Combinations of different arrangements

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H01L2224/49177

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/49177Combinations of different arrangements

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package
- Patent number 11,830,798
- Issue date Nov 28, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,626,358
- Issue date Apr 11, 2023
- Fuji Electric Co., Ltd.
- Rikihiro Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,469,204
- Issue date Oct 11, 2022
- Sumitomo Electric Device Innovations, Inc.
- Akitada Kodama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,456,265
- Issue date Sep 27, 2022
- Renesas Electronics Corporation
- Takashi Tonegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrally-formed multiple-path power amplifier with on-die combini...
- Patent number 11,277,098
- Issue date Mar 15, 2022
- NXP USA, INC.
- Xavier Hue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including two or more chips mounted over wirin...
- Patent number 11,069,655
- Issue date Jul 20, 2021
- Micron Technology, Inc.
- Sensho Usami
- G11 - INFORMATION STORAGE
Information Patent Grant
High power cavity package for light emitters
- Patent number 10,971,892
- Issue date Apr 6, 2021
- II-VI DELAWARE, INC.
- Brent Stapleton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for hierarchical exposure of an integrated circ...
- Patent number 10,923,456
- Issue date Feb 16, 2021
- Cerebras Systems Inc.
- Jean-Philippe Fricker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN pin routing thru lead frame etching
- Patent number 10,872,785
- Issue date Dec 22, 2020
- Texas Instruments Incorporated
- Dolores Babaran Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor device provided with same
- Patent number 10,825,760
- Issue date Nov 3, 2020
- SOCIONEXT INC.
- Toshihiro Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,770,380
- Issue date Sep 8, 2020
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,573,584
- Issue date Feb 25, 2020
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with sealing portion to suppress connection co...
- Patent number 10,483,179
- Issue date Nov 19, 2019
- Fuji Electric Co., Ltd.
- Yoshihiro Yasuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN pin routing thru lead frame etching
- Patent number 10,361,098
- Issue date Jul 23, 2019
- Texas Instruments Incorporated
- Dolores Babaran Milo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal transmission apparatus including semiconductor chips and sig...
- Patent number 10,297,538
- Issue date May 21, 2019
- Panasonic Corporation
- Osamu Tabata
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,290,565
- Issue date May 14, 2019
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 10,163,764
- Issue date Dec 25, 2018
- Semiconductor Components Industries, LLC
- Chun-Li Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,109,611
- Issue date Oct 23, 2018
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging using wire bond wires in place of a redistrib...
- Patent number 10,008,469
- Issue date Jun 26, 2018
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage polymer dielectric capacitor isolation device
- Patent number 9,893,008
- Issue date Feb 13, 2018
- Texas Instruments Incorporated
- Thomas Dyer Bonifield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die and package jigsaw submount
- Patent number 9,831,144
- Issue date Nov 28, 2017
- QUBEICON LTD.
- Shimon Podval
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,831,212
- Issue date Nov 28, 2017
- Rohm Co., Ltd.
- Mamoru Yamagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package device having locking mechanism, and pr...
- Patent number 9,786,583
- Issue date Oct 10, 2017
- Alpha and Omega Semiconductor Incorporated
- Yan Xun Xue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method of manufacture
- Patent number 9,780,019
- Issue date Oct 3, 2017
- Semiconductor Components Industries, LLC
- Chun-Li Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,754,865
- Issue date Sep 5, 2017
- Renesas Electronics Corporation
- Takanori Yamashita
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device with integrated antenna
- Patent number 9,698,110
- Issue date Jul 4, 2017
- RENESAS ELECTRONICS CORPORATION
- Motoi Ishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 9,613,927
- Issue date Apr 4, 2017
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level packaging using wire bond wires in place of a redistrib...
- Patent number 9,502,372
- Issue date Nov 22, 2016
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stacked semiconductor chips and a r...
- Patent number 9,496,216
- Issue date Nov 15, 2016
- Samsung Electronics Co., Ltd.
- Sung-Hoon Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a manufacturing method thereof
- Patent number 9,396,971
- Issue date Jul 19, 2016
- Renesas Electronics Corporation
- Yukihiro Sato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240387495
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Minwoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240347499
- Publication date Oct 17, 2024
- Samsung Electronics Co., Ltd.
- Hongjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240088796
- Publication date Mar 14, 2024
- Fuji Electric Co., Ltd.
- Yuhei NISHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240071997
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Joonghyun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS
- Publication number 20240006193
- Publication date Jan 4, 2024
- SHINKAWA LTD.
- Hiroaki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RIBBON BONDING GROUND PLANE FOR RADIO FREQUENCY PERFORMANCE IMPROVE...
- Publication number 20230420405
- Publication date Dec 28, 2023
- Lumentum Operations LLC
- Flavio DELL'ORTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS
- Publication number 20230378128
- Publication date Nov 23, 2023
- Micron Technology, Inc.
- Seng Kim Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS
- Publication number 20230378129
- Publication date Nov 23, 2023
- Micron Technology, Inc.
- Chin Hui Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230369278
- Publication date Nov 16, 2023
- RENESAS ELECTRONICS CORPORATION
- Yasutaka NAKASHIBA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WINDOW BALL GRID ARRAY (WBGA) PACKAGE
- Publication number 20230361012
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE DRIVER PACKAGE FOR UNIFORM COUPLING TO DIFFERENTIAL SIGNAL BON...
- Publication number 20230138570
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Thomas Dyer BONIFIELD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20220302008
- Publication date Sep 22, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220028763
- Publication date Jan 27, 2022
- ROHM CO., LTD.
- Hiroaki MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210375734
- Publication date Dec 2, 2021
- Fuji Electric Co., Ltd.
- Rikihiro MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR HIERARCHICAL EXPOSURE OF AN INTEGRATED CIRC...
- Publication number 20210167037
- Publication date Jun 3, 2021
- Cerebras Systems Inc.
- Jean-Philippe Fricker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20200402967
- Publication date Dec 24, 2020
- Sharp Kabushiki Kaisha
- YASUHIRO YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200343207
- Publication date Oct 29, 2020
- RENESAS ELECTRONICS CORPORATION
- Takashi TONEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRALLY-FORMED MULTIPLE-PATH POWER AMPLIFIER WITH ON-DIE COMBINI...
- Publication number 20200186097
- Publication date Jun 11, 2020
- NXP USA, Inc.
- Xavier Hue
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20200161228
- Publication date May 21, 2020
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PIN ROUTING THRU LEAD FRAME ETCHING
- Publication number 20190348302
- Publication date Nov 14, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Dolores Babaran MILO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190229042
- Publication date Jul 25, 2019
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20190157193
- Publication date May 23, 2019
- Rohm Co., Ltd.
- Akihiro Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20180204779
- Publication date Jul 19, 2018
- Fuji Electric Co., Ltd.
- Yoshihiro YASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN PIN ROUTING THRU LEAD FRAME ETCHING
- Publication number 20180182642
- Publication date Jun 28, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Dolores Babaran MILO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180047698
- Publication date Feb 15, 2018
- Rohm Co., Ltd.
- Mamoru YAMAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
- Publication number 20180005927
- Publication date Jan 4, 2018
- Semiconductor Components Industries, LLC
- Chun-Li Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170323848
- Publication date Nov 9, 2017
- RENESAS ELECTRONICS CORPORATION
- Takanori Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGING USING WIRE BOND WIRES IN PLACE OF A REDISTRIB...
- Publication number 20160322326
- Publication date Nov 3, 2016
- Invensas Corporation
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE POLYMER DIELECTRIC CAPACITOR ISOLATION DEVICE
- Publication number 20160307840
- Publication date Oct 20, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Thomas Dyer BONIFIELD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140374890
- Publication date Dec 25, 2014
- Renesas Electronics Corporation
- Takanori Yamashita
- H01 - BASIC ELECTRIC ELEMENTS

Combinations of different arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package

Semiconductor device

Semiconductor device

Semiconductor device and method of manufacturing the same

Integrally-formed multiple-path power amplifier with on-die combini...

Semiconductor device including two or more chips mounted over wirin...

High power cavity package for light emitters

Systems and methods for hierarchical exposure of an integrated circ...

QFN pin routing thru lead frame etching

Semiconductor chip and semiconductor device provided with same

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device with sealing portion to suppress connection co...

QFN pin routing thru lead frame etching

Signal transmission apparatus including semiconductor chips and sig...

Semiconductor device and method for manufacturing semiconductor device

Semiconductor component and method of manufacture

Semiconductor device

Wafer-level packaging using wire bond wires in place of a redistrib...

High voltage polymer dielectric capacitor isolation device

Semiconductor die and package jigsaw submount

Semiconductor device

Power semiconductor package device having locking mechanism, and pr...

Semiconductor component and method of manufacture

Semiconductor device and method for manufacturing the same

Semiconductor device with integrated antenna

Semiconductor device and method for manufacturing semiconductor device

Wafer-level packaging using wire bond wires in place of a redistrib...

Semiconductor package including stacked semiconductor chips and a r...

Semiconductor device and a manufacturing method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS

RIBBON BONDING GROUND PLANE FOR RADIO FREQUENCY PERFORMANCE IMPROVE...

CROSS STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS

THROUGH STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS

SEMICONDUCTOR DEVICE

WINDOW BALL GRID ARRAY (WBGA) PACKAGE

GATE DRIVER PACKAGE FOR UNIFORM COUPLING TO DIFFERENTIAL SIGNAL BON...

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SYSTEMS AND METHODS FOR HIERARCHICAL EXPOSURE OF AN INTEGRATED CIRC...

DISPLAY DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

INTEGRALLY-FORMED MULTIPLE-PATH POWER AMPLIFIER WITH ON-DIE COMBINI...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

QFN PIN ROUTING THRU LEAD FRAME ETCHING

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

QFN PIN ROUTING THRU LEAD FRAME ETCHING

SEMICONDUCTOR DEVICE

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

WAFER-LEVEL PACKAGING USING WIRE BOND WIRES IN PLACE OF A REDISTRIB...

HIGH VOLTAGE POLYMER DIELECTRIC CAPACITOR ISOLATION DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME