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Combinations of bonding methods provided for in at least two different groups from H01L2224/818 - H01L2224/81904
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H01L2224/81905
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ELECTRICITY
H01
Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/81905
Combinations of bonding methods provided for in at least two different groups from H01L2224/818 - H01L2224/81904
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Patents Grants
last 30 patents
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Patent Grant
Method and apparatus for embedding semiconductor devices
Patent number
11,538,699
Issue date
Dec 27, 2022
Rohinni, LLC
Cody Peterson
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resin fluxed solder paste, and mount structure
Patent number
10,440,834
Issue date
Oct 8, 2019
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
Hirohisa Hino
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and method for manufacturing the same
Patent number
9,691,676
Issue date
Jun 27, 2017
SOCIONEXT INC.
Takeshi Kodama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Localized sealing of interconnect structures in small gaps
Patent number
9,685,420
Issue date
Jun 20, 2017
Invensas Corporation
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Advanced metal-to-metal direct bonding
Patent number
9,640,509
Issue date
May 2, 2017
International Business Machines Corporation
Chih-Chao Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit constructions having through substrate vias and...
Patent number
9,123,700
Issue date
Sep 1, 2015
Micron Technology, Inc.
Jaspreet S. Gandhi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic element unit and reinforcing adhesive agent
Patent number
8,686,299
Issue date
Apr 1, 2014
Panasonic Corporation
Koji Motomura
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding structure and method for manufacturing same
Patent number
8,258,637
Issue date
Sep 4, 2012
Hitachi, Ltd.
Eiji Sakamoto
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Micro-Spring Chip Attachment Using Solder-Based Interconnect Struct...
Publication number
20140374912
Publication date
Dec 25, 2014
John C. Knights
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20140027920
Publication date
Jan 30, 2014
FUJITSU SEMICONDUCTOR LIMITED
Takeshi Kodama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Constructions Having Through Substrate Vias And...
Publication number
20130175698
Publication date
Jul 11, 2013
Jaspreet S. Gandhi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR ENHANCING RELIABILITY OF WELDING SPOT OF CHIP, PRINTED C...
Publication number
20130128485
Publication date
May 23, 2013
HUAWEI DEVICE CO., LTD.
David Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC ELEMENT UNIT AND REINFORCING ADHESIVE AGENT
Publication number
20120111617
Publication date
May 10, 2012
PANASONIC CORPORATION
Koji Motomura
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
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Patent Application
Semiconductor apparatus and the method of manufacturing the same
Publication number
20120074563
Publication date
Mar 29, 2012
Fuji Electric Co., Ltd.
Yuji Iizuka
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
BONDING STRUCTURE AND METHOD FOR MANUFACTURING SAME
Publication number
20110139856
Publication date
Jun 16, 2011
Hitachi, Ltd.
Eiji SAKAMOTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW STRESS, LOW-TEMPERATURE METAL-METAL COMPOSITE FLIP CHIP INTERCO...
Publication number
20090242121
Publication date
Oct 1, 2009
Daewoong Suh
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...