combined with laser drilling through a metal layer

Industry

CPC
H05K3/0038

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/0038combined with laser drilling through a metal layer

Industries

Patents Grantslast 30 patents

Information Patent Grant
Circuit board preparation method
- Patent number 11,937,377
- Issue date Mar 19, 2024
- SHENNAN CIRCUITS CO., LTD.
- Changsheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board
- Patent number 11,903,129
- Issue date Feb 13, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Chi Seong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit boards with plated blind slots for improved vertica...
- Patent number 11,792,928
- Issue date Oct 17, 2023
- Acleap Power Inc.
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal sublayer sensing in multi-layer workpiece hole drilling
- Patent number 11,792,940
- Issue date Oct 17, 2023
- DRILLIANT LTD
- Guy Soffer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power semiconductor module for PCB embedding, power electronic asse...
- Patent number 11,699,640
- Issue date Jul 11, 2023
- Infineon Technologies AG
- Thomas Stoek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier with blind hole filled with an electrically condu...
- Patent number 11,700,690
- Issue date Jul 11, 2023
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing laminate having patterned metal foil, and lami...
- Patent number 11,664,240
- Issue date May 30, 2023
- Mitsubishi Gas Chemical Company, Inc.
- Syunsuke Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adapter board and method for making adapter board
- Patent number 11,665,820
- Issue date May 30, 2023
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Man-Zhi Peng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for fabrication of a printed circuit board using a semi-add...
- Patent number 11,638,354
- Issue date Apr 25, 2023
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method for printed circuit board and laser processing...
- Patent number 11,576,265
- Issue date Feb 7, 2023
- OFUNA ENTERPRISE JAPAN CO., LTD.
- Kunio Arai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Molded product, metal-clad laminate, printed wiring board, and meth...
- Patent number 11,535,015
- Issue date Dec 27, 2022
- AGC Inc.
- Wataru Kasai
- B32 - LAYERED PRODUCTS
Information Patent Grant
Overhang-compensating annular plating layer in through hole of comp...
- Patent number 11,510,316
- Issue date Nov 22, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing the printed board
- Patent number 11,229,123
- Issue date Jan 18, 2022
- Nichia Corporation
- Masaaki Katsumata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component carrier with blind hole filled with an electrically condu...
- Patent number 11,219,129
- Issue date Jan 4, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a printed circuit board structure
- Patent number 11,172,576
- Issue date Nov 9, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Johannes Stahr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 11,122,686
- Issue date Sep 14, 2021
- Ibiden Co., Ltd.
- Yasuki Kimishima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate bonding structure
- Patent number 11,096,282
- Issue date Aug 17, 2021
- Murata Manufacturing Co., Ltd.
- Atsushi Kasuya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing a high impedance surface (HIS) enhanced by...
- Patent number 11,071,213
- Issue date Jul 20, 2021
- The Boeing Company
- Charles Muwonge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterning and removal of circuit board material using ultrafast la...
- Patent number 11,064,611
- Issue date Jul 13, 2021
- IPG Photonics Corporation
- David C. Clark
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Overhang-compensating annular plating layer in through hole of comp...
- Patent number 11,051,403
- Issue date Jun 29, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing holes in component carrier material
- Patent number 11,039,535
- Issue date Jun 15, 2021
- AT&S (China) Co. Ltd.
- Seok Kim Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed board, light emitting device, and method for manufacturing...
- Patent number 10,964,865
- Issue date Mar 30, 2021
- Nichia Corporation
- Masaaki Katsumata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed board and light emitting device
- Patent number 10,957,836
- Issue date Mar 23, 2021
- Nichia Corporation
- Masaaki Katsumata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper clad laminates and method for manufacturing a printed circui...
- Patent number 10,952,329
- Issue date Mar 16, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Youn-Gyu Han
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal sublayer sensing in multi-layer workpiece hole drilling
- Patent number 10,933,490
- Issue date Mar 2, 2021
- DRILLIANT LTD
- Guy Soffer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal sublayer sensing in multi-layer workpiece hole drilling
- Patent number 10,932,370
- Issue date Feb 23, 2021
- DRILLIANT LTD
- Guy Soffer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for printed circuit boards using backing foil
- Patent number 10,765,012
- Issue date Sep 1, 2020
- CATLAM, LLC
- Kenneth S. Bahl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit board having enhanced bending durability and metho...
- Patent number 10,750,612
- Issue date Aug 18, 2020
- Gigalane Co., Ltd.
- Sang Pil Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board for inspection of electronic components
- Patent number 10,690,716
- Issue date Jun 23, 2020
- NGK Spark Plug Co., Ltd.
- Junichirou Kanematsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding into printed circuit board with drilling
- Patent number 10,681,819
- Issue date Jun 9, 2020
- Infineon Technologies Austria AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING WIRING CIRCUIT BOARD ASSEMBLY SHEET
- Publication number 20240260173
- Publication date Aug 1, 2024
- Nitto Denko Corporation
- Yusaku TAMAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Manufacturing a Sheet with Double-Sided Structured Condu...
- Publication number 20240032207
- Publication date Jan 25, 2024
- FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V.
- Antonio ALTANA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIR...
- Publication number 20230292435
- Publication date Sep 14, 2023
- KIOXIA Corporation
- Tomonori Kawata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARDS WITH PLATED BLIND SLOTS FOR IMPROVED VERTICA...
- Publication number 20230199958
- Publication date Jun 22, 2023
- ABB Schweiz AG
- John Andrew Trelford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20230141270
- Publication date May 11, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Chi Seong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Forming Through Hole in Component Carrier by Laser Drilling Blind H...
- Publication number 20230085035
- Publication date Mar 16, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq IFIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING WIRING SUBSTRATE
- Publication number 20230063719
- Publication date Mar 2, 2023
- IBIDEN CO., LTD.
- Michimasa TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD PREPARATION METHOD
- Publication number 20220386472
- Publication date Dec 1, 2022
- SHENNAN CIRCUITS CO., LTD.
- CHANGSHENG TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Blind Hole Filled With An Electrically Condu...
- Publication number 20220095457
- Publication date Mar 24, 2022
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADAPTER BOARD AND METHOD FOR MAKING ADAPTER BOARD
- Publication number 20220087020
- Publication date Mar 17, 2022
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MAN-ZHI PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20210259107
- Publication date Aug 19, 2021
- IBIDEN CO., LTD.
- Yasuki KIMISHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADAPTER BOARD AND METHOD FOR MAKING ADAPTOR BOARD
- Publication number 20210235581
- Publication date Jul 29, 2021
- QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD
- MAN-ZHI PENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Overhang-Compensating Annular Plating Layer in Through Hole of Comp...
- Publication number 20210185811
- Publication date Jun 17, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal Sublayer Sensing In Multi-Layer Workpiece Hole Drilling
- Publication number 20210161017
- Publication date May 27, 2021
- Drilliant Ltd.
- Guy SOFFER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE BONDING STRUCTURE
- Publication number 20210045245
- Publication date Feb 11, 2021
- Murata Manufacturing Co., Ltd.
- Atsushi KASUYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF MANUFACTURING A HIGH IMPEDANCE SURFACE (HIS) ENHANCED BY...
- Publication number 20210029836
- Publication date Jan 28, 2021
- The Boeing Company
- Charles Muwonge
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semi-Additive Process for Printed Circuit Boards
- Publication number 20200389983
- Publication date Dec 10, 2020
- CATLAM LLC
- Kenneth S. BAHL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing Holes In Component Carrier Material
- Publication number 20200253051
- Publication date Aug 6, 2020
- AT&S (China) Co. Ltd.
- Seok Kim Tay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Overhang-Compensating Annular Plating Layer in Through Hole of Comp...
- Publication number 20200253052
- Publication date Aug 6, 2020
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With Blind Hole Filled With An Electrically Condu...
- Publication number 20200253054
- Publication date Aug 6, 2020
- AT&S (China) Co. Ltd.
- Mikael Tuominen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD AND LASER PROCESSING...
- Publication number 20200214138
- Publication date Jul 2, 2020
- OFUNA ENTERPRISE Japan Co., Ltd.
- Kunio ARAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOLDED PRODUCT, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND METH...
- Publication number 20200198310
- Publication date Jun 25, 2020
- AGC Inc.
- Wataru KASAI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRINTED BOARD AND LIGHT EMITTING DEVICE
- Publication number 20200152846
- Publication date May 14, 2020
- Nichia Corporation.
- Masaaki KATSUMATA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal Sublayer Sensing In Multi-Layer Workpiece Hole Drilling
- Publication number 20200008303
- Publication date Jan 2, 2020
- Drilliant Ltd.
- Guy SOFFER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PATTERNING AND REMOVAL OF CIRCUIT BOARD MATERIAL USING ULTRAFAST LA...
- Publication number 20200008305
- Publication date Jan 2, 2020
- IPG Photonics Corporation
- David C. Clark
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20190394877
- Publication date Dec 26, 2019
- IBIDEN CO., LTD.
- Naohito ISHIGURO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD HAVING ENHANCED BENDING DURABILITY AND METHO...
- Publication number 20190239343
- Publication date Aug 1, 2019
- GIGALANE CO., LTD.
- Sang Pil Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE CIRCUIT BOARD HAVING ENHANCED BENDING DURABILITY AND METHO...
- Publication number 20190239344
- Publication date Aug 1, 2019
- GIGALANE CO., LTD.
- Sang Pil Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD FOR INSPECTION OF ELECTRONIC COMPONENTS
- Publication number 20190162778
- Publication date May 30, 2019
- NGK Spark Plug Co., Ltd.
- Junichirou KANEMATSU
- G01 - MEASURING TESTING
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20190124765
- Publication date Apr 25, 2019
- IBIDEN CO., LTD.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

combined with laser drilling through a metal layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board preparation method

Printed circuit board

Printed circuit boards with plated blind slots for improved vertica...

Metal sublayer sensing in multi-layer workpiece hole drilling

Power semiconductor module for PCB embedding, power electronic asse...

Component carrier with blind hole filled with an electrically condu...

Method for producing laminate having patterned metal foil, and lami...

Adapter board and method for making adapter board

Process for fabrication of a printed circuit board using a semi-add...

Manufacturing method for printed circuit board and laser processing...

Molded product, metal-clad laminate, printed wiring board, and meth...

Overhang-compensating annular plating layer in through hole of comp...

Method of manufacturing the printed board

Component carrier with blind hole filled with an electrically condu...

Method for producing a printed circuit board structure

Wiring substrate

Substrate bonding structure

Methods of manufacturing a high impedance surface (HIS) enhanced by...

Patterning and removal of circuit board material using ultrafast la...

Overhang-compensating annular plating layer in through hole of comp...

Manufacturing holes in component carrier material

Printed board, light emitting device, and method for manufacturing...

Printed board and light emitting device

Copper clad laminates and method for manufacturing a printed circui...

Metal sublayer sensing in multi-layer workpiece hole drilling

Metal sublayer sensing in multi-layer workpiece hole drilling

Process for printed circuit boards using backing foil

Flexible circuit board having enhanced bending durability and metho...

Multilayer wiring board for inspection of electronic components

Embedding into printed circuit board with drilling

Patents Applicationslast 30 patents

METHOD FOR PRODUCING WIRING CIRCUIT BOARD ASSEMBLY SHEET

Method for Manufacturing a Sheet with Double-Sided Structured Condu...

WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIR...

PRINTED CIRCUIT BOARDS WITH PLATED BLIND SLOTS FOR IMPROVED VERTICA...

PRINTED CIRCUIT BOARD

Forming Through Hole in Component Carrier by Laser Drilling Blind H...

METHOD FOR MANUFACTURING WIRING SUBSTRATE

CIRCUIT BOARD PREPARATION METHOD

Component Carrier With Blind Hole Filled With An Electrically Condu...

ADAPTER BOARD AND METHOD FOR MAKING ADAPTER BOARD

WIRING SUBSTRATE

ADAPTER BOARD AND METHOD FOR MAKING ADAPTOR BOARD

Overhang-Compensating Annular Plating Layer in Through Hole of Comp...

Metal Sublayer Sensing In Multi-Layer Workpiece Hole Drilling

SUBSTRATE BONDING STRUCTURE

METHODS OF MANUFACTURING A HIGH IMPEDANCE SURFACE (HIS) ENHANCED BY...

Semi-Additive Process for Printed Circuit Boards

Manufacturing Holes In Component Carrier Material

Overhang-Compensating Annular Plating Layer in Through Hole of Comp...

Component Carrier With Blind Hole Filled With An Electrically Condu...

MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD AND LASER PROCESSING...

MOLDED PRODUCT, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND METH...

PRINTED BOARD AND LIGHT EMITTING DEVICE

Metal Sublayer Sensing In Multi-Layer Workpiece Hole Drilling

PATTERNING AND REMOVAL OF CIRCUIT BOARD MATERIAL USING ULTRAFAST LA...

PRINTED WIRING BOARD

FLEXIBLE CIRCUIT BOARD HAVING ENHANCED BENDING DURABILITY AND METHO...

FLEXIBLE CIRCUIT BOARD HAVING ENHANCED BENDING DURABILITY AND METHO...

MULTILAYER WIRING BOARD FOR INSPECTION OF ELECTRONIC COMPONENTS

PRINTED WIRING BOARD