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H05K7/1076

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/1076co-operating by sliding

Industries

Patents Grantslast 30 patents

Information Patent Grant
SSD card adapter bracket and circuit board assembly
- Patent number 12,150,265
- Issue date Nov 19, 2024
- Hong Fu Jin Precision Industry (WuHan) Co., Ltd.
- Zhao-Li Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connectors for integrated circuit packages
- Patent number 11,158,969
- Issue date Oct 26, 2021
- Intel Corporation
- Feifei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Server
- Patent number 10,168,747
- Issue date Jan 1, 2019
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Zhi-Feng Zhu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Modular electronics system with interfacing interchangeable components
- Patent number 10,021,801
- Issue date Jul 10, 2018
- ATOM, Inc.
- Yani Deros
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
High performance surface mount electrical interconnect
- Patent number 9,093,767
- Issue date Jul 28, 2015
- HSIO Technologies, LLC
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus
- Patent number 8,451,616
- Issue date May 28, 2013
- Kabushiki Kaisha Toshiba
- Takahiro Sugai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alignment and lead insertion device for an electronic component
- Patent number 8,402,640
- Issue date Mar 26, 2013
- Vectronix, Inc.
- Brian Karstetter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connecting device
- Patent number 8,070,505
- Issue date Dec 6, 2011
- Lotes Co., Ltd.
- Ted Ju
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spring reaction force converting apparatus
- Patent number 8,051,731
- Issue date Nov 8, 2011
- Enplas Corporation
- Osamu Hachuda
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Randomly-accessible electrical busbar with protective cover and ass...
- Patent number 7,699,635
- Issue date Apr 20, 2010
- The Boeing Company
- Thomas L. Weaver
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Land grid array (LGA) socket with cells and method of fabrication a...
- Patent number 7,695,288
- Issue date Apr 13, 2010
- Intel Corporation
- Xiaoqing Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Zero insertion force socket having improved actuator position
- Patent number 7,572,136
- Issue date Aug 11, 2009
- Hon Hai Precision Ind. Co., Ltd.
- Fang-Jun Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
CPU socket configured with assembled grids
- Patent number 7,563,106
- Issue date Jul 21, 2009
- Hon Hai Precision Ind. Co., Ltd.
- Nan-Hong Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alignment system
- Patent number 7,347,713
- Issue date Mar 25, 2008
- Hewlett-Packard Development Company, L.P.
- Brent Boudreaux
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for mounting columns for grid array electronic packages
- Patent number 7,293,354
- Issue date Nov 13, 2007
- International Business Machines Corporation
- Yvan Ferland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector with dual-function sidewalls
- Patent number 6,827,585
- Issue date Dec 7, 2004
- Hon Hai Precision Ind. Co., Ltd.
- Hao-Yuan Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor die package having mesh power and ground planes
- Patent number 6,803,650
- Issue date Oct 12, 2004
- Silicon Bandwidth Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hole grid array package and socket technology
- Patent number 6,713,684
- Issue date Mar 30, 2004
- Intel Corporation
- Brent S. Stone
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector with dual-function sidewalls
- Patent number 6,695,625
- Issue date Feb 24, 2004
- Hon Hai Precision Ind. Co., Ltd.
- Hao-Yuan Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for protecting pins of an electrical component
- Patent number 6,203,356
- Issue date Mar 20, 2001
- International Business Machines Corporation
- Peter Thomsen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC socket
- Patent number 6,149,449
- Issue date Nov 21, 2000
- Yamaichi Electronics Co., Ltd.
- Shunji Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for achieving uniform expansion of dielectric plate
- Patent number 6,135,791
- Issue date Oct 24, 2000
- Hon Hai Precision Ind. Co., Ltd.
- Jwo-Min Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
ZIF socket with top loading contacts
- Patent number 6,056,576
- Issue date May 2, 2000
- Hon Hai Precision Ind. Co., Ltd.
- Ming-Lun Szu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit extraction tool
- Patent number 5,617,628
- Issue date Apr 8, 1997
- Cyrix Corporation
- Stanley D. Harder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus for ball grid array device
- Patent number 5,611,705
- Issue date Mar 18, 1997
- Wayne K. Pfaff
- G01 - MEASURING TESTING
Information Patent Grant
Mounting apparatus for ball grid array device
- Patent number 5,556,293
- Issue date Sep 17, 1996
- Wayne K. Pfaff
- G01 - MEASURING TESTING
Information Patent Grant
Tool for removing microchip modules from their sockets
- Patent number 5,537,736
- Issue date Jul 23, 1996
- Lawrence R. Higa
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Integrated circuit extraction tool
- Patent number 5,440,803
- Issue date Aug 15, 1995
- Cyrix Corporation
- Thomas D. Selgas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus for ball grid array device
- Patent number 5,419,710
- Issue date May 30, 1995
- Wayne K. Pfaff
- G01 - MEASURING TESTING
Information Patent Grant
Chip carrier socket
- Patent number 5,177,671
- Issue date Jan 5, 1993
- KEL Corporation
- Kiyoshi Atoh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONNECTOR ASSEMBLY WITH INTEGRATED DATA AND BACKUP ENERGY CONNECTIONS
- Publication number 20240305026
- Publication date Sep 12, 2024
- Micron Technology, Inc.
- Mark A. Tverdy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SSD CARD ADAPTER BRACKET AND CIRCUIT BOARD ASSEMBLY
- Publication number 20230269897
- Publication date Aug 24, 2023
- HONG FU JIN PRECISION INDUSTRY (WUHAN) CO., LTD.
- ZHAO-LI ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC ASSEMBLY
- Publication number 20220374056
- Publication date Nov 24, 2022
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Shuai Zhang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONNECTORS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20190044265
- Publication date Feb 7, 2019
- Intel Corporation
- FEIFEI CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SERVER
- Publication number 20180157295
- Publication date Jun 7, 2018
- Inventec (Pudong) Technology Corporation
- Zhi-Feng ZHU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Modular Electronics System With Interfacing Interchangeable Components
- Publication number 20170238436
- Publication date Aug 17, 2017
- Yani Deros
- F21 - LIGHTING
Information Patent Application
HIGH PERFORMANCE SURFACE MOUNT ELECTRICAL INTERCONNECT
- Publication number 20130244490
- Publication date Sep 19, 2013
- HSIO TECHNOLOGIES, LLC
- James Rathburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Alignment and Lead Insertion Device for an Electronic Component
- Publication number 20120073127
- Publication date Mar 29, 2012
- Irvine Sensors Corporation
- Brian Karstetter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Apparatus
- Publication number 20120057279
- Publication date Mar 8, 2012
- Takahiro Sugai
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRICAL CONNECTING DEVICE
- Publication number 20110177701
- Publication date Jul 21, 2011
- Ted Ju
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RANDOMLY-ACCESSIBLE ELECTRICAL BUSBAR WITH PROTECTIVE COVER AND ASS...
- Publication number 20100075533
- Publication date Mar 25, 2010
- Thomas L. Weaver
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Land grid array (LGA) socket with cells and method of fabrication a...
- Publication number 20090325398
- Publication date Dec 31, 2009
- Xiaoqing Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical connector
- Publication number 20090047808
- Publication date Feb 19, 2009
- HON HAI PRECISION IND. CO., LTD.
- Hao-Yun Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SPRING REACTION FORCE CONVERTING APPARATUS
- Publication number 20080229852
- Publication date Sep 25, 2008
- ENPLAS CORPORATION
- Osamu HACHUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Zero insertion force socket having improved actuator position
- Publication number 20080214037
- Publication date Sep 4, 2008
- HON HAI PRECISION IND. CO., LTD.
- Fang-Jun Liao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CPU socket configured with assembled grids
- Publication number 20080050983
- Publication date Feb 28, 2008
- HON HAI PRECISION IND. CO., LTD.
- Nan-Hong Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR MOUNTING COLUMNS FOR GRID ARRAY ELECTRONIC PACKAGES
- Publication number 20070267463
- Publication date Nov 22, 2007
- International Business Machines Corporation
- Yvan Ferland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Alignment system
- Publication number 20070020984
- Publication date Jan 25, 2007
- Brent Boudreaux
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR MOUNTING COLUMNS FOR GRID ARRAY ELECTRONIC PACKAGES
- Publication number 20050122126
- Publication date Jun 9, 2005
- International Business Machines Corporation
- Yvan Ferland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor die package having mesh power and ground planes
- Publication number 20040222514
- Publication date Nov 11, 2004
- Silicon Bandwidth, Inc.
- Stanford W. Crane
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical connector with dual-function sidewalls
- Publication number 20040185689
- Publication date Sep 23, 2004
- Hao-Yuan Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Hole grid array package and socket technology
- Publication number 20040056298
- Publication date Mar 25, 2004
- Brent S. Stone
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Hole grid array package and socket technology
- Publication number 20030079908
- Publication date May 1, 2003
- Brent S. Stone
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor die package having mesh power and ground planes
- Publication number 20020117751
- Publication date Aug 29, 2002
- Silicon Bandwidth, Inc.
- Stanford W. Crane, Jr.
- H01 - BASIC ELECTRIC ELEMENTS

co-operating by sliding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

SSD card adapter bracket and circuit board assembly

Connectors for integrated circuit packages

Server

Modular electronics system with interfacing interchangeable components

High performance surface mount electrical interconnect

Electronic apparatus

Alignment and lead insertion device for an electronic component

Electrical connecting device

Spring reaction force converting apparatus

Randomly-accessible electrical busbar with protective cover and ass...

Land grid array (LGA) socket with cells and method of fabrication a...

Zero insertion force socket having improved actuator position

CPU socket configured with assembled grids

Alignment system

Apparatus for mounting columns for grid array electronic packages

Electrical connector with dual-function sidewalls

Semiconductor die package having mesh power and ground planes

Hole grid array package and socket technology

Electrical connector with dual-function sidewalls

Device and method for protecting pins of an electrical component

IC socket

Method for achieving uniform expansion of dielectric plate

ZIF socket with top loading contacts

Integrated circuit extraction tool

Mounting apparatus for ball grid array device

Mounting apparatus for ball grid array device

Tool for removing microchip modules from their sockets

Integrated circuit extraction tool

Mounting apparatus for ball grid array device

Chip carrier socket

Patents Applicationslast 30 patents

CONNECTOR ASSEMBLY WITH INTEGRATED DATA AND BACKUP ENERGY CONNECTIONS

SSD CARD ADAPTER BRACKET AND CIRCUIT BOARD ASSEMBLY

ELECTRONIC ASSEMBLY

CONNECTORS FOR INTEGRATED CIRCUIT PACKAGES

SERVER

Modular Electronics System With Interfacing Interchangeable Components

HIGH PERFORMANCE SURFACE MOUNT ELECTRICAL INTERCONNECT

Alignment and Lead Insertion Device for an Electronic Component

Electronic Apparatus

ELECTRICAL CONNECTING DEVICE

RANDOMLY-ACCESSIBLE ELECTRICAL BUSBAR WITH PROTECTIVE COVER AND ASS...

Land grid array (LGA) socket with cells and method of fabrication a...

Electrical connector

SPRING REACTION FORCE CONVERTING APPARATUS

Zero insertion force socket having improved actuator position

CPU socket configured with assembled grids

APPARATUS FOR MOUNTING COLUMNS FOR GRID ARRAY ELECTRONIC PACKAGES

Alignment system

APPARATUS FOR MOUNTING COLUMNS FOR GRID ARRAY ELECTRONIC PACKAGES

Semiconductor die package having mesh power and ground planes

Electrical connector with dual-function sidewalls

Hole grid array package and socket technology

Hole grid array package and socket technology

Semiconductor die package having mesh power and ground planes