Combinations of bonding methods provided for in at least two different groups from H01L2224/818 - H01L2224/81904

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81905Combinations of bonding methods provided for in at least two different groups from H01L2224/818 - H01L2224/81904

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for embedding semiconductor devices
- Patent number 11,538,699
- Issue date Dec 27, 2022
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin fluxed solder paste, and mount structure
- Patent number 10,440,834
- Issue date Oct 8, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hirohisa Hino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,691,676
- Issue date Jun 27, 2017
- SOCIONEXT INC.
- Takeshi Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Localized sealing of interconnect structures in small gaps
- Patent number 9,685,420
- Issue date Jun 20, 2017
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced metal-to-metal direct bonding
- Patent number 9,640,509
- Issue date May 2, 2017
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit constructions having through substrate vias and...
- Patent number 9,123,700
- Issue date Sep 1, 2015
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic element unit and reinforcing adhesive agent
- Patent number 8,686,299
- Issue date Apr 1, 2014
- Panasonic Corporation
- Koji Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure and method for manufacturing same
- Patent number 8,258,637
- Issue date Sep 4, 2012
- Hitachi, Ltd.
- Eiji Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Micro-Spring Chip Attachment Using Solder-Based Interconnect Struct...
- Publication number 20140374912
- Publication date Dec 25, 2014
- John C. Knights
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140027920
- Publication date Jan 30, 2014
- FUJITSU SEMICONDUCTOR LIMITED
- Takeshi Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Constructions Having Through Substrate Vias And...
- Publication number 20130175698
- Publication date Jul 11, 2013
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ENHANCING RELIABILITY OF WELDING SPOT OF CHIP, PRINTED C...
- Publication number 20130128485
- Publication date May 23, 2013
- HUAWEI DEVICE CO., LTD.
- David Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ELEMENT UNIT AND REINFORCING ADHESIVE AGENT
- Publication number 20120111617
- Publication date May 10, 2012
- PANASONIC CORPORATION
- Koji Motomura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor apparatus and the method of manufacturing the same
- Publication number 20120074563
- Publication date Mar 29, 2012
- Fuji Electric Co., Ltd.
- Yuji Iizuka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20110139856
- Publication date Jun 16, 2011
- Hitachi, Ltd.
- Eiji SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS, LOW-TEMPERATURE METAL-METAL COMPOSITE FLIP CHIP INTERCO...
- Publication number 20090242121
- Publication date Oct 1, 2009
- Daewoong Suh
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Combinations of bonding methods provided for in at least two different groups from H01L2224/818 - H01L2224/81904

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and apparatus for embedding semiconductor devices

Resin fluxed solder paste, and mount structure

Semiconductor device and method for manufacturing the same

Localized sealing of interconnect structures in small gaps

Advanced metal-to-metal direct bonding

Integrated circuit constructions having through substrate vias and...

Electronic element unit and reinforcing adhesive agent

Bonding structure and method for manufacturing same

Patents Applicationslast 30 patents

Micro-Spring Chip Attachment Using Solder-Based Interconnect Struct...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Integrated Circuit Constructions Having Through Substrate Vias And...

METHOD FOR ENHANCING RELIABILITY OF WELDING SPOT OF CHIP, PRINTED C...

ELECTRONIC ELEMENT UNIT AND REINFORCING ADHESIVE AGENT

Semiconductor apparatus and the method of manufacturing the same

BONDING STRUCTURE AND METHOD FOR MANUFACTURING SAME

LOW STRESS, LOW-TEMPERATURE METAL-METAL COMPOSITE FLIP CHIP INTERCO...