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  • CPC
  • H01L2224/3754
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/3754Coating
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor device
    • Patent number 10,892,218
    • Issue date Jan 12, 2021
    • Rohm Co., Ltd.
    • Yoshihisa Tsukamoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package structure
    • Patent number 10,672,677
    • Issue date Jun 2, 2020
    • Industrial Technology Research Institute
    • Jing-Yao Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Light emitting apparatus, illumination apparatus and display apparatus
    • Patent number 10,490,533
    • Issue date Nov 26, 2019
    • Sony Corporation
    • Naoki Hirao
    • G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
  • Information Patent Grant

    Semiconductor device
    • Patent number 10,490,494
    • Issue date Nov 26, 2019
    • Rohm Co., Ltd.
    • Yoshihisa Tsukamoto
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Grant

    Laser welding method
    • Patent number 10,442,035
    • Issue date Oct 15, 2019
    • Fuji Electric Co., Ltd.
    • Yuta Tamai
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Light emitting apparatus, illumination apparatus and display apparatus
    • Patent number 10,249,600
    • Issue date Apr 2, 2019
    • Sony Corporation
    • Naoki Hirao
    • G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
  • Information Patent Grant

    Semiconductor device
    • Patent number 10,192,820
    • Issue date Jan 29, 2019
    • Rohm Co., Ltd.
    • Yoshihisa Tsukamoto
    • H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
  • Information Patent Grant

    Power module
    • Patent number 10,181,445
    • Issue date Jan 15, 2019
    • Mitsubishi Electric Corporation
    • Akihisa Fukumoto
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Stack die package
    • Patent number 9,966,330
    • Issue date May 8, 2018
    • Vishay Siliconix
    • Kyle Terrill
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents