Component having two leads

Industry

CPC
H05K2201/10651

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/10651Component having two leads

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Signal processing board and image forming apparatus
- Patent number 12,295,093
- Issue date May 6, 2025
- Kyocera Document Solutions Inc.
- Shotaro Ikegami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor storage device
- Patent number 12,232,265
- Issue date Feb 18, 2025
- Kioxia Corporation
- Koji Ueno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and electronic device
- Patent number 12,219,712
- Issue date Feb 4, 2025
- Canon Kabushiki Kaisha
- Noritake Tsuboi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Modular capacitor subassembly for backup power
- Patent number 12,207,409
- Issue date Jan 21, 2025
- Intel Corporation
- John Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Component built-in substrate including multilayer ceramic electroni...
- Patent number 12,051,547
- Issue date Jul 30, 2024
- Murata Manufacturing Co., Ltd.
- Yuichiro Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and electronic device
- Patent number 11,792,936
- Issue date Oct 17, 2023
- Canon Kabushiki Kaisha
- Noritake Tsuboi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for manufacturing a circuit board with embedded nickel resistor
- Patent number 11,665,831
- Issue date May 30, 2023
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Jian Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in substrate
- Patent number 11,646,157
- Issue date May 9, 2023
- Murata Manufacturing Co., Ltd.
- Yuichiro Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and its manufacturing method
- Patent number 11,452,209
- Issue date Sep 20, 2022
- TDK Corporation
- Yuichiro Okuyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and electronic device
- Patent number 11,412,616
- Issue date Aug 9, 2022
- Canon Kabushiki Kaisha
- Noritake Tsuboi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Mounting aid and method for mounting electrical components on a pri...
- Patent number 11,357,114
- Issue date Jun 7, 2022
- BorgWarner Ludwigsburg GmbH
- Sisay Tadele
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor with visual indicator
- Patent number 11,340,287
- Issue date May 24, 2022
- Intel Corporation
- Ramaswamy Parthasarathy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vented capacitor mounting structure for airbag electronic controlle...
- Patent number 11,270,848
- Issue date Mar 8, 2022
- ZF ACTIVE SAFETY AND ELECTRONICS US LLC
- Neil G. Murray
- B60 - VEHICLES IN GENERAL
Information Patent Grant
SMD diode taking a runner as body and manufacturing method thereof
- Patent number 11,024,567
- Issue date Jun 1, 2021
- SIYANG GRANDE ELECTRONICS CO., LTD.
- Yunhui Zhong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic electronic component, ceramic electronic component manufact...
- Patent number 11,011,309
- Issue date May 18, 2021
- Taiyo Yuden Co., Ltd.
- Shota Yajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin molded substrate and mounting structure for capacitor
- Patent number 10,984,949
- Issue date Apr 20, 2021
- FANUC CORPORATION
- Yuuki Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of providing power input to a flexible printed circuit and a...
- Patent number 10,729,011
- Issue date Jul 28, 2020
- TF Massif Technologies Ltd.
- Alain Carel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reverse mounted gull wing electronic package
- Patent number 10,699,992
- Issue date Jun 30, 2020
- Intel Corporation
- Juan Landeros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacting arrangement and method for forming the contacting arrang...
- Patent number 10,667,409
- Issue date May 26, 2020
- Robert Bosch GmbH
- Heiner Jacobs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic electronic component and mounting structure therefor
- Patent number 10,614,954
- Issue date Apr 7, 2020
- Murata Manufacturing Co., Ltd.
- Teppei Akiyoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cache management for memory module comprising two-terminal resistiv...
- Patent number 10,592,429
- Issue date Mar 17, 2020
- Crossbar, Inc.
- Mehdi Asnaashari
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Capacitor with improved heat dissipation
- Patent number 10,418,177
- Issue date Sep 17, 2019
- Deere & Company
- Christopher J. Schmit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-etched wiring board for LED applications
- Patent number 10,288,231
- Issue date May 14, 2019
- LEDVANCE GMBH
- Bernhard Rieder
- F21 - LIGHTING
Information Patent Grant
Composite electronic component and board having the same
- Patent number 10,229,790
- Issue date Mar 12, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Sang Soo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clamp and display device including same
- Patent number 10,219,382
- Issue date Feb 26, 2019
- Samsung Electronics Co., Ltd.
- Sung Yong Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 10,159,155
- Issue date Dec 18, 2018
- Joled Inc
- Shinya Ogasawara
- G02 - OPTICS
Information Patent Grant
Multilayer electronic component and board having the same
- Patent number 10,062,511
- Issue date Aug 28, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED lamp using ultra-small LED electrode assembly
- Patent number 9,978,725
- Issue date May 22, 2018
- PSI CO., LTD.
- Young Rag Do
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor with improved heat dissipation
- Patent number 9,831,035
- Issue date Nov 28, 2017
- Deere & Company
- Christopher J. Schmit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic electronic component and board having the same
