Combined or convertible surface bonding means and/or assembly means

Industry

CPC
Y10T156/15

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Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T156/00Adhesive bonding and miscellaneous chemical manufacture

Current Industry

Y10T156/15Combined or convertible surface bonding means and/or assembly means

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and stack body manufacturing apparatus
- Patent number 10,583,641
- Issue date Mar 10, 2020
- Semiconductor Energy Laboratory Co., Ltd.
- Masakatsu Ohno
- B32 - LAYERED PRODUCTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,354,972
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Epitaxial lift off systems and methods
- Patent number 10,259,206
- Issue date Apr 16, 2019
- Alta Devices, Inc.
- Brian Brown
- B32 - LAYERED PRODUCTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 10,103,122
- Issue date Oct 16, 2018
- Taiwan Semiconductor Manufacturing Company
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recyclable surface covering and method and system for manufacturing...
- Patent number 10,099,452
- Issue date Oct 16, 2018
- Ecore International Inc.
- Arthur B. Dodge
- E04 - BUILDING
Information Patent Grant
Recyclable surface covering and method and system for manufacturing...
- Patent number 10,029,447
- Issue date Jul 24, 2018
- Ecore International Inc.
- Arthur B. Dodge
- E04 - BUILDING
Information Patent Grant
Bonding apparatus and stack body manufacturing apparatus
- Patent number 9,925,749
- Issue date Mar 27, 2018
- Semiconductor Energy Laboratory Co., Ltd.
- Masakatsu Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 9,748,198
- Issue date Aug 29, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for separating wafer from carrier
- Patent number 9,735,039
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid recirculation system for use in vapor phase particle producti...
- Patent number 9,719,727
- Issue date Aug 1, 2017
- SDCmaterials, Inc.
- Frederick P. Layman
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Highly turbulent quench chamber
- Patent number 9,599,405
- Issue date Mar 21, 2017
- SDCmaterials, Inc.
- Maximilian A. Biberger
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Devices with thinned wafer
- Patent number 9,428,381
- Issue date Aug 30, 2016
- Infineon Technologies AG
- Andre Brockmeier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device and method for elutriating and gluing wood chips
- Patent number 9,381,669
- Issue date Jul 5, 2016
- Kronoplus Technical AG
- Hannes Speidel
- B07 - SEPARATING SOLIDS FROM SOLIDS SORTING
Information Patent Grant
Epitaxial lift off systems and methods
- Patent number 9,381,731
- Issue date Jul 5, 2016
- Alta Devices, Inc.
- Brian Brown
- B32 - LAYERED PRODUCTS
Information Patent Grant
Collet cleaning method and die bonder using the same
- Patent number 9,318,361
- Issue date Apr 19, 2016
- FASFORD TECHNOLOGY CO., LTD.
- Yoshihide Ishii
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Flexible barrier composite fabrics via an adhered film process
- Patent number 9,222,611
- Issue date Dec 29, 2015
- Dartex Coatings, Inc.
- Thomas C. Colasanto
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Method and apparatus for making uniform and ultrasmall nanoparticles
- Patent number 9,216,398
- Issue date Dec 22, 2015
- SDCmaterials, Inc.
- Maximilian A. Biberger
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Spool-less, continuous bobbin assembly and method of use
- Patent number 9,200,396
- Issue date Dec 1, 2015
- Geoff McCue
- D05 - SEWING EMBROIDERING TUFTING
Information Patent Grant
Highly turbulent quench chamber
- Patent number 9,180,423
- Issue date Nov 10, 2015
- SDCmaterials, Inc.
- Maximilian A. Biberger
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
System for mounting objects to polymeric membranes
- Patent number 9,175,479
- Issue date Nov 3, 2015
- BWDT, LLC
- Joel A. Stanley
- E04 - BUILDING
Information Patent Grant
Gas delivery system with constant overpressure relative to ambient...
- Patent number 9,132,404
- Issue date Sep 15, 2015
- SDCmaterials, Inc.
- Fredrick P. Layman
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Recyclable surface covering and method and system for manufacturing...
- Patent number 9,096,045
- Issue date Aug 4, 2015
- ECORE INTERNTAIONAL INC.
- Arthur B. Dodge
- B32 - LAYERED PRODUCTS
Information Patent Grant
Hybrid bonding systems and methods for semiconductor wafers
- Patent number 9,048,283
- Issue date Jun 2, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
System for and method of introducing additives to biological materi...
- Patent number 8,945,219
- Issue date Feb 3, 2015
- SDCmaterials, Inc.
- Maximilian A. Biberger
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Fluid recirculation system for use in vapor phase particle producti...
- Patent number 8,906,316
- Issue date Dec 9, 2014
- SDCmaterials, Inc.
- Frederick P. Layman
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Plasma-arc vaporization chamber with wide bore
- Patent number 8,893,651
- Issue date Nov 25, 2014
- SDCmaterials, Inc.
- Maximilian A. Biberger
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Apparatus and method of separating wafer from carrier
- Patent number 8,834,662
- Issue date Sep 16, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling Hwang
- B32 - LAYERED PRODUCTS
Information Patent Grant
Reduction of edge chipping during wafer handling
- Patent number 8,807,184
- Issue date Aug 19, 2014
- International Business Machines Corporation
- Sarah H. Knickerbocker
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Prepreg manufacturing device
- Patent number 8,789,571
- Issue date Jul 29, 2014
- Arisawa Mfg. Co., Ltd.
- Akihiko Machii
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Reduction of edge chipping during wafer handling
- Patent number 8,753,460
- Issue date Jun 17, 2014
- International Business Machines Corporation
- Sarah H. Knickerbocker
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
RECYCLABLE SURFACE COVERING AND METHOD AND SYSTEM FOR MANUFACTURING...
- Publication number 20200254733
- Publication date Aug 13, 2020
- ECORE INTERNATIONAL INC.
- Arthur B. DODGE
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20190051628
- Publication date Feb 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND PROCESS FOR THE PRODUCTION OF PAPER WEB MATERIAL
- Publication number 20180133999
- Publication date May 17, 2018
- Futura S.P.A.
- Giovacchino GIURLANI
- B31 - MAKING ARTICLES OF PAPER OR CARDBOARD WORKING PAPER OR CARDBOARD
Information Patent Application
BONDING APPARATUS AND STACK BODY MANUFACTURING APPARATUS
- Publication number 20180072033
- Publication date Mar 15, 2018
- Semiconductor Energy Laboratory Co., Ltd.
- Masakatsu OHNO
- B32 - LAYERED PRODUCTS
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20170358551
- Publication date Dec 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Labeler
- Publication number 20140374028
- Publication date Dec 25, 2014
- KRONES AG
- Josef Scheck
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
APPARATUS FOR SEPARATING WAFER FROM CARRIER
- Publication number 20140360671
- Publication date Dec 11, 2014
- Chien Ling HWANG
- B32 - LAYERED PRODUCTS
Information Patent Application
FLEXIBLE BARRIER COMPOSITE FABRICS VIA AN ADHERED FILM PROCESS
- Publication number 20140261972
- Publication date Sep 18, 2014
- Dartex Coatings, Inc.
- Thomas C. Colasanto
- B32 - LAYERED PRODUCTS
Information Patent Application
EPITAXIAL LIFT OFF SYSTEMS AND METHODS
- Publication number 20140251547
- Publication date Sep 11, 2014
- ALTA DEVICES, INC.
- Brian BROWN
- B32 - LAYERED PRODUCTS
Information Patent Application
APPARATUS AND PROCESS FOR THE PRODUCTION OF PAPER WEB MATERIAL
- Publication number 20140251530
- Publication date Sep 11, 2014
- Giovacchino Giurlani
- B31 - MAKING ARTICLES OF PAPER OR CARDBOARD WORKING PAPER OR CARDBOARD
Information Patent Application
Collet Cleaning Method and Die Bonder Using the Same
- Publication number 20140251535
- Publication date Sep 11, 2014
- Hitachi High-Tech Instruments Co., Ltd.
- Yoshihide ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECYCLABLE SURFACE COVERING AND METHOD AND SYSTEM FOR MANUFACTURING...
- Publication number 20140251538
- Publication date Sep 11, 2014
- ECORE INTERNATIONAL INC.
- Arthur B. DODGE
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD AND APPARATUS FOR PRODUCING AN EASILY APPLIED SELF ADHESIVE...
- Publication number 20140246140
- Publication date Sep 4, 2014
- MALLETT MAGNETICS, LLC
- Shawn Mallett
- B32 - LAYERED PRODUCTS
Information Patent Application
SPOOL-LESS, CONTINUOUS BOBBIN ASSEMBLY AND METHOD OF USE
- Publication number 20140209234
- Publication date Jul 31, 2014
- Geoff McCue
- D05 - SEWING EMBROIDERING TUFTING
Information Patent Application
METHOD AND APPARATUS FOR MAKING UNIFORM AND ULTRASMALL NANOPARTICLES
- Publication number 20140209451
- Publication date Jul 31, 2014
- Maximilian A. BIBERGER
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
FLUID RECIRCULATION SYSTEM FOR USE IN VAPOR PHASE PARTICLE PRODUCTI...
- Publication number 20140151939
- Publication date Jun 5, 2014
- Frederick P. LAYMAN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
System for Mounting Objects to Polymeric Membranes
- Publication number 20140099157
- Publication date Apr 10, 2014
- Joel A. Stanley
- E04 - BUILDING
Information Patent Application
Hybrid Bonding Systems and Methods for Semiconductor Wafers
- Publication number 20140011324
- Publication date Jan 9, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ping-Yin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANO-SKELETAL CATALYST
- Publication number 20130316896
- Publication date Nov 28, 2013
- SDCmaterials, Inc.
- Maximilian A. BIBERGER
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
DEVICE AND METHOD FOR ELUTRIATING AND GLUING WOOD CHIPS
- Publication number 20130276951
- Publication date Oct 24, 2013
- KRONOPLUS TECHNICAL AG
- Hannes Speidel
- B32 - LAYERED PRODUCTS
Information Patent Application
INFLATION AND SEALING DEVICE FOR INFLATABLE AIR CUSHIONS
- Publication number 20130255857
- Publication date Oct 3, 2013
- THOMAS D. WETSCH
- B31 - MAKING ARTICLES OF PAPER OR CARDBOARD WORKING PAPER OR CARDBOARD
Information Patent Application
APPARATUS AND METHOD OF SEPARATING WAFER FROM CARRIER
- Publication number 20130248119
- Publication date Sep 26, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien Ling HWANG
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PRO...
- Publication number 20130240127
- Publication date Sep 19, 2013
- Kabushiki Kaisha Toshiba
- Daisuke YAMASHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INFILTRATING SILICONE INTO A FIBER COMPOSITE STRUCTURE A...
- Publication number 20130200652
- Publication date Aug 8, 2013
- AIRBUS OPERATIONS GMBH
- Tamas Havar
- B60 - VEHICLES IN GENERAL
Information Patent Application
REDUCTION OF EDGE CHIPPING DURING WAFER HANDLING
- Publication number 20130164912
- Publication date Jun 27, 2013
- International Business Machines Corporation
- Sarah H. Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF EDGE CHIPPING DURING WAFER HANDLING
- Publication number 20130160705
- Publication date Jun 27, 2013
- International Business Machines Corporation
- Sarah H. Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT SYSTEM, SUBSTRATE PROCESSING SYSTEM, AND JOINT METHOD
- Publication number 20130153116
- Publication date Jun 20, 2013
- TOKYO ELECTRON LIMITED
- Osamu Hirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY DECORATION FOR FABRIC
- Publication number 20130029076
- Publication date Jan 31, 2013
- Brandon Douglas GADDIS
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Swing Out Mold Insert Device On Lay Up Molds
- Publication number 20130014887
- Publication date Jan 17, 2013
- Paul D. Jagos
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
EASY BREAK GEODE
- Publication number 20130000835
- Publication date Jan 3, 2013
- Gem Center U.S.A., Inc.
- Marcos Lionel Carrillo
- B28 - WORKING CEMENT, CLAY, OR STONE

Combined or convertible surface bonding means and/or assembly means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonding apparatus and stack body manufacturing apparatus

Hybrid bonding systems and methods for semiconductor wafers

Epitaxial lift off systems and methods

Hybrid bonding systems and methods for semiconductor wafers

Recyclable surface covering and method and system for manufacturing...

Recyclable surface covering and method and system for manufacturing...

Bonding apparatus and stack body manufacturing apparatus

Hybrid bonding systems and methods for semiconductor wafers

Apparatus for separating wafer from carrier

Fluid recirculation system for use in vapor phase particle producti...

Highly turbulent quench chamber

Devices with thinned wafer

Device and method for elutriating and gluing wood chips

Epitaxial lift off systems and methods

Collet cleaning method and die bonder using the same

Flexible barrier composite fabrics via an adhered film process

Method and apparatus for making uniform and ultrasmall nanoparticles

Spool-less, continuous bobbin assembly and method of use

Highly turbulent quench chamber

System for mounting objects to polymeric membranes

Gas delivery system with constant overpressure relative to ambient...

Recyclable surface covering and method and system for manufacturing...

Hybrid bonding systems and methods for semiconductor wafers

System for and method of introducing additives to biological materi...

Fluid recirculation system for use in vapor phase particle producti...

Plasma-arc vaporization chamber with wide bore

Apparatus and method of separating wafer from carrier

Reduction of edge chipping during wafer handling

Prepreg manufacturing device

Reduction of edge chipping during wafer handling

Patents Applicationslast 30 patents

RECYCLABLE SURFACE COVERING AND METHOD AND SYSTEM FOR MANUFACTURING...

Hybrid Bonding Systems and Methods for Semiconductor Wafers

APPARATUS AND PROCESS FOR THE PRODUCTION OF PAPER WEB MATERIAL

BONDING APPARATUS AND STACK BODY MANUFACTURING APPARATUS

Hybrid Bonding Systems and Methods for Semiconductor Wafers

Labeler

APPARATUS FOR SEPARATING WAFER FROM CARRIER

FLEXIBLE BARRIER COMPOSITE FABRICS VIA AN ADHERED FILM PROCESS

EPITAXIAL LIFT OFF SYSTEMS AND METHODS

APPARATUS AND PROCESS FOR THE PRODUCTION OF PAPER WEB MATERIAL

Collet Cleaning Method and Die Bonder Using the Same

RECYCLABLE SURFACE COVERING AND METHOD AND SYSTEM FOR MANUFACTURING...

METHOD AND APPARATUS FOR PRODUCING AN EASILY APPLIED SELF ADHESIVE...

SPOOL-LESS, CONTINUOUS BOBBIN ASSEMBLY AND METHOD OF USE

METHOD AND APPARATUS FOR MAKING UNIFORM AND ULTRASMALL NANOPARTICLES

FLUID RECIRCULATION SYSTEM FOR USE IN VAPOR PHASE PARTICLE PRODUCTI...

System for Mounting Objects to Polymeric Membranes

Hybrid Bonding Systems and Methods for Semiconductor Wafers

NANO-SKELETAL CATALYST

DEVICE AND METHOD FOR ELUTRIATING AND GLUING WOOD CHIPS

INFLATION AND SEALING DEVICE FOR INFLATABLE AIR CUSHIONS

APPARATUS AND METHOD OF SEPARATING WAFER FROM CARRIER

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PRO...

METHOD FOR INFILTRATING SILICONE INTO A FIBER COMPOSITE STRUCTURE A...

REDUCTION OF EDGE CHIPPING DURING WAFER HANDLING

REDUCTION OF EDGE CHIPPING DURING WAFER HANDLING

JOINT SYSTEM, SUBSTRATE PROCESSING SYSTEM, AND JOINT METHOD

TEMPORARY DECORATION FOR FABRIC

Swing Out Mold Insert Device On Lay Up Molds

EASY BREAK GEODE