Components thermally connected to metal substrates or heat-sinks by insert mounting

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H05K1/021

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/021Components thermally connected to metal substrates or heat-sinks by insert mounting

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Display module and display device
- Patent number 12,369,255
- Issue date Jul 22, 2025
- Beijing Boe Display Technology Co., Ltd.
- Yuanye Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Camera module for heat dissipation and ground and electronic device...
- Patent number 12,363,406
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Minki Cho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
System for driving power devices
- Patent number 12,363,819
- Issue date Jul 15, 2025
- Delta Electronics (Shanghai) Co., Ltd.
- Lifeng Qiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module
- Patent number 12,363,821
- Issue date Jul 15, 2025
- Murata Manufacturing Co., Ltd.
- Ryota Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component module
- Patent number 12,356,538
- Issue date Jul 8, 2025
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and image display device including same
- Patent number 12,356,540
- Issue date Jul 8, 2025
- LG Electronics Inc.
- Geumsub Sin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus, system, and method for achieving certain characteristics...
- Patent number 12,349,267
- Issue date Jul 1, 2025
- Juniper Networks, Inc.
- Dylan G. Rust-Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modular electronic building systems with magnetic interconnections...
- Patent number 12,349,275
- Issue date Jul 1, 2025
- Sphero, Inc.
- Aya Bdeir
- A63 - SPORTS GAMES AMUSEMENTS
Information Patent Grant
Externally grounded printed circuit board
- Patent number 12,349,266
- Issue date Jul 1, 2025
- Knowles Electronics, LLC
- Joshua Watson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Customized thermal pathways in a PCB
- Patent number 12,342,474
- Issue date Jun 24, 2025
- Todd Robinson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supply apparatus, load and electronic device
- Patent number 12,342,450
- Issue date Jun 24, 2025
- Delta Electronics (Shanghai) Co., Ltd.
- Wulong Cong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Humidity-adjusted power supply
- Patent number 12,336,084
- Issue date Jun 17, 2025
- Xerox Corporation
- Hendrikus Adrianus Anthonius Verheijen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductive coupling structures for reducing cross talk effects in pa...
- Patent number 12,336,088
- Issue date Jun 17, 2025
- Intel Corporation
- Ranjul Balakrishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection body and harness
- Patent number 12,334,659
- Issue date Jun 17, 2025
- Japan Aviation Electronics Industry, Limited
- Kentaro Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-channel filter comprising plural elongate signal tracks cover...
- Patent number 12,334,617
- Issue date Jun 17, 2025
- QM TECHNOLOGIES APS
- Merlin Von Soosten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency module and communication device
- Patent number 12,336,086
- Issue date Jun 17, 2025
- Murata Manufacturing Co., Ltd.
- Takanori Uejima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device comprising printed circuit board
- Patent number 12,336,087
- Issue date Jun 17, 2025
- Samsung Electronics Co., Ltd.
- Haekeu Park
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Thermal management solution for power stage comprising top-cooled p...
- Patent number 12,336,148
- Issue date Jun 17, 2025
- GaN Systems Inc.
- Ruoyu Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and structure with electronic component
- Patent number 12,336,085
- Issue date Jun 17, 2025
- Murata Manufacturing Co., Ltd.
- Kazunori Tsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming multi-layer shielding st...
- Patent number 12,327,799
- Issue date Jun 10, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless connector system
- Patent number 12,327,931
- Issue date Jun 10, 2025
- NuCurrent, Inc.
- Vinit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating member arrangement structure and electronic device inclu...
- Patent number 12,328,811
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Wooram Ki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wiring base and electronic device
- Patent number 12,322,700
- Issue date Jun 3, 2025
- Kyocera Corporation
- Toshihiko Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and signal transmission method
- Patent number 12,324,092
- Issue date Jun 3, 2025
- Realtek Semiconductor Corporation
- Li Chung Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency module and communication device
- Patent number 12,317,413
- Issue date May 27, 2025
- Murata Manufacturing Co., Ltd.
- Masateru Higashi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Circuit board local electromagnetic shielding
- Patent number 12,317,409
- Issue date May 27, 2025
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-frequency module and communication device
- Patent number 12,317,412
- Issue date May 27, 2025
- Murata Manufacturing Co., Ltd.
- Yoichi Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 12,309,915
- Issue date May 20, 2025
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer circuit board having signal and power isolation circuit
- Patent number 12,309,914
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Tarou Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic wave shield film
- Patent number 12,309,988
- Issue date May 20, 2025
- Tatsuta Electric Wire & Cable Co., Ltd.
- Kouji Takami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
POWER ELECTRONIC SYSTEM WITH CONDUCTOR HAVING DAMPING FUNCTION
- Publication number 20250239378
- Publication date Jul 24, 2025
- Delta Electronics, Inc.
- Boyi Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH LAMINATED STRUCTURE AND METHOD OF MANUFACTURING A LAMIN...
- Publication number 20250240871
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Deborah COGONI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wireless Connector System
- Publication number 20250239769
- Publication date Jul 24, 2025
- NUCURRENT, INC.
- Vinit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND DISPLAY APPARATUS
- Publication number 20250240872
- Publication date Jul 24, 2025
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Shuang LEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE-LEVEL THERMAL MANAGEMENT MECHANISM
- Publication number 20250234452
- Publication date Jul 17, 2025
- Micron Technology, Inc.
- Mark A. Tverdy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Automotive Electronic Control Unit
- Publication number 20250229763
- Publication date Jul 17, 2025
- Aptiv Technologies AG
- Pawel HEBDA
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRONIC DEVICE AND IMPEDANCE MEASUREMENT METHOD
- Publication number 20250227836
- Publication date Jul 10, 2025
- InnoLux Corporation
- Cheng-Yeh TSAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROSTRIP BOARD GROUND PLANE IMPEDANCE MATCHING ADJUSTMENT
- Publication number 20250226561
- Publication date Jul 10, 2025
- MACOM Technology Solutions Holdings, Inc.
- Benone Achiriloaie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT WITH PRINTED HEATER
- Publication number 20250227851
- Publication date Jul 10, 2025
- TOKYO ELECTRON LIMITED
- Melvin Verbaas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low Sheet Resistance Coating
- Publication number 20250220824
- Publication date Jul 3, 2025
- Vitro Flat Glass LLC
- Zhixun Ma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL MAGNETIC INTERFERENCE FILTER BOARD FOR POWER BUSBAR
- Publication number 20250220805
- Publication date Jul 3, 2025
- GM Cruise Holdings LLC
- Xiao Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY PANEL, BONDING DEVICE THEREOF, AND DISPLAY DEVICE
- Publication number 20250220803
- Publication date Jul 3, 2025
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Shuya DONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL TRANSCEIVER EQUIPPED WITH GROUND VIA
- Publication number 20250220804
- Publication date Jul 3, 2025
- Prime World International Holdings Ltd.
- Chao-Hung TSAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISK DEVICE
- Publication number 20250210061
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Taichi OKANO
- G11 - INFORMATION STORAGE
Information Patent Application
WIRING BOARD
- Publication number 20250212324
- Publication date Jun 26, 2025
- TOPPAN Holdings Inc.
- Tomoyuki Ishii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING SHIELD CAN
- Publication number 20250212316
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Joosoon KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURES FOR REDUCING CROSSTALK INSIDE A SHIELDED DEVICE
- Publication number 20250212315
- Publication date Jun 26, 2025
- Intel Corporation
- Lidar Glazer
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICE INCLUDING INTERPOSER
- Publication number 20250212331
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Jungsik PARK
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DISPLAY MODULE AND DISPLAY DEVICE
- Publication number 20250211663
- Publication date Jun 26, 2025
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Haotian YANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
GROUNDING OPTIMIZATION FOR UNSHIELDED DATA CONNECTIONS
- Publication number 20250203754
- Publication date Jun 19, 2025
- Marvell Asia Pte Ltd.
- Shaowu Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR MINIMIZING ELECTROMAGNETIC COUPLING BETWEEN SURFACE M...
- Publication number 20250202529
- Publication date Jun 19, 2025
- Skyworks Solutions, Inc.
- John C. Baldwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD MODULE CAPABLE OF SUPPRESSING COMMON MODE NOISE
- Publication number 20250203756
- Publication date Jun 19, 2025
- EMPass Technology Inc.
- Yang-Chih HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optical Module
- Publication number 20250203758
- Publication date Jun 19, 2025
- Nippon Telegraph and Telephone Corporation
- Josuke Ozaki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WIRING BOARD AND MOUNTING STRUCTURE
- Publication number 20250203755
- Publication date Jun 19, 2025
- KYOCERA CORPORATION
- Aki KAWASE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20250203759
- Publication date Jun 19, 2025
- Murata Manufacturing Co., Ltd.
- Nanami YUMURA
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20250194011
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Eunhye Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, ELECTRONIC MODULE, ELECTRONIC EQUIPMENT AND V...
- Publication number 20250194012
- Publication date Jun 12, 2025
- Canon Kabushiki Kaisha
- SHOJI MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR COMPONENT AND INK JET RECORDING ELEMENT SUBSTRATE
- Publication number 20250194259
- Publication date Jun 12, 2025
- Canon Kabushiki Kaisha
- SUGURU TANIGUCHI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
MULTIFUNCTIONAL CHARGING AND DATA ADAPTER
- Publication number 20250183605
- Publication date Jun 5, 2025
- CHANNEL WELL TECHNOLOGY CO., LTD.
- YEN-CHENG PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE...
- Publication number 20250185159
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- Youngjin JUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Components thermally connected to metal substrates or heat-sinks by insert mounting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Display module and display device

Camera module for heat dissipation and ground and electronic device...

System for driving power devices

Circuit module

Electronic component module

Printed circuit board and image display device including same

Apparatus, system, and method for achieving certain characteristics...

Modular electronic building systems with magnetic interconnections...

Externally grounded printed circuit board

Customized thermal pathways in a PCB

Power supply apparatus, load and electronic device

Humidity-adjusted power supply

Inductive coupling structures for reducing cross talk effects in pa...

Connection body and harness

Multi-channel filter comprising plural elongate signal tracks cover...

High-frequency module and communication device

Electronic device comprising printed circuit board

Thermal management solution for power stage comprising top-cooled p...

Structure and structure with electronic component

Semiconductor device and method of forming multi-layer shielding st...

Wireless connector system

Insulating member arrangement structure and electronic device inclu...

Wiring base and electronic device

Integrated circuit and signal transmission method

High-frequency module and communication device

Circuit board local electromagnetic shielding

High-frequency module and communication device

Mating backplane for high speed, high density electrical connector

Multilayer circuit board having signal and power isolation circuit

Electromagnetic wave shield film

Patents Applicationslast 30 patents

POWER ELECTRONIC SYSTEM WITH CONDUCTOR HAVING DAMPING FUNCTION

DEVICE WITH LAMINATED STRUCTURE AND METHOD OF MANUFACTURING A LAMIN...

Wireless Connector System

CIRCUIT BOARD AND DISPLAY APPARATUS

MODULE-LEVEL THERMAL MANAGEMENT MECHANISM

Automotive Electronic Control Unit

ELECTRONIC DEVICE AND IMPEDANCE MEASUREMENT METHOD

MICROSTRIP BOARD GROUND PLANE IMPEDANCE MATCHING ADJUSTMENT

SUBSTRATE SUPPORT WITH PRINTED HEATER

Low Sheet Resistance Coating

ELECTRICAL MAGNETIC INTERFERENCE FILTER BOARD FOR POWER BUSBAR

DISPLAY PANEL, BONDING DEVICE THEREOF, AND DISPLAY DEVICE

OPTICAL TRANSCEIVER EQUIPPED WITH GROUND VIA

DISK DEVICE

WIRING BOARD

ELECTRONIC DEVICE INCLUDING SHIELD CAN

STRUCTURES FOR REDUCING CROSSTALK INSIDE A SHIELDED DEVICE

ELECTRONIC DEVICE INCLUDING INTERPOSER

DISPLAY MODULE AND DISPLAY DEVICE

GROUNDING OPTIMIZATION FOR UNSHIELDED DATA CONNECTIONS

APPARATUS FOR MINIMIZING ELECTROMAGNETIC COUPLING BETWEEN SURFACE M...

CIRCUIT BOARD MODULE CAPABLE OF SUPPRESSING COMMON MODE NOISE

Optical Module

WIRING BOARD AND MOUNTING STRUCTURE

RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME

PRINTED WIRING BOARD, ELECTRONIC MODULE, ELECTRONIC EQUIPMENT AND V...

SEMICONDUCTOR COMPONENT AND INK JET RECORDING ELEMENT SUBSTRATE

MULTIFUNCTIONAL CHARGING AND DATA ADAPTER

MULTI-LAYERED FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE...