Coating over pads

Industry

CPC
H05K2201/099

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/099Coating over pads

Industries

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board including conductive pad and electric device...
- Patent number 12,232,259
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Bongsoo Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and method of fabricating the same
- Patent number 12,232,273
- Issue date Feb 18, 2025
- LG Innotek Co., Ltd
- Yun Mi Bae
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Printed circuit board
- Patent number 12,224,235
- Issue date Feb 11, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chan Hoon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and electronic device
- Patent number 12,219,712
- Issue date Feb 4, 2025
- Canon Kabushiki Kaisha
- Noritake Tsuboi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic device including high-frequency transmission circuit
- Patent number 12,218,410
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Han-Min Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel including mesh blocking portion
- Patent number 12,207,527
- Issue date Jan 21, 2025
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Qinzun Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Droplet actuator fabrication apparatus, systems, and related methods
- Patent number 12,201,980
- Issue date Jan 21, 2025
- Abbott Laboratories
- Andrew Fischer
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Display device including dam and separation walls
- Patent number 12,200,957
- Issue date Jan 14, 2025
- Sharp Kabushiki Kaisha
- Takashi Ochi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display device including valley separated circuit portions
- Patent number 12,200,955
- Issue date Jan 14, 2025
- Samsung Display Co., Ltd.
- Kiho Bang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Circuit assembly and electrical junction box
- Patent number 12,184,052
- Issue date Dec 31, 2024
- Sumitomo Wiring Systems, Ltd.
- Shinya Hamano
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Modular electronic prototyping platforms
- Patent number 12,177,969
- Issue date Dec 24, 2024
- Microsoft Technology Licensing, LLC
- Stephen Edward Hodges
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display device including separation wall having canopy-shaped metal...
- Patent number 12,167,624
- Issue date Dec 10, 2024
- SHARP KABUSHIKI KAISHA
- Tohru Okabe
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible circuit board with thermally conductive connection to a he...
- Patent number 12,127,329
- Issue date Oct 22, 2024
- HELLA GMBH & CO. KGAA
- Dirk Bösch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed board having improved recognition accuracy
- Patent number 12,108,525
- Issue date Oct 1, 2024
- Yazaki Corporation
- Hidehiko Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including printed circuit board
- Patent number 12,101,883
- Issue date Sep 24, 2024
- Samsung Electronics Co., Ltd.
- Kijung Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reciprocal PCB manufacturing process
- Patent number 12,096,566
- Issue date Sep 17, 2024
- Intel Corporation
- Tyler Leuten
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lighting arrangement comprising a substrate for light emitting elem...
- Patent number 12,092,301
- Issue date Sep 17, 2024
- SIGNIFY HOLDING, B.V.
- Rifat Ata Mustafa Hikmet
- F21 - LIGHTING
Information Patent Grant
Flexible display apparatus including monitoring and buffering banks
- Patent number 12,082,452
- Issue date Sep 3, 2024
- Samsung Display Co., Ltd.
- Yujin Jeon
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Display device including dam and groove structure in non-display area
- Patent number 12,075,647
- Issue date Aug 27, 2024
- Samsung Display Co., Ltd.
- Daehong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electromagnetic wave transmission board comprising an inner board w...
- Patent number 12,074,357
- Issue date Aug 27, 2024
- BOARDTEK ELECTRONICS CORPORATION
- Chung-Hsing Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device including compensation layer
- Patent number 12,058,885
- Issue date Aug 6, 2024
- Samsung Display Co., Ltd.
- Taekyung Yim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display device including resin filled dam spaces
- Patent number 12,048,185
- Issue date Jul 23, 2024
- Japan Display Inc.
- Hiroki Ohara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic control unit
- Patent number 12,018,710
- Issue date Jun 25, 2024
- Hitachi Astemo, Ltd.
- Kenta Yakuzawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Display device including corner display having cutouts and dams
- Patent number 12,016,195
- Issue date Jun 18, 2024
- Samsung Display Co., Ltd.
- Hye Min Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High-frequency circuit including a circuit board and a waveguide st...
- Patent number 12,010,790
- Issue date Jun 11, 2024
- Robert Bosch GmbH
- Christian Hollaender
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a three-dimensional electronic module havin...
- Patent number 11,974,399
- Issue date Apr 30, 2024
- Yuriy Borisovich Sokolov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Array substrate and method of mounting integrated circuit using the...
- Patent number 11,967,597
- Issue date Apr 23, 2024
- Samsung Display Co., Ltd.
- Dae Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and disk device
- Patent number 11,968,781
- Issue date Apr 23, 2024
- Kabushiki Kaisha Toshiba
- Kazuyoshi Akutsu
- G11 - INFORMATION STORAGE
Information Patent Grant
Organic light emitting display device including dam structure and a...
- Patent number 11,968,860
- Issue date Apr 23, 2024
- LG Display Co., Ltd.
- Dongjin Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Miniaturization of control boards with flexibility in desposition o...
- Patent number 11,955,906
- Issue date Apr 9, 2024
- AISIN CORPORATION
- Yoshinobu Ito
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250107008
- Publication date Mar 27, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Hyun Hu Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD WITH EMBEDDED OPTICAL WAVEGUIDE STRU...
- Publication number 20250106987
- Publication date Mar 27, 2025
- CYNTEC CO., LTD.
- Chia-Fu Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20250098060
- Publication date Mar 20, 2025
- AT&S (Chongqing) Company Limited
- Lei Tang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY DEVICE
- Publication number 20250098404
- Publication date Mar 20, 2025
- SAMSUNG DISPLAY CO., LTD.
- Kiho Bang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICAT...
- Publication number 20250089174
- Publication date Mar 13, 2025
- International Business Machines Corporation
- Hongqing ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20250056965
- Publication date Feb 13, 2025
- Sharp Kabushiki Kaisha
- TOHRU OKABE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FIELD PROGRAMMABLE SOLDER BALL GRID ARRAY WITH EMBEDDED CONTROL SYS...
- Publication number 20250048561
- Publication date Feb 6, 2025
- Tesla, Inc.
- Vijaykumar KRITHIVASAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR ESTABLISHING AN ELECTRICAL CONNECTION AND/OR COMMUNICATI...
- Publication number 20250008664
- Publication date Jan 2, 2025
- SIEMENS AKTIENGESELLSCHAFT
- Jens JÄHNICKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20240431024
- Publication date Dec 26, 2024
- Murata Manufacturing Co., Ltd.
- Hirofumi OIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DESIGN OF A RECYCLABLE ELECTRONIC DEVICE
- Publication number 20240431037
- Publication date Dec 26, 2024
- NEDERLANDSE ORGANISATIE VOOR TOEGEPAST- NATUURWETENSCHAPPELIJK ONDERZOEK TNO
- Stephan HARKEMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING...
- Publication number 20240404978
- Publication date Dec 5, 2024
- Shinko Electric Industries Co., Ltd.
- Masaya Takizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240397633
- Publication date Nov 28, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-HSIANG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD OF PROVIDING THE SAME
- Publication number 20240373667
- Publication date Nov 7, 2024
- SAMSUNG DISPLAY CO., LTD.
- DAEHONG KIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WIRING BOARD
- Publication number 20240332772
- Publication date Oct 3, 2024
- Shinko Electric Industries Co., Ltd.
- Hiroshi TANEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-Thin Sandwich Component
- Publication number 20240314928
- Publication date Sep 19, 2024
- KYOCERA AVX Components Corporation
- Cory Nelson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Board And Method For Soldering A Chip Housing In A...
- Publication number 20240292514
- Publication date Aug 29, 2024
- LISA DRAXLMAIER GMBH
- Andreas Brinkmann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier For Waveguide Applications
- Publication number 20240292518
- Publication date Aug 29, 2024
- AT&S Austria Technologie & Systemtechnik AG
- Heinrich Trischler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INFORMATION HANDLING SYSTEMS WITH A FLEXIBLE PRINTED CIRCUIT TENSIO...
- Publication number 20240292542
- Publication date Aug 29, 2024
- Dell Products L.P.
- Chris A. Torres
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME, AND...
- Publication number 20240276640
- Publication date Aug 15, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Young-Gon Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240268034
- Publication date Aug 8, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Jesang Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD ASSEMBLY SHEET
- Publication number 20240260173
- Publication date Aug 1, 2024
- Nitto Denko Corporation
- Yusaku TAMAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20240260187
- Publication date Aug 1, 2024
- Shinko Electric Industries Co., Ltd.
- Hiroshi YOKOTA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD ASSEMBLY SHEET
- Publication number 20240244742
- Publication date Jul 18, 2024
- Nitto Denko Corporation
- Kenya TAKIMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLY SHEET
- Publication number 20240244756
- Publication date Jul 18, 2024
- Nitto Denko Corporation
- Chihiro WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...
- Publication number 20240234443
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- Dae Geun LEE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
FASTENER AND SEALANT
- Publication number 20240224427
- Publication date Jul 4, 2024
- LEAR CORPORATION
- Antoni PUJOL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20240224414
- Publication date Jul 4, 2024
- NIKO SEMICONDUCTOR CO., LTD.
- CHUNG-MING LENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240215159
- Publication date Jun 27, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Sang-min Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240206068
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Yang LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE MANUFACTURING METHOD AND WIRING SUBSTRATE
- Publication number 20240196530
- Publication date Jun 13, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Yukiko KITABATAKE
- H01 - BASIC ELECTRIC ELEMENTS

Coating over pads

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed circuit board including conductive pad and electric device...

Printed circuit board and method of fabricating the same

Printed circuit board

Printed circuit board and electronic device

Electronic device including high-frequency transmission circuit

Display panel including mesh blocking portion

Droplet actuator fabrication apparatus, systems, and related methods

Display device including dam and separation walls

Display device including valley separated circuit portions

Circuit assembly and electrical junction box

Modular electronic prototyping platforms

Display device including separation wall having canopy-shaped metal...

Flexible circuit board with thermally conductive connection to a he...

Flexible printed board having improved recognition accuracy

Electronic device including printed circuit board

Reciprocal PCB manufacturing process

Lighting arrangement comprising a substrate for light emitting elem...

Flexible display apparatus including monitoring and buffering banks

Display device including dam and groove structure in non-display area

Electromagnetic wave transmission board comprising an inner board w...

Display device including compensation layer

Display device including resin filled dam spaces

Electronic control unit

Display device including corner display having cutouts and dams

High-frequency circuit including a circuit board and a waveguide st...

Method of manufacturing a three-dimensional electronic module havin...

Array substrate and method of mounting integrated circuit using the...

Printed circuit board and disk device

Organic light emitting display device including dam structure and a...

Miniaturization of control boards with flexibility in desposition o...

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD

FLEXIBLE PRINTED CIRCUIT BOARD WITH EMBEDDED OPTICAL WAVEGUIDE STRU...

Component Carrier and Method of Manufacturing the Same

DISPLAY DEVICE

GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICAT...

DISPLAY DEVICE

FIELD PROGRAMMABLE SOLDER BALL GRID ARRAY WITH EMBEDDED CONTROL SYS...

METHOD FOR ESTABLISHING AN ELECTRICAL CONNECTION AND/OR COMMUNICATI...

ELECTRONIC COMPONENT

DESIGN OF A RECYCLABLE ELECTRONIC DEVICE

WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING...

SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

DISPLAY DEVICE AND METHOD OF PROVIDING THE SAME

WIRING BOARD

Ultra-Thin Sandwich Component

Printed Circuit Board And Method For Soldering A Chip Housing In A...

Component Carrier For Waveguide Applications

INFORMATION HANDLING SYSTEMS WITH A FLEXIBLE PRINTED CIRCUIT TENSIO...

CIRCUIT BOARD, ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME, AND...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

METHOD FOR PRODUCING WIRING CIRCUIT BOARD ASSEMBLY SHEET

WIRING BOARD

WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD ASSEMBLY SHEET

ASSEMBLY SHEET

ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...

FASTENER AND SEALANT

CIRCUIT BOARD

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD

MULTILAYER SUBSTRATE MANUFACTURING METHOD AND WIRING SUBSTRATE