Coating or filling in grooves made in the semiconductor body

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H01L23/3178

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3178Coating or filling in grooves made in the semiconductor body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Solvent annealing of an organic planarization layer
- Patent number 12,362,168
- Issue date Jul 15, 2025
- International Business Machines Corporation
- Jing Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unit specific variable or adaptive metal fill and system and method...
- Patent number 12,334,396
- Issue date Jun 17, 2025
- Deca Technologies USA, Inc.
- David Ryan Bartling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package including a protection layer
- Patent number 12,198,999
- Issue date Jan 14, 2025
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for forminginsulating structure of high electr...
- Patent number 12,199,175
- Issue date Jan 14, 2025
- United Microelectronics Corp.
- Chun-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan out device with a filler-free insulating material
- Patent number 12,191,222
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a dielectric between portions
- Patent number 12,183,646
- Issue date Dec 31, 2024
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor packages
- Patent number 12,159,833
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures
- Patent number 12,125,784
- Issue date Oct 22, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including groove in termination region
- Patent number 12,087,706
- Issue date Sep 10, 2024
- Mitsubishi Electric Corporation
- Takaki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing a semiconductor...
- Patent number 12,087,717
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 12,050,398
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Hidenori Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 12,014,969
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming packaged semiconductor devices and leadframes fo...
- Patent number 12,009,286
- Issue date Jun 11, 2024
- MACOM Technology Solutions Holdings, Inc.
- Soon Lee Liew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation scheme for pad openings and trenches
- Patent number 12,002,774
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porogen bonded gap filling material in semiconductor manufacturing
- Patent number 11,984,316
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit medical devices and method
- Patent number 11,974,862
- Issue date May 7, 2024
- Vactronix Scientific, Inc.
- Scott P. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,908,835
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus having a functional structure delimited by a frame struct...
- Patent number 11,908,763
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Prashanth Makaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,901,269
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Seongchan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus
- Patent number 11,817,362
- Issue date Nov 14, 2023
- Advanced Semiconductor Engineering, Inc.
- Pang Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,798,898
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Wen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unit specific variable or adaptive metal fill and system and method...
- Patent number 11,791,207
- Issue date Oct 17, 2023
- Deca Technologies USA, Inc.
- David Ryan Bartling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection structures in semiconductor chips and methods for formin...
- Patent number 11,791,229
- Issue date Oct 17, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jialan He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic devices with a cap and molding
- Patent number 11,776,860
- Issue date Oct 3, 2023
- Seiko Epson Corporation
- Masataka Kazuno
- G01 - MEASURING TESTING
Information Patent Grant
Chip component and method of manufacturing the same
- Patent number 11,769,705
- Issue date Sep 26, 2023
- Rohm Co., Ltd.
- Katsuya Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures
- Patent number 11,756,880
- Issue date Sep 12, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan out method utilizing a filler-free insulating material
- Patent number 11,721,603
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit medical devices and method
- Patent number 11,701,059
- Issue date Jul 18, 2023
- Vactronix Scientific, LLC.
- Scott P. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with embossed solder mask having non-...
- Patent number 11,688,706
- Issue date Jun 27, 2023
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESS FOR MANUFACTURING ELECTRONIC COMPONENTS
- Publication number 20250192022
- Publication date Jun 12, 2025
- STMicroelectronics International N.V.
- Gregoire DELACOURT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20250185232
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Heonjun Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING OPTICAL COMPONENT AND MANUFACTURING...
- Publication number 20250174586
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hui Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250118612
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE AND MANUFACTURING METHOD
- Publication number 20250112143
- Publication date Apr 3, 2025
- Fuji Electric Co., Ltd.
- Kohei YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERTER
- Publication number 20250112103
- Publication date Apr 3, 2025
- Mitsubishi Electric Corporation
- Kohei EBIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan Out Device with a Filler-Free Insulating Material
- Publication number 20250096059
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RINGS FOR A WIDE BAND-GAP SEMICONDUCTOR LAYER STACK
- Publication number 20250079345
- Publication date Mar 6, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Ian McCallum-Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE THEREWITH
- Publication number 20250079359
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Jeong Wan HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046755
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEMS COOLED BY EMBEDDED MICROTUBES
- Publication number 20250029891
- Publication date Jan 23, 2025
- SABANCI UNIVERSITESI
- Murat Kaya YAPICI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421020
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- YOUNG KWAN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING INTEGRATED INTEGRATED CIRCUIT MEDICAL DEVICES
- Publication number 20240382158
- Publication date Nov 21, 2024
- Vactronix Scientific, Inc.
- Scott P. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES
- Publication number 20240379539
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PROTECTIVE STRUCTURE AND METHOD OF MANUFA...
- Publication number 20240371780
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240371717
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Donggon Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY REGULATED SEMICONDUCTOR DEVICE
- Publication number 20240347413
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Chen Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321955
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Tsutomu KIYOSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED STRUCTURE AND SEMICONDUCTOR ELEMENT
- Publication number 20240312854
- Publication date Sep 19, 2024
- FLOSFIA INC.
- Hiroyuki ANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CAPPING LAYER AND METHOD FOR FABRICATING...
- Publication number 20240304697
- Publication date Sep 12, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CAPPING LAYER
- Publication number 20240304696
- Publication date Sep 12, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240297089
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME, MEMORY, AND...
- Publication number 20240290678
- Publication date Aug 29, 2024
- BEIJING SUPERSTRING ACADEMY OF MEMORY TECHNOLOGY
- Ming ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES AND LEADFRAMES FO...
- Publication number 20240282679
- Publication date Aug 22, 2024
- MACOM Technology Solutions Holdings, Inc.
- Soon Lee Liew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION SCHEME FOR PAD OPENINGS AND TRENCHES
- Publication number 20240282728
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRIC POWER CONVERSION DEVICE, AND METHOD...
- Publication number 20240274655
- Publication date Aug 15, 2024
- Mitsubishi Electric Corporation
- Kohei EBIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240274486
- Publication date Aug 15, 2024
- InnoCare Optoelectronics Corporation
- Hsin-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING STRUCTURES
- Publication number 20240234346
- Publication date Jul 11, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Mark D. LEVY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIT SPECIFIC VARIABLE OR ADAPTIVE METAL FILL AND SYSTEM AND METHOD...
- Publication number 20240222193
- Publication date Jul 4, 2024
- David Ryan BARTLING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR DEVICES
- Publication number 20240213109
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS

Coating or filling in grooves made in the semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solvent annealing of an organic planarization layer

Unit specific variable or adaptive metal fill and system and method...

Electronic package including a protection layer

Manufacturing method for forminginsulating structure of high electr...

Integrated fan out device with a filler-free insulating material

Semiconductor device with a dielectric between portions

Fan-out semiconductor packages

Interconnect structures

Semiconductor device including groove in termination region

Semiconductor package and methods of manufacturing a semiconductor...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method of forming the same

Package structure and method for forming the same

Methods of forming packaged semiconductor devices and leadframes fo...

Passivation scheme for pad openings and trenches

Porogen bonded gap filling material in semiconductor manufacturing

Integrated circuit medical devices and method

Semiconductor structure and manufacturing method thereof

Apparatus having a functional structure delimited by a frame struct...

Semiconductor package

Electronic apparatus

Package structure

Unit specific variable or adaptive metal fill and system and method...

Protection structures in semiconductor chips and methods for formin...

Method of manufacturing electronic devices with a cap and molding

Chip component and method of manufacturing the same

Interconnect structures

Integrated fan out method utilizing a filler-free insulating material

Integrated circuit medical devices and method

Semiconductor device assembly with embossed solder mask having non-...

Patents Applicationslast 30 patents

PROCESS FOR MANUFACTURING ELECTRONIC COMPONENTS

SEMICONDUCTOR DEVICES

SEMICONDUCTOR STRUCTURE HAVING OPTICAL COMPONENT AND MANUFACTURING...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE AND MANUFACTURING METHOD

SEMICONDUCTOR DEVICE AND POWER CONVERTER

Integrated Fan Out Device with a Filler-Free Insulating Material

SEAL RINGS FOR A WIDE BAND-GAP SEMICONDUCTOR LAYER STACK

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE THEREWITH

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT SYSTEMS COOLED BY EMBEDDED MICROTUBES

SEMICONDUCTOR PACKAGE

METHOD OF MAKING INTEGRATED INTEGRATED CIRCUIT MEDICAL DEVICES

INTERCONNECT STRUCTURES

SEMICONDUCTOR DEVICE WITH PROTECTIVE STRUCTURE AND METHOD OF MANUFA...

SEMICONDUCTOR DEVICE

THERMALLY REGULATED SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

LAMINATED STRUCTURE AND SEMICONDUCTOR ELEMENT

SEMICONDUCTOR DEVICE WITH CAPPING LAYER AND METHOD FOR FABRICATING...

SEMICONDUCTOR DEVICE WITH CAPPING LAYER

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME, MEMORY, AND...

METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES AND LEADFRAMES FO...

PASSIVATION SCHEME FOR PAD OPENINGS AND TRENCHES

SEMICONDUCTOR DEVICE, ELECTRIC POWER CONVERSION DEVICE, AND METHOD...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEAL RING STRUCTURES

UNIT SPECIFIC VARIABLE OR ADAPTIVE METAL FILL AND SYSTEM AND METHOD...

SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR DEVICES