Coating or filling in grooves made in the semiconductor body

Industry

CPC
H01L23/3178

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/3178Coating or filling in grooves made in the semiconductor body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,908,835
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus having a functional structure delimited by a frame struct...
- Patent number 11,908,763
- Issue date Feb 20, 2024
- Infineon Technologies AG
- Prashanth Makaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,901,269
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Seongchan Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus
- Patent number 11,817,362
- Issue date Nov 14, 2023
- Advanced Semiconductor Engineering, Inc.
- Pang Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,798,898
- Issue date Oct 24, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiao-Wen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unit specific variable or adaptive metal fill and system and method...
- Patent number 11,791,207
- Issue date Oct 17, 2023
- Deca Technologies USA, Inc.
- David Ryan Bartling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protection structures in semiconductor chips and methods for formin...
- Patent number 11,791,229
- Issue date Oct 17, 2023
- Yangtze Memory Technologies Co., Ltd.
- Jialan He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing electronic devices with a cap and molding
- Patent number 11,776,860
- Issue date Oct 3, 2023
- Seiko Epson Corporation
- Masataka Kazuno
- G01 - MEASURING TESTING
Information Patent Grant
Chip component and method of manufacturing the same
- Patent number 11,769,705
- Issue date Sep 26, 2023
- Rohm Co., Ltd.
- Katsuya Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures
- Patent number 11,756,880
- Issue date Sep 12, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan out method utilizing a filler-free insulating material
- Patent number 11,721,603
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit medical devices and method
- Patent number 11,701,059
- Issue date Jul 18, 2023
- Vactronix Scientific, LLC.
- Scott P. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with embossed solder mask having non-...
- Patent number 11,688,706
- Issue date Jun 27, 2023
- Micron Technology, Inc.
- Jungbae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package with warpage management and process for f...
- Patent number 11,676,876
- Issue date Jun 13, 2023
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with multiple electronic components spaced apart...
- Patent number 11,676,877
- Issue date Jun 13, 2023
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porogen bonded gap filling material in semiconductor manufacturing
- Patent number 11,658,120
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disaggregated die interconnection with on-silicon cavity bridge
- Patent number 11,652,057
- Issue date May 16, 2023
- Intel Corporation
- Khang Choong Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sawing underfill in packaging processes
- Patent number 11,637,086
- Issue date Apr 25, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sawing underfill in packaging processes
- Patent number 11,631,654
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Wei Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a dielectric between portions
- Patent number 11,581,232
- Issue date Feb 14, 2023
- STMicroelectronics Pte Ltd
- Jing-En Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor packages
- Patent number 11,574,868
- Issue date Feb 7, 2023
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package structure and method for fabricating t...
- Patent number 11,495,510
- Issue date Nov 8, 2022
- United Microelectronics Corp.
- Yu-Yuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for gapfill in high aspect ratio structures
- Patent number 11,488,856
- Issue date Nov 1, 2022
- Applied Materials, Inc.
- Pramit Manna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation scheme for pad openings and trenches
- Patent number 11,444,046
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Hong Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,424,220
- Issue date Aug 23, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method for manufacturing the same
- Patent number 11,411,073
- Issue date Aug 9, 2022
- Advanced Semiconductor Engineering, Inc.
- Shao Hsuan Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with multiple electronic components spaced apart...
- Patent number 11,398,413
- Issue date Jul 26, 2022
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating structure of high electron mobility transistor and manuf...
- Patent number 11,380,786
- Issue date Jul 5, 2022
- United Microelectronics Corp.
- Chun-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module embedded in a mold compounded with an op...
- Patent number 11,362,008
- Issue date Jun 14, 2022
- Hitachi Energy Switzerland AG
- Dominik Trüssel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit medical devices and method
- Patent number 11,291,412
- Issue date Apr 5, 2022
- Vactronix Scientific, LLC.
- Scott P. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES WITH COPLANAR INTERCONNECT STRUCTUR...
- Publication number 20240071914
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Thiagarajan Raman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240055371
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Der-Chyang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES
- Publication number 20240047344
- Publication date Feb 8, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT MEDICAL DEVICES AND METHOD
- Publication number 20240008818
- Publication date Jan 11, 2024
- Vactronix Scientific, Inc.
- Scott P. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240014087
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- In Sup SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230386953
- Publication date Nov 30, 2023
- Mitsubishi Electric Corporation
- Takashi TSUBAKIDANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, TEST STRUCTURE, MANUFACTURING METHOD AND T...
- Publication number 20230378064
- Publication date Nov 23, 2023
- Changxin Memory Technologies, Inc.
- Deyuan XIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Fan Out Method Utilizing a Filler-Free Insulating Material
- Publication number 20230326822
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW CEILING TEMPERATURE HOMOPOLYMERS AS SACRIFICIAL PROTECTION LAYE...
- Publication number 20230295412
- Publication date Sep 21, 2023
- LAM RESEARCH CORPORATION
- Stephen M. SIRARD
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Porogen Bonded Gap Filling Material In Semiconductor Manufacturing
- Publication number 20230299003
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Jiun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER AND METHOD OF MAKING, AND SEMICONDUCTOR DEVICE
- Publication number 20230230936
- Publication date Jul 20, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- PING-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELEMENT PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20230223310
- Publication date Jul 13, 2023
- DENSO CORPORATION
- Yoshihiro INUTSUKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A DIELECTRIC BETWEEN PORTIONS
- Publication number 20230197545
- Publication date Jun 22, 2023
- STMicroelectronics Pte Ltd
- Jing-En LUAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLVENT ANNEALING OF AN ORGANIC PLANARIZATION LAYER
- Publication number 20230197437
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Jing Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF A RECONSTITUTED CIRCUIT DEVICE USING FLOW OF A MATERIA...
- Publication number 20230197551
- Publication date Jun 22, 2023
- Intel Corporation
- OMKAR KARHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ANCHORING ELEMENT OF A SIC-BASED ELECTRO...
- Publication number 20230170271
- Publication date Jun 1, 2023
- STMicroelectronics S.r.l.
- Valeria PUGLISI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGES
- Publication number 20230163070
- Publication date May 25, 2023
- Samsung Electronics Co., Ltd.
- Joonsung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230126003
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES AND LEADFRAMES FO...
- Publication number 20230117260
- Publication date Apr 20, 2023
- Wolfspeed, Inc.
- Soon Lee Liew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGE WITH DELAMINATION MITIGATION
- Publication number 20230106642
- Publication date Apr 6, 2023
- Bernd Schmoelzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230105626
- Publication date Apr 6, 2023
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Koji ITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20230097299
- Publication date Mar 30, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAM SURROUNDING A DIE ON A SUBSTRATE
- Publication number 20230086920
- Publication date Mar 23, 2023
- Intel Corporation
- Liang HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230066598
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIT SPECIFIC VARIABLE OR ADAPTIVE METAL FILL AND SYSTEM AND METHOD...
- Publication number 20230047504
- Publication date Feb 16, 2023
- Deca Technologies USA, Inc.
- David Ryan Bartling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL STRUCTURES INCLUDING PASSIVATION STRUCTURES
- Publication number 20230026785
- Publication date Jan 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20230017424
- Publication date Jan 19, 2023
- Advanced Semiconductor Engineering, Inc.
- Pang Yuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230011627
- Publication date Jan 12, 2023
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230011041
- Publication date Jan 12, 2023
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230009548
- Publication date Jan 12, 2023
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Soichiro Umeda
- H01 - BASIC ELECTRIC ELEMENTS

