Coating or filling in grooves made in the semiconductor body

Industry

CPC
H01L23/3178

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3178Coating or filling in grooves made in the semiconductor body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with a dielectric between portions
- Patent number 12,183,646
- Issue date Dec 31, 2024
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor packages
- Patent number 12,159,833
- Issue date Dec 3, 2024
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures
- Patent number 12,125,784
- Issue date Oct 22, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including groove in termination region
- Patent number 12,087,706
- Issue date Sep 10, 2024
- Mitsubishi Electric Corporation
- Takaki Ito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and methods of manufacturing a semiconductor...
- Patent number 12,087,717
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Thomas Feil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 12,057,362
- Issue date Aug 6, 2024
- Rohm Co., Ltd.
- Osamu Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming the same
- Patent number 12,050,398
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Hidenori Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for forming the same
- Patent number 12,014,969
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming packaged semiconductor devices and leadframes fo...
- Patent number 12,009,286
- Issue date Jun 11, 2024
- MACOM Technology Solutions Holdings, Inc.
- Soon Lee Liew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation scheme for pad openings and trenches
- Patent number 12,002,774
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porogen bonded gap filling material in semiconductor manufacturing
- Patent number 11,984,316
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit medical devices and method
- Patent number 11,974,862
- Issue date May 7, 2024
- Vactronix Scientific, Inc.
- Scott P. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,908,835
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus having a functional structure delimited by a frame struct...
- Patent number 11,908,763
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Prashanth Makaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,901,269
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Seongchan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus
- Patent number 11,817,362
- Issue date Nov 14, 2023
- Advanced Semiconductor Engineering, Inc.
- Pang Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,798,898
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Wen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unit specific variable or adaptive metal fill and system and method...
- Patent number 11,791,207
- Issue date Oct 17, 2023
- Deca Technologies USA, Inc.
- David Ryan Bartling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection structures in semiconductor chips and methods for formin...
- Patent number 11,791,229
- Issue date Oct 17, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jialan He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic devices with a cap and molding
- Patent number 11,776,860
- Issue date Oct 3, 2023
- Seiko Epson Corporation
- Masataka Kazuno
- G01 - MEASURING TESTING
Information Patent Grant
Chip component and method of manufacturing the same
- Patent number 11,769,705
- Issue date Sep 26, 2023
- Rohm Co., Ltd.
- Katsuya Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures
- Patent number 11,756,880
- Issue date Sep 12, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan out method utilizing a filler-free insulating material
- Patent number 11,721,603
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit medical devices and method
- Patent number 11,701,059
- Issue date Jul 18, 2023
- Vactronix Scientific, LLC.
- Scott P. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with embossed solder mask having non-...
- Patent number 11,688,706
- Issue date Jun 27, 2023
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package with warpage management and process for f...
- Patent number 11,676,876
- Issue date Jun 13, 2023
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with multiple electronic components spaced apart...
- Patent number 11,676,877
- Issue date Jun 13, 2023
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porogen bonded gap filling material in semiconductor manufacturing
- Patent number 11,658,120
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disaggregated die interconnection with on-silicon cavity bridge
- Patent number 11,652,057
- Issue date May 16, 2023
- Intel Corporation
- Khang Choong Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sawing underfill in packaging processes
- Patent number 11,637,086
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240421020
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- YOUNG KWAN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING INTEGRATED INTEGRATED CIRCUIT MEDICAL DEVICES
- Publication number 20240382158
- Publication date Nov 21, 2024
- Vactronix Scientific, Inc.
- Scott P. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES
- Publication number 20240379539
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH PROTECTIVE STRUCTURE AND METHOD OF MANUFA...
- Publication number 20240371780
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240371717
- Publication date Nov 7, 2024
- Samsung Electronics Co., Ltd.
- Donggon Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY REGULATED SEMICONDUCTOR DEVICE
- Publication number 20240347413
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Chen Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321955
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Tsutomu KIYOSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED STRUCTURE AND SEMICONDUCTOR ELEMENT
- Publication number 20240312854
- Publication date Sep 19, 2024
- FLOSFIA INC.
- Hiroyuki ANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CAPPING LAYER AND METHOD FOR FABRICATING...
- Publication number 20240304697
- Publication date Sep 12, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CAPPING LAYER
- Publication number 20240304696
- Publication date Sep 12, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240297089
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME, MEMORY, AND...
- Publication number 20240290678
- Publication date Aug 29, 2024
- BEIJING SUPERSTRING ACADEMY OF MEMORY TECHNOLOGY
- Ming ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES AND LEADFRAMES FO...
- Publication number 20240282679
- Publication date Aug 22, 2024
- MACOM Technology Solutions Holdings, Inc.
- Soon Lee Liew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION SCHEME FOR PAD OPENINGS AND TRENCHES
- Publication number 20240282728
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, ELECTRIC POWER CONVERSION DEVICE, AND METHOD...
- Publication number 20240274655
- Publication date Aug 15, 2024
- Mitsubishi Electric Corporation
- Kohei EBIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240274486
- Publication date Aug 15, 2024
- InnoCare Optoelectronics Corporation
- Hsin-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING STRUCTURES
- Publication number 20240234346
- Publication date Jul 11, 2024
- GLOBALFOUNDRIES U.S. Inc.
- Mark D. LEVY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIT SPECIFIC VARIABLE OR ADAPTIVE METAL FILL AND SYSTEM AND METHOD...
- Publication number 20240222193
- Publication date Jul 4, 2024
- David Ryan BARTLING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR DEVICES
- Publication number 20240213109
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240203847
- Publication date Jun 20, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Dae Young Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH COPLANAR INTERCONNECT STRUCTUR...
- Publication number 20240071914
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Thiagarajan Raman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240055371
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Der-Chyang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES
- Publication number 20240047344
- Publication date Feb 8, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT MEDICAL DEVICES AND METHOD
- Publication number 20240008818
- Publication date Jan 11, 2024
- Vactronix Scientific, Inc.
- Scott P. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240014087
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- In Sup SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230386953
- Publication date Nov 30, 2023
- Mitsubishi Electric Corporation
- Takashi TSUBAKIDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, TEST STRUCTURE, MANUFACTURING METHOD AND T...
- Publication number 20230378064
- Publication date Nov 23, 2023
- Changxin Memory Technologies, Inc.
- Deyuan XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan Out Method Utilizing a Filler-Free Insulating Material
- Publication number 20230326822
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW CEILING TEMPERATURE HOMOPOLYMERS AS SACRIFICIAL PROTECTION LAYE...
- Publication number 20230295412
- Publication date Sep 21, 2023
- LAM RESEARCH CORPORATION
- Stephen M. SIRARD
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Porogen Bonded Gap Filling Material In Semiconductor Manufacturing
- Publication number 20230299003
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS

Coating or filling in grooves made in the semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with a dielectric between portions

Fan-out semiconductor packages

Interconnect structures

Semiconductor device including groove in termination region

Semiconductor package and methods of manufacturing a semiconductor...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method of forming the same

Package structure and method for forming the same

Methods of forming packaged semiconductor devices and leadframes fo...

Passivation scheme for pad openings and trenches

Porogen bonded gap filling material in semiconductor manufacturing

Integrated circuit medical devices and method

Semiconductor structure and manufacturing method thereof

Apparatus having a functional structure delimited by a frame struct...

Semiconductor package

Electronic apparatus

Package structure

Unit specific variable or adaptive metal fill and system and method...

Protection structures in semiconductor chips and methods for formin...

Method of manufacturing electronic devices with a cap and molding

Chip component and method of manufacturing the same

Interconnect structures

Integrated fan out method utilizing a filler-free insulating material

Integrated circuit medical devices and method

Semiconductor device assembly with embossed solder mask having non-...

Semiconductor die package with warpage management and process for f...

Electronic package with multiple electronic components spaced apart...

Porogen bonded gap filling material in semiconductor manufacturing

Disaggregated die interconnection with on-silicon cavity bridge

Sawing underfill in packaging processes

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

METHOD OF MAKING INTEGRATED INTEGRATED CIRCUIT MEDICAL DEVICES

INTERCONNECT STRUCTURES

SEMICONDUCTOR DEVICE WITH PROTECTIVE STRUCTURE AND METHOD OF MANUFA...

SEMICONDUCTOR DEVICE

THERMALLY REGULATED SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

LAMINATED STRUCTURE AND SEMICONDUCTOR ELEMENT

SEMICONDUCTOR DEVICE WITH CAPPING LAYER AND METHOD FOR FABRICATING...

SEMICONDUCTOR DEVICE WITH CAPPING LAYER

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME, MEMORY, AND...

METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES AND LEADFRAMES FO...

PASSIVATION SCHEME FOR PAD OPENINGS AND TRENCHES

SEMICONDUCTOR DEVICE, ELECTRIC POWER CONVERSION DEVICE, AND METHOD...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

SEAL RING STRUCTURES

UNIT SPECIFIC VARIABLE OR ADAPTIVE METAL FILL AND SYSTEM AND METHOD...

SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR DEVICES

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE ASSEMBLIES WITH COPLANAR INTERCONNECT STRUCTUR...

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

INTERCONNECT STRUCTURES

INTEGRATED CIRCUIT MEDICAL DEVICES AND METHOD

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE, TEST STRUCTURE, MANUFACTURING METHOD AND T...

Integrated Fan Out Method Utilizing a Filler-Free Insulating Material

LOW CEILING TEMPERATURE HOMOPOLYMERS AS SACRIFICIAL PROTECTION LAYE...

Porogen Bonded Gap Filling Material In Semiconductor Manufacturing