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Coating over pads

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  • H05K2201/099
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/099Coating over pads
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    DISPLAY DEVICE
    • Publication number 20250056965
    • Publication date Feb 13, 2025
    • Sharp Kabushiki Kaisha
    • TOHRU OKABE
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    FIELD PROGRAMMABLE SOLDER BALL GRID ARRAY WITH EMBEDDED CONTROL SYS...
    • Publication number 20250048561
    • Publication date Feb 6, 2025
    • Tesla, Inc.
    • Vijaykumar KRITHIVASAN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR ESTABLISHING AN ELECTRICAL CONNECTION AND/OR COMMUNICATI...
    • Publication number 20250008664
    • Publication date Jan 2, 2025
    • SIEMENS AKTIENGESELLSCHAFT
    • Jens JÄHNICKE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC COMPONENT
    • Publication number 20240431024
    • Publication date Dec 26, 2024
    • Murata Manufacturing Co., Ltd.
    • Hirofumi OIE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DESIGN OF A RECYCLABLE ELECTRONIC DEVICE
    • Publication number 20240431037
    • Publication date Dec 26, 2024
    • NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
    • Stephan HARKEMA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING...
    • Publication number 20240404978
    • Publication date Dec 5, 2024
    • Shinko Electric Industries Co., Ltd.
    • Masaya Takizawa
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    • Publication number 20240397633
    • Publication date Nov 28, 2024
    • TONG HSING ELECTRONIC INDUSTRIES, LTD.
    • YU-HSIANG LIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DISPLAY DEVICE AND METHOD OF PROVIDING THE SAME
    • Publication number 20240373667
    • Publication date Nov 7, 2024
    • SAMSUNG DISPLAY CO., LTD.
    • DAEHONG KIM
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    WIRING BOARD
    • Publication number 20240332772
    • Publication date Oct 3, 2024
    • Shinko Electric Industries Co., Ltd.
    • Hiroshi TANEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Ultra-Thin Sandwich Component
    • Publication number 20240314928
    • Publication date Sep 19, 2024
    • KYOCERA AVX Components Corporation
    • Cory Nelson
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Printed Circuit Board And Method For Soldering A Chip Housing In A...
    • Publication number 20240292514
    • Publication date Aug 29, 2024
    • LISA DRAXLMAIER GMBH
    • Andreas Brinkmann
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Component Carrier For Waveguide Applications
    • Publication number 20240292518
    • Publication date Aug 29, 2024
    • AT&S Austria Technologie & Systemtechnik AG
    • Heinrich Trischler
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    INFORMATION HANDLING SYSTEMS WITH A FLEXIBLE PRINTED CIRCUIT TENSIO...
    • Publication number 20240292542
    • Publication date Aug 29, 2024
    • Dell Products L.P.
    • Chris A. Torres
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD, ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME, AND...
    • Publication number 20240276640
    • Publication date Aug 15, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Young-Gon Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20240268034
    • Publication date Aug 8, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Jesang Park
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR PRODUCING WIRING CIRCUIT BOARD ASSEMBLY SHEET
    • Publication number 20240260173
    • Publication date Aug 1, 2024
    • Nitto Denko Corporation
    • Yusaku TAMAKI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING BOARD
    • Publication number 20240260187
    • Publication date Aug 1, 2024
    • Shinko Electric Industries Co., Ltd.
    • Hiroshi YOKOTA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD ASSEMBLY SHEET
    • Publication number 20240244742
    • Publication date Jul 18, 2024
    • Nitto Denko Corporation
    • Kenya TAKIMOTO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ASSEMBLY SHEET
    • Publication number 20240244756
    • Publication date Jul 18, 2024
    • Nitto Denko Corporation
    • Chihiro WATANABE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...
    • Publication number 20240234443
    • Publication date Jul 11, 2024
    • SAMSUNG DISPLAY CO., LTD.
    • Dae Geun LEE
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    FASTENER AND SEALANT
    • Publication number 20240224427
    • Publication date Jul 4, 2024
    • LEAR CORPORATION
    • Antoni PUJOL
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20240224414
    • Publication date Jul 4, 2024
    • NIKO SEMICONDUCTOR CO., LTD.
    • CHUNG-MING LENG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
    • Publication number 20240215159
    • Publication date Jun 27, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Sang-min Lee
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240206068
    • Publication date Jun 20, 2024
    • Samsung Electronics Co., Ltd.
    • Yang LIU
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MULTILAYER SUBSTRATE MANUFACTURING METHOD AND WIRING SUBSTRATE
    • Publication number 20240196530
    • Publication date Jun 13, 2024
    • Mitsui Mining and Smelting Co., Ltd.
    • Yukiko KITABATAKE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240164026
    • Publication date May 16, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Jung Soo KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRING CIRCUIT BOARD
    • Publication number 20240164017
    • Publication date May 16, 2024
    • Nitto Denko Corporation
    • Hideki MATSUI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONTROL BOARD, CONTROL APPARATUS AND METHOD FOR SECURITY ENHANCEMEN...
    • Publication number 20240164011
    • Publication date May 16, 2024
    • HL KLEMOVE CORP.
    • Minsu HAN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD FOR FORMING FUNCTIONAL LAYER, METHOD FOR MANUFACTURING ELECT...
    • Publication number 20240155769
    • Publication date May 9, 2024
    • RICOH COMPANY, LTD.
    • Yukihiro WAKABAYASHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRINTED CIRCUIT BOARD
    • Publication number 20240114620
    • Publication date Apr 4, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Min LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR