Collar structures

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H01L2224/02126

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/02126Collar structures

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip
- Patent number 11,798,906
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Jeong-gi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for forming the same
- Patent number 11,282,802
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 11,251,144
- Issue date Feb 15, 2022
- Samsung Electronics Co., Ltd.
- Jeong-gi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bump planarity control
- Patent number 11,145,612
- Issue date Oct 12, 2021
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 10,840,199
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Final passivation for wafer level warpage and ULK stress reduction
- Patent number 10,622,319
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Ekta Misra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 10,515,915
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,490,471
- Issue date Nov 26, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip
- Patent number 10,483,224
- Issue date Nov 19, 2019
- Samsung Electronics Co., Ltd.
- Jeong-gi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and method for forming the same
- Patent number 10,475,758
- Issue date Nov 12, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Hsien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,453,765
- Issue date Oct 22, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging for enhanced performance
- Patent number 10,418,297
- Issue date Sep 17, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pillar bump structure and manufacturing method therefor
- Patent number 10,312,208
- Issue date Jun 4, 2019
- Semiconductor Manufacturing International (Shanghai) Corporation
- Xingtao Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming connector pad structures, interconnect structure...
- Patent number 10,269,739
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad protection for harsh media applications
- Patent number 10,262,897
- Issue date Apr 16, 2019
- Melexis Technologies NV
- Appolonius Jacobus Van Der Wiel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of packaging substrate
- Patent number 10,192,838
- Issue date Jan 29, 2019
- Siliconware Precision Industries Co., Ltd.
- Chien-Lung Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures including carrier wafers and attached devi...
- Patent number 10,128,142
- Issue date Nov 13, 2018
- Micron Technology, Inc.
- Sharon N. Farrens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waterproof structure of pad, waterproof pad, and method for forming...
- Patent number 10,069,236
- Issue date Sep 4, 2018
- Huawei Technologies Co., Ltd.
- Jun Wang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer level package and method
- Patent number 10,026,707
- Issue date Jul 17, 2018
- Microchip Technology Incorportated
- George Chu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 9,922,928
- Issue date Mar 20, 2018
- Renesas Electronics Corporation
- Takashi Tonegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming bump structure with insu...
- Patent number 9,780,063
- Issue date Oct 3, 2017
- STATS ChipPAC Pte. Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated WLUF and SOD process
- Patent number 9,728,515
- Issue date Aug 8, 2017
- Intel Corporation
- Rubayat Mahmud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a dual UBM structure for...
- Patent number 9,711,438
- Issue date Jul 18, 2017
- STATS ChipPAC, Pte. Ltd.
- Li-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device and structure therefor
- Patent number 9,646,951
- Issue date May 9, 2017
- Semiconductor Components Industries, LLC
- Richard D. Moyers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,607,956
- Issue date Mar 28, 2017
- Renesas Electronics Corporation
- Masahiro Matsumoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor devices having through electrodes, methods of manufac...
- Patent number 9,595,499
- Issue date Mar 14, 2017
- SK Hynix Inc.
- Wan Choon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer for packaged chip
- Patent number 9,570,366
- Issue date Feb 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,406,628
- Issue date Aug 2, 2016
- Renesas Electronics Corporation
- Masahiro Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure with an interconnect level having a conduct...
- Patent number 9,397,054
- Issue date Jul 19, 2016
- GLOBALFOUNDRIES Inc.
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated WLUF and SOD process
- Patent number 9,349,698
- Issue date May 24, 2016
- Intel Corporation
- Rubayat Mahmud
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230275051
- Publication date Aug 31, 2023
- RENESAS ELECTRONICS CORPORATION
- Teruhiro KUWAJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESI...
- Publication number 20230036317
- Publication date Feb 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Heng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP
- Publication number 20220108962
- Publication date Apr 7, 2022
- Samsung Electronics Co., Ltd.
- Jeong-gi JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...
- Publication number 20200211931
- Publication date Jul 2, 2020
- RENESAS ELECTRONICS CORPORATION
- Masahiro MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING CONNECTOR PAD STRUCTURES, INTERCONNECT STRUCTURE...
- Publication number 20190244918
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Connector Pad Structures, Interconnect Structure...
- Publication number 20180211928
- Publication date Jul 26, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED WLUF AND SOD PROCESS
- Publication number 20160247774
- Publication date Aug 25, 2016
- Intel Corporation
- Rubayat Mahmud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Stress-Reduced Conductiv...
- Publication number 20140319695
- Publication date Oct 30, 2014
- STATS ChipPAC, Ltd.
- Ming-Che Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump Structure with Insu...
- Publication number 20140319680
- Publication date Oct 30, 2014
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140284790
- Publication date Sep 25, 2014
- RENESAS ELECTRONICS CORPORATION
- Masahiro Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Dual UBM Structure for...
- Publication number 20140264850
- Publication date Sep 18, 2014
- STATS ChipPAC, Ltd.
- Li-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING A GRAPHENE SHEET TO METAL CONTACT BUMPS OF...
- Publication number 20140166194
- Publication date Jun 19, 2014
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20140061887
- Publication date Mar 6, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Hayato OKUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...
- Publication number 20140054800
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad Sidewall Spacers and Method of Making Pad Sidewall Spacers
- Publication number 20140048958
- Publication date Feb 20, 2014
- INFINEON TECHNOLOGIES AG
- Johann Gatterbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Waterproof Structure of Pad, Waterproof Pad, and Method for Forming...
- Publication number 20140045372
- Publication date Feb 13, 2014
- Huawei Technologies Co., Ltd
- Jun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double Solid Metal Pad with Reduced Area
- Publication number 20140045327
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION LAYER FOR PACKAGED CHIP
- Publication number 20140014959
- Publication date Jan 16, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED WLUF AND SOD PROCESS
- Publication number 20140001631
- Publication date Jan 2, 2014
- Rubayat Mahmud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECTION STRUCTURES INCLUDING STRESS BUFFER LAYERS
- Publication number 20130334656
- Publication date Dec 19, 2013
- Samsung Electronics Co., Ltd.
- Jeonggi JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT
- Publication number 20130244418
- Publication date Sep 19, 2013
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20130241067
- Publication date Sep 19, 2013
- RENESAS ELECTRONICS CORPORATION
- Takeshi FURUSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor component that includes a protective structure
- Publication number 20130234311
- Publication date Sep 12, 2013
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION LAYER FOR PACKAGED CHIP
- Publication number 20130147032
- Publication date Jun 13, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shin-Puu JENG
- G01 - MEASURING TESTING
Information Patent Application
METAL PAD STRUCTURE FOR THICKNESS ENHANCEMENT OF POLYMER USED IN EL...
- Publication number 20130119534
- Publication date May 16, 2013
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for 3D Integrated Circuit Stacking
- Publication number 20130062766
- Publication date Mar 14, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Ming Ching
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE AND PROCESS OF MANUFACTURING THE SAME
- Publication number 20120319271
- Publication date Dec 20, 2012
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUFFER PAD IN SOLDER BUMP CONNECTIONS AND METHODS OF MANUFACTURE
- Publication number 20120280399
- Publication date Nov 8, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120220057
- Publication date Aug 30, 2012
- FUJITSU SEMICONDUCTOR LIMITED
- Wensheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump Structure with Insu...
- Publication number 20120217640
- Publication date Aug 30, 2012
- STATS ChipPAC, Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS

Collar structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor chip

Semiconductor device structure and method for forming the same

Semiconductor chip

Methods for bump planarity control

Methods of forming connector pad structures, interconnect structure...

Final passivation for wafer level warpage and ULK stress reduction

Methods of forming connector pad structures, interconnect structure...

Wafer-level packaging for enhanced performance

Semiconductor chip

Semiconductor device structure and method for forming the same

Wafer-level packaging for enhanced performance

Wafer-level packaging for enhanced performance

Copper pillar bump structure and manufacturing method therefor

Methods of forming connector pad structures, interconnect structure...

Bond pad protection for harsh media applications

Fabrication method of packaging substrate

Semiconductor structures including carrier wafers and attached devi...

Waterproof structure of pad, waterproof pad, and method for forming...

Wafer level package and method

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and method of forming bump structure with insu...

Integrated WLUF and SOD process

Semiconductor device and method of forming a dual UBM structure for...

Method of forming a semiconductor device and structure therefor

Semiconductor device and method of manufacturing the same

Semiconductor devices having through electrodes, methods of manufac...

Passivation layer for packaged chip

Semiconductor device and method of manufacturing the same

Semiconductor structure with an interconnect level having a conduct...

Integrated WLUF and SOD process

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESI...

SEMICONDUCTOR CHIP

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE INCLUDING INTERLAYER...

METHODS OF FORMING CONNECTOR PAD STRUCTURES, INTERCONNECT STRUCTURE...

Methods of Forming Connector Pad Structures, Interconnect Structure...

INTEGRATED WLUF AND SOD PROCESS

Semiconductor Device and Method of Forming Stress-Reduced Conductiv...

Semiconductor Device and Method of Forming Bump Structure with Insu...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device and Method of Forming a Dual UBM Structure for...

METHOD FOR TRANSFERRING A GRAPHENE SHEET TO METAL CONTACT BUMPS OF...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING A METAL PAD STRUCTURE OF A DIE, A METHOD F...

Pad Sidewall Spacers and Method of Making Pad Sidewall Spacers

Waterproof Structure of Pad, Waterproof Pad, and Method for Forming...

Double Solid Metal Pad with Reduced Area

PASSIVATION LAYER FOR PACKAGED CHIP

INTEGRATED WLUF AND SOD PROCESS

ELECTRICAL INTERCONNECTION STRUCTURES INCLUDING STRESS BUFFER LAYERS

METHOD OF MANUFACTURING A SEMICONDUCTOR COMPONENT

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Semiconductor component that includes a protective structure

PASSIVATION LAYER FOR PACKAGED CHIP

METAL PAD STRUCTURE FOR THICKNESS ENHANCEMENT OF POLYMER USED IN EL...

System and Method for 3D Integrated Circuit Stacking

BUMP STRUCTURE AND PROCESS OF MANUFACTURING THE SAME

BUFFER PAD IN SOLDER BUMP CONNECTIONS AND METHODS OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Device and Method of Forming Bump Structure with Insu...