- Patent number 9,818,541
- Issue date Nov 14, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Heung Kil Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20250159811
- Publication date May 15, 2025
- KIOXIA Corporation
- Koji UENO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE
- Publication number 20250126717
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Cheolmin Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LATERALLY PLACED CAPACITOR PACKAGE ASSEMBLY AND ASSEMBLY METHOD THE...
- Publication number 20240431032
- Publication date Dec 26, 2024
- APAQ TECHNOLOGY CO., LTD.
- CHING-FENG LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20240206074
- Publication date Jun 20, 2024
- KIOXIA Corporation
- Koji UENO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SIGNAL PROCESSING BOARD AND IMAGE FORMING APPARATUS
- Publication number 20240107661
- Publication date Mar 28, 2024
- KYOCERA DOCUMENT SOLUTIONS INC.
- Shotaro Ikegami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENT AND METHOD FOR M...
- Publication number 20240107666
- Publication date Mar 28, 2024
- TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
- MING-HSUN LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20230403796
- Publication date Dec 14, 2023
- Canon Kabushiki Kaisha
- Noritake Tsuboi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20230135950
- Publication date May 4, 2023
- Kioxia Corporation
- Koji UENO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20220353995
- Publication date Nov 3, 2022
- Canon Kabushiki Kaisha
- Noritake Tsuboi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND METHOD FOR MAN...
- Publication number 20220071020
- Publication date Mar 3, 2022
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- JIAN WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT BUILT-IN SUBSTRATE
- Publication number 20220051852
- Publication date Feb 17, 2022
- Murata Manufacturing Co., Ltd.
- Yuichiro TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
- Publication number 20210219430
- Publication date Jul 15, 2021
- TDK Corporation
- Yuichiro OKUYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VENTED CAPACITOR MOUNTING STRUCTURE FOR AIRBAG ELECTRONIC CONTROLLE...
- Publication number 20210012972
- Publication date Jan 14, 2021
- ZF ACTIVE SAFETY AND ELECTRONICS US LLC
- NEIL G. MURRAY
- B60 - VEHICLES IN GENERAL
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20200315016
- Publication date Oct 1, 2020
- Canon Kabushiki Kaisha
- Noritake Tsuboi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN MOLDED SUBSTRATE AND MOUNTING STRUCTURE FOR CAPACITOR
- Publication number 20200227206
- Publication date Jul 16, 2020
- FANUC CORPORATION
- Yuuki INOUE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROVIDING POWER INPUT TO A FLEXIBLE PRINTED CIRCUIT AND...
- Publication number 20200077519
- Publication date Mar 5, 2020
- Alain Carel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTACTING ARRANGEMENT AND METHOD FOR FORMING THE CONTACTING ARRANG...
- Publication number 20190215969
- Publication date Jul 11, 2019
- ROBERT BOSCH GmbH
- Heiner Jacobs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN MOLDED SUBSTRATE AND MOUNTING STRUCTURE FOR CAPACITOR
- Publication number 20190157002
- Publication date May 23, 2019
- FANUC CORPORATION
- Yuuki INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSE MOUNTED GULL WING ELECTRONIC PACKAGE
- Publication number 20180337114
- Publication date Nov 22, 2018
- Intel Corporation
- Juan Landeros
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICALLY EMBEDDED PASSIVE COMPONENTS
- Publication number 20180332708
- Publication date Nov 15, 2018
- Intel Corporation
- William J. LAMBERT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Non-etched wiring board for LED applications
- Publication number 20180320832
- Publication date Nov 8, 2018
- LEDVANCE GmbH
- Bernhard Rieder
- F21 - LIGHTING
Information Patent Application
STACKED OUTPUT STRUCTURE OF CAPACITIVE POWER SUPPLY FOR WELDING EQU...
- Publication number 20180310409
- Publication date Oct 25, 2018
- BOSJOB COMPANY LTD.
- Liang-huan WENG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR WITH IMPROVED HEAT DISSIPATION
- Publication number 20180061570
- Publication date Mar 1, 2018
- Deere & Company
- Christopher J. Schmit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR PROCESS
- Publication number 20160143149
- Publication date May 19, 2016
- Advanced Semiconductor Engineering, Inc.
- Yuan-Chang SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING DEVICE AND SEMICONDUCTOR DEVICE INCLU...
- Publication number 20150163916
- Publication date Jun 11, 2015
- Mitsubishi Electric Corporation
- Taichi OBARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH VOLTAGE DISCHARGE PROTECTION DEVICE AND RADIO FREQUENCY TRANSM...
- Publication number 20140355163
- Publication date Dec 4, 2014
- CHIT SHUN CATV EQUIPMENT LIMITED
- Siu Shan Chung
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
COMPOSITE ELECTRONIC COMPONENT
- Publication number 20140313682
- Publication date Oct 23, 2014
- NIHON DEMPA KOGYO CO., LTD.
- HIROYUKI MITOME
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Assembly Structure with Filter Device and Printed Circuit Board and...
- Publication number 20140254094
- Publication date Sep 11, 2014
- U.D. ELECTRONIC CORP.
- Chih-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT WIRING MEMBER AND MANUFACTURING METHOD THEREOF
- Publication number 20140204544
- Publication date Jul 24, 2014
- Hitachi Metals, Ltd.
- Kotaro TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME
- Publication number 20140146549
- Publication date May 29, 2014
- LG Innotek Co., Ltd.
- Kyong Jun KIM
- G02 - OPTICS

Component having two leads

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Signal processing board and image forming apparatus

Semiconductor storage device

Printed circuit board and electronic device

Modular capacitor subassembly for backup power

Component built-in substrate including multilayer ceramic electroni...

Printed circuit board and electronic device

Method for manufacturing a circuit board with embedded nickel resistor

Component built-in substrate

Electronic component and its manufacturing method

Printed circuit board and electronic device

Mounting aid and method for mounting electrical components on a pri...

Capacitor with visual indicator

Vented capacitor mounting structure for airbag electronic controlle...

SMD diode taking a runner as body and manufacturing method thereof

Ceramic electronic component, ceramic electronic component manufact...

Resin molded substrate and mounting structure for capacitor

Method of providing power input to a flexible printed circuit and a...

Reverse mounted gull wing electronic package

Contacting arrangement and method for forming the contacting arrang...

Ceramic electronic component and mounting structure therefor

Cache management for memory module comprising two-terminal resistiv...

Capacitor with improved heat dissipation

Non-etched wiring board for LED applications

Composite electronic component and board having the same

Clamp and display device including same

Display device

Multilayer electronic component and board having the same

LED lamp using ultra-small LED electrode assembly

Capacitor with improved heat dissipation

Multilayer ceramic electronic component and board having the same

Patents Applicationslast 30 patents

SEMICONDUCTOR STORAGE DEVICE

CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE

LATERALLY PLACED CAPACITOR PACKAGE ASSEMBLY AND ASSEMBLY METHOD THE...

SEMICONDUCTOR STORAGE DEVICE

SIGNAL PROCESSING BOARD AND IMAGE FORMING APPARATUS

CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENT AND METHOD FOR M...

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE

SEMICONDUCTOR STORAGE DEVICE

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE

CIRCUIT BOARD WITH EMBEDDED ELECTRONIC COMPONENT AND METHOD FOR MAN...

COMPONENT BUILT-IN SUBSTRATE

ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD

VENTED CAPACITOR MOUNTING STRUCTURE FOR AIRBAG ELECTRONIC CONTROLLE...

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE

RESIN MOLDED SUBSTRATE AND MOUNTING STRUCTURE FOR CAPACITOR

METHOD OF PROVIDING POWER INPUT TO A FLEXIBLE PRINTED CIRCUIT AND...

CONTACTING ARRANGEMENT AND METHOD FOR FORMING THE CONTACTING ARRANG...

RESIN MOLDED SUBSTRATE AND MOUNTING STRUCTURE FOR CAPACITOR

REVERSE MOUNTED GULL WING ELECTRONIC PACKAGE

VERTICALLY EMBEDDED PASSIVE COMPONENTS

Non-etched wiring board for LED applications

STACKED OUTPUT STRUCTURE OF CAPACITIVE POWER SUPPLY FOR WELDING EQU...

CAPACITOR WITH IMPROVED HEAT DISSIPATION

SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR PROCESS

ELECTRONIC COMPONENT MOUNTING DEVICE AND SEMICONDUCTOR DEVICE INCLU...

HIGH VOLTAGE DISCHARGE PROTECTION DEVICE AND RADIO FREQUENCY TRANSM...

COMPOSITE ELECTRONIC COMPONENT

Assembly Structure with Filter Device and Printed Circuit Board and...

FLAT WIRING MEMBER AND MANUFACTURING METHOD THEREOF

LIGHT EMITTING APPARATUS AND LIGHT UNIT HAVING THE SAME