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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

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H05K7/1023co-operating by abutting
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    LOW PROFILE IMPEDANCE-TUNABLE AND CROSS-TALK CONTROLLED HIGH SPEED...
    • Publication number 20230307856
    • Publication date Sep 28, 2023
    • Intel Corporation
    • Emad S. AL-MOMANI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ID CHIP SOCKET FOR TEST CONNECTOR ASSEMBLY, TEST CONNECTOR ASSEMBL...
    • Publication number 20200150148
    • Publication date May 14, 2020
    • ISC CO., LTD.
    • Young Bae CHUNG
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    SOCKET
    • Publication number 20190064214
    • Publication date Feb 28, 2019
    • Sensata Technologies, Inc.
    • Hideyuki Takahashi
    • G01 - MEASURING TESTING
  • Information Patent Application

    ELECTRIC COMPONENT SOCKET
    • Publication number 20170373416
    • Publication date Dec 28, 2017
    • ENPLAS CORPORATION
    • Yuki UEYAMA
    • G01 - MEASURING TESTING
  • Information Patent Application

    HIGH-POWER ELECTRONIC MODULE AND METHOD FOR MAKING SUCH A MODULE
    • Publication number 20160073535
    • Publication date Mar 10, 2016
    • Schneider Electric Industries SAS
    • Cong Martin WU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SOCKET FOR ELECTRICAL COMPONENT
    • Publication number 20110159714
    • Publication date Jun 30, 2011
    • Hirohisa OHNO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Vertically Stackable Sockets for Chip Modules
    • Publication number 20110014802
    • Publication date Jan 20, 2011
    • Sony Ericsson Mobile Communications AB
    • Randolph Cary Demuynck
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGE SOCKET
    • Publication number 20100261370
    • Publication date Oct 14, 2010
    • Yamaichi Electronics Co., Ltd.
    • Eiichi Murakoshi
    • G01 - MEASURING TESTING
  • Information Patent Application

    ELECTRICAL CONNECTOR HAVING IMPROVED RESTRICTING PORTIONS
    • Publication number 20100248519
    • Publication date Sep 30, 2010
    • HON HAI Precision Industry CO., LTD.
    • WEI-CHIH LIN
    • G01 - MEASURING TESTING
  • Information Patent Application

    ELECTRICAL CONNECTOR HAVING DETACHABLE GUIDING MEMBER
    • Publication number 20100227490
    • Publication date Sep 9, 2010
    • HON HAI Precision Industry CO., LTD.
    • WEI-CHIH LIN
    • G01 - MEASURING TESTING
  • Information Patent Application

    CHIP MOUNT FOR DATA STORAGE DEVICE
    • Publication number 20100053925
    • Publication date Mar 4, 2010
    • Chao-Tsung HUANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRICAL CONNECTOR ASSEMBLY WITH FLOATABLY ARRANGED WAFER
    • Publication number 20080305656
    • Publication date Dec 11, 2008
    • HON HAI PRECISION IND, CO., LTD.
    • Kevin E. Walker
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Chip adapter
    • Publication number 20080012105
    • Publication date Jan 17, 2008
    • WIESON TECHNOLOGIES CO., LTD.
    • Sheng-Fu Chen
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Chip Adapter Seat
    • Publication number 20070218742
    • Publication date Sep 20, 2007
    • Chih-Ming Lai
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Radiation board
    • Publication number 20060254755
    • Publication date Nov 16, 2006
    • Win-Haw Chen
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    Conforming Lid Socket for Leaded Surface Mount Packages
    • Publication number 20060121754
    • Publication date Jun 8, 2006
    • Milos Krejcik
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Socket for semiconductor device
    • Publication number 20050250363
    • Publication date Nov 10, 2005
    • Yamaichi Electronics Co., Ltd.
    • Takeyuki Suzuki
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    IC socket having fastening mechanism for sensor
    • Publication number 20050068753
    • Publication date Mar 31, 2005
    • Robert G. McHugh
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Contact pin and socket for electrical parts
    • Publication number 20050042905
    • Publication date Feb 24, 2005
    • ENPLAS CORPORATION
    • Akira Miura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Self-aligning socket connector
    • Publication number 20040171292
    • Publication date Sep 2, 2004
    • Toshiaki Watanabe
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Socket
    • Publication number 20040127075
    • Publication date Jul 1, 2004
    • Mitsubishi Denki Kabushiki Kaisha
    • Eiji Yoshida
    • G01 - MEASURING TESTING
  • Information Patent Application

    IC socket
    • Publication number 20040018760
    • Publication date Jan 29, 2004
    • Yamaichi Electronics Co., Ltd.
    • Yuji Kato
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Socket for semiconductor device
    • Publication number 20040009682
    • Publication date Jan 15, 2004
    • Yamaichi Electronics Co., Ltd.
    • Takeyuki Suzuki
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Locking assembly for securing semiconductor device to carrier subst...
    • Publication number 20030211769
    • Publication date Nov 13, 2003
    • David J. Corisis
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Socket for electrical parts
    • Publication number 20030162418
    • Publication date Aug 28, 2003
    • ENPLAS CORPORATION
    • TAKAYUKI YAMADA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Contact base with detachable contacts for making electrical contact...
    • Publication number 20030129861
    • Publication date Jul 10, 2003
    • Claus Engelhardt
    • G01 - MEASURING TESTING
  • Information Patent Application

    DE-MOUNTABLE, SOLDERLESS IN-LINE LEAD MODULE PACKAGE WITH INTERFACE
    • Publication number 20030107874
    • Publication date Jun 12, 2003
    • Haim Feigenbaum
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Contactor for semiconductor device and contact method
    • Publication number 20030096523
    • Publication date May 22, 2003
    • FUJITSU LIMITED
    • Masaru Tateishi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    KGD carrier and an IC mounting socket mounting it
    • Publication number 20030092301
    • Publication date May 15, 2003
    • Yamaichi Electronics Co., Ltd.
    • Minoru Hisaishi
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    IC SOCKET WITH TWO POINT-CONTACTS
    • Publication number 20030073355
    • Publication date Apr 17, 2003
    • Yamaichi Electronics Co.
    • Nobuo Kawamura
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR