Coating material

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H01L2224/29399

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29399Coating material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and methods of manufacture thereof
- Patent number 10,825,747
- Issue date Nov 3, 2020
- NXP USA, INC.
- Li Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic device with transceiving antenna and magnetic...
- Patent number 10,366,969
- Issue date Jul 30, 2019
- STMicroelectronics S.r.l.
- Alberto Pagani
- G01 - MEASURING TESTING
Information Patent Grant
Method for creating a connection between metallic moulded bodies an...
- Patent number 9,786,627
- Issue date Oct 10, 2017
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic device with transceiving antenna and magnetic...
- Patent number 9,530,743
- Issue date Dec 27, 2016
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode (LED) devices, systems, and methods
- Patent number 9,111,778
- Issue date Aug 18, 2015
- Cree, Inc.
- David T. Emerson
- G02 - OPTICS
Information Patent Grant
Integrated electronic device with transceiving antenna and magnetic...
- Patent number 9,076,883
- Issue date Jul 7, 2015
- STMicroelectronics S.R.L.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electronic device with transceiving antenna and magnetic...
- Patent number 8,604,570
- Issue date Dec 10, 2013
- STMicroelectronics S.r.l.
- Alberto Pagani
- G01 - MEASURING TESTING
Information Patent Grant
Circuit connecting material, film-form circuit connecting material...
- Patent number 8,501,045
- Issue date Aug 6, 2013
- Hitachi Chemical Company, Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Circuit connecting material, film-form circuit connecting material...
- Patent number 8,202,622
- Issue date Jun 19, 2012
- Hitachi Chemical Co., Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Interconnect and method for mounting an electronic device to a subs...
- Patent number 8,129,847
- Issue date Mar 6, 2012
- Warren M. Farnworth
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit connecting material, film-like circuit connecting material...
- Patent number 8,043,709
- Issue date Oct 25, 2011
- Hitachi Chemical Co., Ltd.
- Motohiro Arifuku
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electric components connecting method
- Patent number 7,886,432
- Issue date Feb 15, 2011
- Panasonic Corporation
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Insulated conductive particles and anisotropic conductive adhesive...
- Patent number 7,815,999
- Issue date Oct 19, 2010
- Cheil Industries, Inc.
- Jin Gyu Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component unit
- Patent number 7,683,482
- Issue date Mar 23, 2010
- Panasonic Corporation
- Kazuto Nishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self-assembled interconnection particles
- Patent number 7,662,708
- Issue date Feb 16, 2010
- Palo Alto Research Center Incorporated
- David K. Fork
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mounting electronic component
- Patent number 7,647,694
- Issue date Jan 19, 2010
- Sony Corporation
- Misao Konishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive adhesive, electrode connection structure and...
- Patent number 7,635,862
- Issue date Dec 22, 2009
- Toshiba Matsushita Display Technology Co., Ltd
- Daijiro Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer-level chip scale package and method for fabricating and using...
- Patent number 7,632,719
- Issue date Dec 15, 2009
- Fairchild Korea Semiconductor, Ltd.
- Seung Yong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having an anisotropic-conductive adhesive film
- Patent number 7,492,434
- Issue date Feb 17, 2009
- NEC LCD Technologies, Ltd.
- Kiyofumi Kudo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive particle and adhesive agent
- Patent number 7,413,686
- Issue date Aug 19, 2008
- Sony Chemicals Corporation
- Yukio Yamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package using flip-chip mounting technique
- Patent number 7,227,267
- Issue date Jun 5, 2007
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yeong Gyu Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Insulated conductive ball for anisotropic conductive connection, me...
- Patent number 7,169,332
- Issue date Jan 30, 2007
- Hanwha Chemical Corporation
- Joo-Seok Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive material body, display apparatus, method for...
- Patent number 7,134,879
- Issue date Nov 14, 2006
- Sharp Kabushiki Kaisha
- Mitsuhiro Sugimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for mounting electronic component on circuit board
- Patent number 6,981,317
- Issue date Jan 3, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kazuto Nishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive and electric device
- Patent number 6,921,782
- Issue date Jul 26, 2005
- Sony Chemicals Corp.
- Takayuki Matsushima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device, a method for making the same, and an LCD moni...
- Patent number 6,867,505
- Issue date Mar 15, 2005
- Au Optronics Corp.
- Chun-Yu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adhesive for semiconductor part
- Patent number 6,833,180
- Issue date Dec 21, 2004
- Nippon Zeon Company, Ltd.
- Junji Kodemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded anisotropic conductive film
- Patent number 6,806,581
- Issue date Oct 19, 2004
- Au Optronics Corporation
- Kuan-Sheng Hsieh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Latent hardener, manufacturing method for latent hardener, and adhe...
- Patent number 6,794,038
- Issue date Sep 21, 2004
- Sony Chemicals Corporation
- Takayuki Matsushima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Microcapsulating conductive metal particles with polymerized monomers
- Patent number 6,737,108
- Issue date May 18, 2004
- Fujitsu Limited
- Hiroaki Date
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE
- Publication number 20240120254
- Publication date Apr 11, 2024
- DEXERIALS CORPORATION
- Keisuke ARAMAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC DEVICE WITH TRANSCEIVING ANTENNA AND MAGNETIC...
- Publication number 20180040591
- Publication date Feb 8, 2018
- STMicroelectronics S.r.l.
- Alberto Pagani
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE
- Publication number 20140291826
- Publication date Oct 2, 2014
- RENESAS ELECTRONICS CORPORATION
- Motoi ISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CREATING A CONNECTION BETWEEN METALLIC MOULDED BODIES AN...
- Publication number 20140230989
- Publication date Aug 21, 2014
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC DEVICE WITH TRANSCEIVING ANTENNA AND MAGNETIC...
- Publication number 20140070345
- Publication date Mar 13, 2014
- STMicroelectronics S.r. I.
- Alberto PAGANI
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE FOR DRIVING DISPLAY DEVICE...
- Publication number 20130075897
- Publication date Mar 28, 2013
- RENESAS ELECTRONICS CORPORATION
- Atsushi OBUCHI
- G01 - MEASURING TESTING
Information Patent Application
LIGHT EMITTING DIODE (LED) DEVICES, SYSTEMS, AND METHODS
- Publication number 20120153317
- Publication date Jun 21, 2012
- David T. Emerson
- G02 - OPTICS
Information Patent Application
SINTERING MATERIALS AND ATTACHMENT METHODS USING SAME
- Publication number 20120114927
- Publication date May 10, 2012
- Oscar Khaselev
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...
- Publication number 20110247870
- Publication date Oct 13, 2011
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CONNECTION MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...
- Publication number 20110247757
- Publication date Oct 13, 2011
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED ELECTRONIC DEVICE WITH TRANSCEIVING ANTENNA AND MAGNETIC...
- Publication number 20100164671
- Publication date Jul 1, 2010
- STMICROELECTRONICS S.R.L.
- Alberto PAGANI
- G01 - MEASURING TESTING
Information Patent Application
Interconnect And Method For Mounting An Electronic Device To A Subs...
- Publication number 20100123115
- Publication date May 20, 2010
- Warren M. Farnworth
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE FOR DRIVING DISPLAY DEVICE...
- Publication number 20100117081
- Publication date May 13, 2010
- Renesas Technology Corp.
- Atsushi OBUCHI
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
WIRING BOARD AND DISPLAY UNIT
- Publication number 20100051330
- Publication date Mar 4, 2010
- Sharp Kabushiki Kaisha
- Kenichi Yamashita
- G02 - OPTICS
Information Patent Application
CIRCUIT CONNECTION STRUCTURE
- Publication number 20100025097
- Publication date Feb 4, 2010
- Hitachi Chemical Company, Ltd.
- Kazuyoshi Kojima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...
- Publication number 20090321116
- Publication date Dec 31, 2009
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC COMPONENTS CONNECTING METHOD
- Publication number 20090229123
- Publication date Sep 17, 2009
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER-LEVEL CHIP SCALE PACKAGE AND METHOD FOR FABRICATING AND USING...
- Publication number 20090111219
- Publication date Apr 30, 2009
- Seung-Yong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Anisotropic Insulated Conductive Ball For Electric Connect...
- Publication number 20080237545
- Publication date Oct 2, 2008
- Hanwha Chemical Corporation
- Eui-Deok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for mounting electronic component
- Publication number 20070094872
- Publication date May 3, 2007
- Sony Chemicals Corporation
- Misao Konishi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packages, anisotropic conductive films, and conductive particles ut...
- Publication number 20070063347
- Publication date Mar 22, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Yuan Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Insulated conductive particles and anisotropic conductive adhesive...
- Publication number 20070059503
- Publication date Mar 15, 2007
- Jin Gyu Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE HAVING AN ANISOTROPIC-CONDUCTIVE ADHESIVE FILM
- Publication number 20070030433
- Publication date Feb 8, 2007
- Kiyofumi Kudo
- G02 - OPTICS
Information Patent Application
Self-assembled interconnection particles
- Publication number 20070023907
- Publication date Feb 1, 2007
- Palo Alto Research Center Incorporated
- David K. Fork
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component mounting method and apparatus
- Publication number 20070013067
- Publication date Jan 18, 2007
- Kazuto Nishida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Anisotropic conductive adhesive, electrode connection structure and...
- Publication number 20060194425
- Publication date Aug 31, 2006
- Toshiba Matsushita Display Technology Co., Ltd.
- Daijiro Takano
- G02 - OPTICS
Information Patent Application
Circuit device and manufacturing method thereof
- Publication number 20060193108
- Publication date Aug 31, 2006
- SANYO ELECTRIC CO., LTD.
- Ryosuke Usui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit connecting material, film-like circuit connecting material...
- Publication number 20060100314
- Publication date May 11, 2006
- Motohiro Arifuku
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor package using flip-chip mounting technique
- Publication number 20060076692
- Publication date Apr 13, 2006
- Samsung Electro-Mechanics CO., LTD.
- Yeong Gyu Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Conductive particle and adhesive agent
- Publication number 20060054867
- Publication date Mar 16, 2006
- Yukio Yamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Coating material

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package and methods of manufacture thereof

Integrated electronic device with transceiving antenna and magnetic...

Method for creating a connection between metallic moulded bodies an...

Integrated electronic device with transceiving antenna and magnetic...

Light emitting diode (LED) devices, systems, and methods

Integrated electronic device with transceiving antenna and magnetic...

Integrated electronic device with transceiving antenna and magnetic...

Circuit connecting material, film-form circuit connecting material...

Circuit connecting material, film-form circuit connecting material...

Interconnect and method for mounting an electronic device to a subs...

Circuit connecting material, film-like circuit connecting material...

Electric components connecting method

Insulated conductive particles and anisotropic conductive adhesive...

Electronic component unit

Self-assembled interconnection particles

Method for mounting electronic component

Anisotropic conductive adhesive, electrode connection structure and...

Wafer-level chip scale package and method for fabricating and using...

Display device having an anisotropic-conductive adhesive film

Conductive particle and adhesive agent

Semiconductor package using flip-chip mounting technique

Insulated conductive ball for anisotropic conductive connection, me...

Anisotropic conductive material body, display apparatus, method for...

Method and device for mounting electronic component on circuit board

Adhesive and electric device

Semiconductor device, a method for making the same, and an LCD moni...

Adhesive for semiconductor part

Bonded anisotropic conductive film

Latent hardener, manufacturing method for latent hardener, and adhe...

Microcapsulating conductive metal particles with polymerized monomers

Patents Applicationslast 30 patents

THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE

INTEGRATED ELECTRONIC DEVICE WITH TRANSCEIVING ANTENNA AND MAGNETIC...

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

METHOD FOR CREATING A CONNECTION BETWEEN METALLIC MOULDED BODIES AN...

INTEGRATED ELECTRONIC DEVICE WITH TRANSCEIVING ANTENNA AND MAGNETIC...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE FOR DRIVING DISPLAY DEVICE...

LIGHT EMITTING DIODE (LED) DEVICES, SYSTEMS, AND METHODS

SINTERING MATERIALS AND ATTACHMENT METHODS USING SAME

CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...

CIRCUIT CONNECTION MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...

INTEGRATED ELECTRONIC DEVICE WITH TRANSCEIVING ANTENNA AND MAGNETIC...

Interconnect And Method For Mounting An Electronic Device To A Subs...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE FOR DRIVING DISPLAY DEVICE...

WIRING BOARD AND DISPLAY UNIT

CIRCUIT CONNECTION STRUCTURE

CIRCUIT CONNECTING MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL...

ELECTRIC COMPONENTS CONNECTING METHOD

WAFER-LEVEL CHIP SCALE PACKAGE AND METHOD FOR FABRICATING AND USING...

Advanced Anisotropic Insulated Conductive Ball For Electric Connect...

Method for mounting electronic component

Packages, anisotropic conductive films, and conductive particles ut...

Insulated conductive particles and anisotropic conductive adhesive...

DISPLAY DEVICE HAVING AN ANISOTROPIC-CONDUCTIVE ADHESIVE FILM

Self-assembled interconnection particles

Electronic component mounting method and apparatus

Anisotropic conductive adhesive, electrode connection structure and...

Circuit device and manufacturing method thereof

Circuit connecting material, film-like circuit connecting material...

Semiconductor package using flip-chip mounting technique

Conductive particle and adhesive agent