- Publication date Jul 7, 2022
- Inari Technology Sdn Bhd
- BOON SENG TEOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING M...
- Publication number 20210227735
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Gold Contacting Metal
- Publication number 20210227734
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Tin-Based Contacting Metal
- Publication number 20210227732
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Copper-Based Contacting M...
- Publication number 20210227733
- Publication date Jul 22, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding Using Metastable Gas Atoms
- Publication number 20210219474
- Publication date Jul 15, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermocompression Bonding with Passivated Nickel-Based Contacting M...
- Publication number 20210219475
- Publication date Jul 15, 2021
- SET NORTH AMERICA, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210005565
- Publication date Jan 7, 2021
- Samsung Electronics Co., Ltd.
- Seong-Min SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods of Forming Same
- Publication number 20200343209
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING BUMP BONDS
- Publication number 20200006620
- Publication date Jan 2, 2020
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING BUMP BONDS
- Publication number 20200006621
- Publication date Jan 2, 2020
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hollow Metal Pillar Packaging Scheme
- Publication number 20190341377
- Publication date Nov 7, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-LED MODULE AND METHOD FOR FABRICATING THE SAME
- Publication number 20190252360
- Publication date Aug 15, 2019
- LUMENS CO., LTD
- Taekyung Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING CONNECTOR PAD STRUCTURES, INTERCONNECT STRUCTURE...
- Publication number 20190244918
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods of Forming Same
- Publication number 20190244920
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A BUMP STRUCTURE AND METHOD FOR MANUFAC...
- Publication number 20190214357
- Publication date Jul 11, 2019
- Chipbond Technology Corporation
- Chun-Te Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A CLEANING COMPO...
- Publication number 20190198315
- Publication date Jun 27, 2019
- Samsung Electronics Co., Ltd.
- Hoyoung KIM
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...
- Publication number 20190131266
- Publication date May 2, 2019
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP BONDED CRYOGENIC CHIP CARRIER
- Publication number 20190131509
- Publication date May 2, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20190109108
- Publication date Apr 11, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP BONDED CRYOGENIC CHIP CARRIER
- Publication number 20190103541
- Publication date Apr 4, 2019
- International Business Machines Corporation
- David W. Abraham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for an Improved Interconnect Structure
- Publication number 20180374807
- Publication date Dec 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERCONDUCTING BUMP BONDS
- Publication number 20180366634
- Publication date Dec 20, 2018
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Interconnect structure for semiconductor with ultra-fine pitch and...

Semiconductor device

Method of manufacturing a semiconductor device and a cleaning compo...

Method of forming vias using silicon on insulator substrate

Fabrication method of high aspect ratio solder bumping with stud bu...

Superconducting bump bonds

3D packaging with low-force thermocompression bonding of oxidizable...

Superconducting bump bonds

Fabrication method of high aspect ratio solder bumping with stud bu...

Interconnect structures and methods of forming same

Tool and method of reflow

Substrate device, electronic apparatus, and method for manufacturin...

Mechanisms for forming hybrid bonding structures with elongated bumps

Micro-LED module and method for fabricating the same

Flux, solder paste, and method for forming solder bump

Methods of forming connector pad structures, interconnect structure...

Semiconductor device

Hollow metal pillar packaging scheme

Bump bonded cryogenic chip carrier

Method of manufacturing chip-on-chip structure comprising sinterted...

Bump bonded cryogenic chip carrier

Interconnect structures and methods of forming same

Expanded head pillar for bump bonds

Two-component bump metallization

Two-component bump metallization

Fabrication method of high aspect ratio solder bumping with stud bu...

Methods of forming connector pad structures, interconnect structure...

Superconducting bump bonds

Superconducting bump bonds

Semiconductor chip mounted on a packaging substrate

Patents Applicationslast 30 patents

Apparatus and Method for Wafer Oxide Removal and Reflow Treatment

SOLDER PASTE, METHOD FOR FORMING SOLDER BUMPS, AND METHOD FOR PRODU...

ELECTRONIC DEVICE HAVING CHEMICALLY COATED BUMP BONDS

DIPPING APPARATUS, DIE BONDING APPARATUS, AND MANUFACTURING METHOD...

CONDUCTIVE PILLAR, METHOD FOR MANUFACTURING THE SAME, AND METHOD FO...

INTERCONNECT STRUCTURE FOR SEMICONDUCTOR WITH ULTRA-FINE PITCH AND...

METHOD FOR PRINTING SOLDER ONTO A WAFER AND SYSTEM THEREOF

THERMOCOMPRESSION BONDING WITH PASSIVATED SILVER-BASED CONTACTING M...

Thermocompression Bonding with Passivated Gold Contacting Metal

Thermocompression Bonding with Passivated Tin-Based Contacting Metal

Thermocompression Bonding with Passivated Copper-Based Contacting M...

Thermocompression Bonding Using Metastable Gas Atoms

Thermocompression Bonding with Passivated Nickel-Based Contacting M...

SEMICONDUCTOR DEVICE

Interconnect Structures and Methods of Forming Same

EXPANDED HEAD PILLAR FOR BUMP BONDS

SUPERCONDUCTING BUMP BONDS

SUPERCONDUCTING BUMP BONDS

Hollow Metal Pillar Packaging Scheme

MICRO-LED MODULE AND METHOD FOR FABRICATING THE SAME

METHODS OF FORMING CONNECTOR PAD STRUCTURES, INTERCONNECT STRUCTURE...

Interconnect Structures and Methods of Forming Same

SEMICONDUCTOR DEVICE HAVING A BUMP STRUCTURE AND METHOD FOR MANUFAC...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A CLEANING COMPO...

FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...

BUMP BONDED CRYOGENIC CHIP CARRIER

EXPANDED HEAD PILLAR FOR BUMP BONDS

BUMP BONDED CRYOGENIC CHIP CARRIER

System and Method for an Improved Interconnect Structure

SUPERCONDUCTING BUMP BONDS