Coating or filling in grooves made in the semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure and manufacturing method thereof

Apparatus having a functional structure delimited by a frame struct...

Semiconductor package

Electronic apparatus

Package structure

Unit specific variable or adaptive metal fill and system and method...

Protection structures in semiconductor chips and methods for formin...

Method of manufacturing electronic devices with a cap and molding

Chip component and method of manufacturing the same

Interconnect structures

Integrated fan out method utilizing a filler-free insulating material

Integrated circuit medical devices and method

Semiconductor device assembly with embossed solder mask having non-...

Semiconductor die package with warpage management and process for f...

Electronic package with multiple electronic components spaced apart...

Porogen bonded gap filling material in semiconductor manufacturing

Disaggregated die interconnection with on-silicon cavity bridge

Sawing underfill in packaging processes

Sawing underfill in packaging processes

Semiconductor device with a dielectric between portions

Fan-out semiconductor packages

Semiconductor device package structure and method for fabricating t...

Methods for gapfill in high aspect ratio structures

Passivation scheme for pad openings and trenches

Semiconductor structure and manufacturing method thereof

Semiconductor package device and method for manufacturing the same

Electronic package with multiple electronic components spaced apart...

Insulating structure of high electron mobility transistor and manuf...

Power semiconductor module embedded in a mold compounded with an op...

Integrated circuit medical devices and method

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE ASSEMBLIES WITH COPLANAR INTERCONNECT STRUCTUR...

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

INTERCONNECT STRUCTURES

INTEGRATED CIRCUIT MEDICAL DEVICES AND METHOD

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE, TEST STRUCTURE, MANUFACTURING METHOD AND T...

Integrated Fan Out Method Utilizing a Filler-Free Insulating Material

LOW CEILING TEMPERATURE HOMOPOLYMERS AS SACRIFICIAL PROTECTION LAYE...

Porogen Bonded Gap Filling Material In Semiconductor Manufacturing

WAFER AND METHOD OF MAKING, AND SEMICONDUCTOR DEVICE

ELEMENT PACKAGE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH A DIELECTRIC BETWEEN PORTIONS

SOLVENT ANNEALING OF AN ORGANIC PLANARIZATION LAYER

FORMATION OF A RECONSTITUTED CIRCUIT DEVICE USING FLOW OF A MATERIA...

METHOD OF MANUFACTURING AN ANCHORING ELEMENT OF A SIC-BASED ELECTRO...

FAN-OUT SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHODS OF FORMING PACKAGED SEMICONDUCTOR DEVICES AND LEADFRAMES FO...

EMBEDDED PACKAGE WITH DELAMINATION MITIGATION

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC PACKAGE

DAM SURROUNDING A DIE ON A SUBSTRATE

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

UNIT SPECIFIC VARIABLE OR ADAPTIVE METAL FILL AND SYSTEM AND METHOD...

SEAL STRUCTURES INCLUDING PASSIVATION STRUCTURES

ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE