Components thermally connected to metal substrates or heat-sinks by insert mounting

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CPC
H05K1/021

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/021Components thermally connected to metal substrates or heat-sinks by insert mounting

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method for pcb with thermal conductor embedded therei...
- Patent number 12,171,057
- Issue date Dec 17, 2024
- SHENGYI ELECTRONICS CO., LTD.
- Lu Xiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Phase change material (PCM) heatsinks
- Patent number 12,163,740
- Issue date Dec 10, 2024
- Simmonds Precision Products, Inc.
- Jason Graham
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heatsink based power delivery for CPUs
- Patent number 12,160,945
- Issue date Dec 3, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module
- Patent number 12,160,947
- Issue date Dec 3, 2024
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for shaping flexible circuits to improve routin...
- Patent number 12,156,342
- Issue date Nov 26, 2024
- Aptiv Technologies AG
- David G. Siegfried
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic device
- Patent number 12,156,336
- Issue date Nov 26, 2024
- Advanced Semiconductor Engineering, Inc.
- Chiung-Ying Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal Interface Material (TIM) filling structure for high warpage...
- Patent number 12,156,324
- Issue date Nov 26, 2024
- Cisco Technology, Inc.
- Yongguo Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Film-closure apparatus for plastic film material, printed circuit b...
- Patent number 12,145,324
- Issue date Nov 19, 2024
- Green Light Packaging Limited
- Mark Bonning
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method and procedure for miniaturing a multi-layer PCB
- Patent number 12,150,237
- Issue date Nov 19, 2024
- VEEA INC.
- Robert Migliorino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing shielded printed wiring board and shielded...
- Patent number 12,150,239
- Issue date Nov 19, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Sirou Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic compatibility contact between metal castings and pr...
- Patent number 12,150,251
- Issue date Nov 19, 2024
- Harman International Industries, Incorporated
- Jianing Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including shielding member and heat radiating str...
- Patent number 12,150,238
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Wansang Ryu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Voltage regulator module with inductor-cooled power stage
- Patent number 12,150,236
- Issue date Nov 19, 2024
- Infineon Technologies Austria AG
- Gerald Deboy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic compatibility contact between metal castings and pr...
- Patent number 12,150,252
- Issue date Nov 19, 2024
- Harman International Industries, Incorporated
- Jianing Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heater having flexible printed wiring board and method for manufact...
- Patent number 12,144,068
- Issue date Nov 12, 2024
- Nippon Mektron, Ltd.
- Garo Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency module and communication device
- Patent number 12,144,104
- Issue date Nov 12, 2024
- Murata Manufacturing Co., Ltd.
- Tetsuro Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,144,106
- Issue date Nov 12, 2024
- TPK Auto Tech (Xiamen) Limited
- Li Hua Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resetting different pair skew of printed circuit board traces
- Patent number 12,137,518
- Issue date Nov 5, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bus bar link for battery cell interconnections in a battery module
- Patent number 12,134,323
- Issue date Nov 5, 2024
- CPS Technology Holdings LLC
- Matthew R. Tyler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Circuit board for high frequency transmission and shielding method
- Patent number 12,127,331
- Issue date Oct 22, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD
- Zhi Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic control device
- Patent number 12,127,330
- Issue date Oct 22, 2024
- Hitachi Astemo, Ltd.
- Kiyoharu Ozaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic equipment
- Patent number 12,127,332
- Issue date Oct 22, 2024
- Sony Interactive Entertainment Inc.
- Yuta Tamaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate and memory system
- Patent number 12,127,346
- Issue date Oct 22, 2024
- Kioxia Corporation
- Kazuyuki Niitsuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,120,820
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Keiichi Ichikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power conversion device
- Patent number 12,119,756
- Issue date Oct 15, 2024
- Hitachi Industrial Equipment Systems Co., Ltd.
- Fumihiro Sato
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Circuit board and method of manufacturing thereof
- Patent number 12,120,812
- Issue date Oct 15, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Hao-Yi Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including heat dissipation structure
- Patent number 12,120,853
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Junwhon Uhm
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module and electronic device
- Patent number 12,114,418
- Issue date Oct 8, 2024
- Huawei Technologies Co., Ltd.
- Yongyao Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-ground vias for improved signal integrity for high-speed seri...
- Patent number 12,114,419
- Issue date Oct 8, 2024
- Dell Products L.P.
- William Andrew Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio frequency module
- Patent number 12,113,566
- Issue date Oct 8, 2024
- Murata Manufacturing Co., Ltd.
- Shou Matsumoto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240422908
- Publication date Dec 19, 2024
- LG Innotek Co., Ltd.
- Kyo Hun KOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board
- Publication number 20240422920
- Publication date Dec 19, 2024
- Avary Holding (Shenzhen) Co., Limited.
- WEN-ZHU WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING BRIDGE PRINTED CIRCUIT BOARD
- Publication number 20240422954
- Publication date Dec 19, 2024
- Samsung Electronics Co., Ltd.
- Bongkyu MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATSINK BASED POWER DELIVERY FOR CPUS
- Publication number 20240414836
- Publication date Dec 12, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board Arrangement for a Motor Vehicle Headlight
- Publication number 20240414838
- Publication date Dec 12, 2024
- ZKW GROUP GMBH
- Dietmar KIESLINGER
- F21 - LIGHTING
Information Patent Application
MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD
- Publication number 20240414839
- Publication date Dec 12, 2024
- FUJIFILM CORPORATION
- Norihide SHIMOHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER STRUCTURE
- Publication number 20240407079
- Publication date Dec 5, 2024
- Siliconware Precision Industries Co., Ltd.
- Chien-Sheng CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB, PCB MOUNTING BOX, CASE ASSEMBLY, AND CASE
- Publication number 20240407078
- Publication date Dec 5, 2024
- ZTE CORPORATION
- Shoulong WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED COUPLING COIL COMPONENT AND CIRCUIT BOARD HAVING THE SAME
- Publication number 20240395452
- Publication date Nov 28, 2024
- TDK Corporation
- Yuki HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAM...
- Publication number 20240397608
- Publication date Nov 28, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Wen LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARD
- Publication number 20240397609
- Publication date Nov 28, 2024
- Nitto Denko Corporation
- Tomoaki TANAKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SINGLE-PIECE HIGH DATA RATE BACKPLANE CONNECTOR
- Publication number 20240396252
- Publication date Nov 28, 2024
- MINDREACH I2I, SL
- Gaby Cristian MINDRECI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR ELIMINATING NOISE OF COOKING DEVICE BY USING...
- Publication number 20240397588
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Hwasung KIM
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
COMPUTER COOLING SYSTEM WITH DEFORMABLE DUCTS
- Publication number 20240397607
- Publication date Nov 28, 2024
- International Business Machines Corporation
- DUSTIN DEMETRIOU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONDUCTIVE MEMORY MODULE NOTCH AND CONNECTOR-TO-MOTHERBOARD PINS FO...
- Publication number 20240397628
- Publication date Nov 28, 2024
- Intel Corporation
- Landon HANKS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC DEVICE
- Publication number 20240392778
- Publication date Nov 28, 2024
- Mikuni Corporation
- Kei YASUGAHIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE
- Publication number 20240389217
- Publication date Nov 21, 2024
- InnoLight Technology PTE. LTD.
- Long CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD DEVICE AND IMAGE FORMING APPARATUS
- Publication number 20240389218
- Publication date Nov 21, 2024
- RICOH COMPANY, LTD.
- Ryosuke KAWASAKI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...
- Publication number 20240389219
- Publication date Nov 21, 2024
- Dell Products L.P.
- William Andrew Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND SYSTEM OF ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING
- Publication number 20240389289
- Publication date Nov 21, 2024
- Intel Corporation
- Kari Mansukoski
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR ALIGNING CONTACT SURFACES OF AN ELECTRICAL AND/OR ELECTR...
- Publication number 20240381542
- Publication date Nov 14, 2024
- ROBERT BOSCH GmbH
- Jivan Kapoor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES
- Publication number 20240373544
- Publication date Nov 7, 2024
- Murata Manufacturing Co., Ltd.
- Jahangir AFSHARIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240373545
- Publication date Nov 7, 2024
- Siliconware Precision Industries Co., Ltd.
- Hsiang-Hua HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND IMAGE DISPLAY DEVICE INCLUDING SAME
- Publication number 20240373547
- Publication date Nov 7, 2024
- LG ELECTRONICS INC.
- Geumsub SIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240373558
- Publication date Nov 7, 2024
- Innolux Corporation
- Chin-Lung Ting
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONFORMAL ELECTROMAGNETIC INTERFERENCE SHIELDING FILM
- Publication number 20240373608
- Publication date Nov 7, 2024
- Microsoft Technology Licensing, LLC
- Jaejin LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CABLE ASSEMBLY WITH CROSSTALK BARRIER
- Publication number 20240373609
- Publication date Nov 7, 2024
- 3M Innovative Properties Company
- Alexander W. Barr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR WITH THERMAL EXPAN...
- Publication number 20240372426
- Publication date Nov 7, 2024
- INFINITUM ELECTRIC INC.
- Rich Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible Hybrid Interconnect Circuits
- Publication number 20240373546
- Publication date Nov 7, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Speed Communication Jack
- Publication number 20240364059
- Publication date Oct 31, 2024
- Sentinel Connector Systems, Inc.
- Brett D. Robinson
- H01 - BASIC ELECTRIC ELEMENTS

Components thermally connected to metal substrates or heat-sinks by insert mounting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Manufacturing method for pcb with thermal conductor embedded therei...

Phase change material (PCM) heatsinks

Heatsink based power delivery for CPUs

Electronic module

Systems and methods for shaping flexible circuits to improve routin...

Electronic device

Thermal Interface Material (TIM) filling structure for high warpage...

Film-closure apparatus for plastic film material, printed circuit b...

Method and procedure for miniaturing a multi-layer PCB

Method for manufacturing shielded printed wiring board and shielded...

Electromagnetic compatibility contact between metal castings and pr...

Electronic device including shielding member and heat radiating str...

Voltage regulator module with inductor-cooled power stage

Electromagnetic compatibility contact between metal castings and pr...

Heater having flexible printed wiring board and method for manufact...

High frequency module and communication device

Electronic device

Resetting different pair skew of printed circuit board traces

Bus bar link for battery cell interconnections in a battery module

Circuit board for high frequency transmission and shielding method

Electronic control device

Electronic equipment

Substrate and memory system

Electronic device

Power conversion device

Circuit board and method of manufacturing thereof

Electronic device including heat dissipation structure

Electronic module and electronic device

Micro-ground vias for improved signal integrity for high-speed seri...

Radio frequency module

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD

Circuit board

ELECTRONIC DEVICE INCLUDING BRIDGE PRINTED CIRCUIT BOARD

HEATSINK BASED POWER DELIVERY FOR CPUS

Printed Circuit Board Arrangement for a Motor Vehicle Headlight

MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD

CARRIER STRUCTURE

PCB, PCB MOUNTING BOX, CASE ASSEMBLY, AND CASE

STACKED COUPLING COIL COMPONENT AND CIRCUIT BOARD HAVING THE SAME

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAM...

WIRING CIRCUIT BOARD AND METHOD OF PRODUCING THE WIRING CIRCUIT BOARD

SINGLE-PIECE HIGH DATA RATE BACKPLANE CONNECTOR

METHOD AND DEVICE FOR ELIMINATING NOISE OF COOKING DEVICE BY USING...

COMPUTER COOLING SYSTEM WITH DEFORMABLE DUCTS

CONDUCTIVE MEMORY MODULE NOTCH AND CONNECTOR-TO-MOTHERBOARD PINS FO...

ELECTRIC DEVICE

OPTICAL MODULE

CIRCUIT BOARD DEVICE AND IMAGE FORMING APPARATUS

MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...

APPARATUS AND SYSTEM OF ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING

METHOD FOR ALIGNING CONTACT SURFACES OF AN ELECTRICAL AND/OR ELECTR...

CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND IMAGE DISPLAY DEVICE INCLUDING SAME

ELECTRONIC DEVICE

CONFORMAL ELECTROMAGNETIC INTERFERENCE SHIELDING FILM

CABLE ASSEMBLY WITH CROSSTALK BARRIER

AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR WITH THERMAL EXPAN...

Flexible Hybrid Interconnect Circuits

High Speed Communication Jack