Components thermally connected to metal substrates or heat-sinks by insert mounting

Industry

CPC
H05K1/021

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/021Components thermally connected to metal substrates or heat-sinks by insert mounting

Industries

Patents Grantslast 30 patents

Information Patent Grant
Monolithic Pstages and methods for voltage regulators
- Patent number 11,979,978
- Issue date May 7, 2024
- Dell Products L.P.
- Merle Wood
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board module and electronic device including the same
- Patent number 11,974,397
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Seungbo Shim
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Power module and heat sink system
- Patent number 11,974,387
- Issue date Apr 30, 2024
- FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD
- Nianbin Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Isolation of compartments in a layered printed circuit board, and a...
- Patent number 11,972,190
- Issue date Apr 30, 2024
- Management Services Group, Inc.
- Thomas Scott Morgan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Boot control circuit of computer system
- Patent number 11,966,755
- Issue date Apr 23, 2024
- Pegatron Corporation
- Chi-Yu Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Connector including signal pins shielded by buried ground vias
- Patent number 11,967,782
- Issue date Apr 23, 2024
- NEOCONIX, INC
- Woody Maynard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PCB for heatsink based power delivery
- Patent number 11,963,289
- Issue date Apr 16, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Efficient wave guide transition between package and PCB using solde...
- Patent number 11,963,291
- Issue date Apr 16, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and grounding assembly thereof
- Patent number 11,956,888
- Issue date Apr 9, 2024
- Delta Electronics, Inc.
- Chia-Hsien Chu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module
- Patent number 11,956,891
- Issue date Apr 9, 2024
- Chicony Electronics Co., Ltd.
- Sheng-Sung Chou
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
One-way communication data diode on a chip
- Patent number 11,954,235
- Issue date Apr 9, 2024
- Fend Incorporated
- Sang Cheon Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Board, circuit board, and fixture
- Patent number 11,956,887
- Issue date Apr 9, 2024
- Skiileux Electricity Inc.
- Shang-Wei Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self-equalized and self-crosstalk-compensated 3D transmission line...
- Patent number 11,955,436
- Issue date Apr 9, 2024
- Intel Corporation
- Khang Choong Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board and manufacturing method therefor, and relat...
- Patent number 11,950,355
- Issue date Apr 2, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Hui Wen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and procedure for miniaturing a multi-layer PCB
- Patent number 11,950,361
- Issue date Apr 2, 2024
- VEEA INC.
- Shaun Joseph Greaney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor interposer employing castellated through-vias
- Patent number 11,950,363
- Issue date Apr 2, 2024
- DexCom, Inc.
- Sean Frick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,950,356
- Issue date Apr 2, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies having conductive structures with differ...
- Patent number 11,942,334
- Issue date Mar 26, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board having conductive layer for shielding electronic component an...
- Patent number 11,943,862
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Bongchoon Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,942,389
- Issue date Mar 26, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic discharge protection for sensors in wound therapy
- Patent number 11,931,165
- Issue date Mar 19, 2024
- Smith & Nephew PLC
- Ben Alan Askem
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Flexible printed circuit board and display device
- Patent number 11,930,587
- Issue date Mar 12, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Fan Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board (PCB) including heatsinks
- Patent number 11,924,962
- Issue date Mar 5, 2024
- Dell Products L.P.
- Umesh Chandra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed-circuit isolation barrier for co-site interference mitigation
- Patent number 11,924,963
- Issue date Mar 5, 2024
- Raytheon Company
- David D. Crouch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heatsink based power delivery for CPUs
- Patent number 11,924,959
- Issue date Mar 5, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board for galvanic effect reduction
- Patent number 11,924,964
- Issue date Mar 5, 2024
- Western Digital Technologies, Inc.
- Lin Hui Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-functional PCB for assembling GaN-based power converter and m...
- Patent number 11,916,005
- Issue date Feb 27, 2024
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Yanbo Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and circuit board module thereof
- Patent number 11,917,747
- Issue date Feb 27, 2024
- Chicony Electronics Co., Ltd.
- Chien-Yueh Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Power converter
- Patent number 11,915,995
- Issue date Feb 27, 2024
- Fuji Electric Co., Ltd.
- Shun Fukuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test element support
- Patent number 11,911,768
- Issue date Feb 27, 2024
- Roche Diagnostics Operations, Inc.
- Reiner Stein
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD MODULE AND TOUCH DISPLAY APPARATUS
- Publication number 20240147602
- Publication date May 2, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Xianfeng YANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF STORAGE DEVICES
- Publication number 20240138054
- Publication date Apr 25, 2024
- Dell Products L.P.
- JOHN R. STUEWE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BIOPOLYMER-BASED ELECTROMAGENTIC INTERFERRENCE SHIELDING MATERIALS
- Publication number 20240138132
- Publication date Apr 25, 2024
- Software Defined Technologies, Inc.
- Michael M. Salour
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20240130035
- Publication date Apr 18, 2024
- FUJIFILM CORPORATION
- Yota AKASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATSINK BASED POWER DELIVERY FOR CPUS
- Publication number 20240130033
- Publication date Apr 18, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Device
- Publication number 20240130048
- Publication date Apr 18, 2024
- Honor Device Co., Ltd.
- Xiaoyong Dong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURGE PROTECTIVE DEVICES
- Publication number 20240127991
- Publication date Apr 18, 2024
- Raycap, S.A.
- Georgios Peppas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR A FLEXIBLE 3D POWER PLANE IN A CHASSIS
- Publication number 20240130068
- Publication date Apr 18, 2024
- Intel Corporation
- Nan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC U...
- Publication number 20240121885
- Publication date Apr 11, 2024
- Canon Kabushiki Kaisha
- Yu Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal Conduction - Electrical Conduction Isolated Circuit Board w...
- Publication number 20240114614
- Publication date Apr 4, 2024
- ICP TECHNOLOGY CO., LTD.
- HO-CHIEH YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD UNIT AND ELECTRONIC APPARATUS
- Publication number 20240114618
- Publication date Apr 4, 2024
- SEIKO EPSON CORPORATION
- Yu MASAGO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL SUBSTRATE WITH HIGH-RESISTANCE MAGNIFICATION AND POSITIVE T...
- Publication number 20240101851
- Publication date Mar 28, 2024
- LMS Consulting Group, LLC
- Shuyong Xiao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carrier Substrate
- Publication number 20240107658
- Publication date Mar 28, 2024
- Solid-tech Co., Ltd.
- Tzu Chien Hung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND APPARATUS FOR FACILITATING ROBUST AUTOMOTIVE ETHERNET
- Publication number 20240107660
- Publication date Mar 28, 2024
- BLACK SESAME TECHNOLOGIES (CHONGQING) CO., LTD.
- Hai Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC COMPONENT
- Publication number 20240107659
- Publication date Mar 28, 2024
- Murata Manufacturing Co., Ltd.
- Kenji MATSUDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL DEVICE
- Publication number 20240098881
- Publication date Mar 21, 2024
- MEIDENSHA CORPORATION
- Shota SUZUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240098880
- Publication date Mar 21, 2024
- KMW Inc.
- Bae Mook JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible Connector with Permeability Shield to Reduce Antenna Loss
- Publication number 20240097321
- Publication date Mar 21, 2024
- Google LLC
- Yao Ding
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING MODULE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AN...
- Publication number 20240098901
- Publication date Mar 21, 2024
- Nichia Corporation.
- Shota TAKASE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ISOLATOR
- Publication number 20240090120
- Publication date Mar 14, 2024
- Kabushiki Kaisha Toshiba
- Yoshinari TAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20240090121
- Publication date Mar 14, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Dae Jung BYUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Supply Cooling Structure
- Publication number 20240090153
- Publication date Mar 14, 2024
- AA Power Inc.
- Qun Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY EMBEDDED THERMAL MANAGEMENT SYSTEM U...
- Publication number 20240080966
- Publication date Mar 7, 2024
- Honeywell International Inc.
- Karthikeyan Paramanandam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND INFORMATION PROCESSING APPARATUS
- Publication number 20240080979
- Publication date Mar 7, 2024
- Hitachi, Ltd
- Goro HAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION ARRANGEMENT FOR FREQUENCY CONVERTER
- Publication number 20240074128
- Publication date Feb 29, 2024
- Zhejiang Holip Electronic Technology Co., Ltd.
- Yuedong LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OUTLET HEAT SINK FOR COOLING SYSTEM OF A SUPERCOMPUTER ELECTRONIC B...
- Publication number 20240074032
- Publication date Feb 29, 2024
- BULL SAS
- Marc RAETH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BASE AND ELECTRONIC DEVICE
- Publication number 20240074035
- Publication date Feb 29, 2024
- KYOCERA CORPORATION
- Yoshiki KAWAZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE
- Publication number 20240074033
- Publication date Feb 29, 2024
- Industrial Technology Research Institute
- Wen-Chih CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CONTROL DEVICE AND GROUND LINE ROUTING METHOD
- Publication number 20240074034
- Publication date Feb 29, 2024
- Hitachi Astemo, Ltd.
- Akira ISHII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEXTURED METAL CORE PRINTED CIRCUIT BOARDS FOR IMPROVED THERMAL DIS...
- Publication number 20240074031
- Publication date Feb 29, 2024
- CreeLED, Inc.
- Everett Bradford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Components thermally connected to metal substrates or heat-sinks by insert mounting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Monolithic Pstages and methods for voltage regulators

Circuit board module and electronic device including the same

Power module and heat sink system

Isolation of compartments in a layered printed circuit board, and a...

Boot control circuit of computer system

Connector including signal pins shielded by buried ground vias

PCB for heatsink based power delivery

Efficient wave guide transition between package and PCB using solde...

Electronic device and grounding assembly thereof

Electronic module

One-way communication data diode on a chip

Board, circuit board, and fixture

Self-equalized and self-crosstalk-compensated 3D transmission line...

Flexible circuit board and manufacturing method therefor, and relat...

Method and procedure for miniaturing a multi-layer PCB

Sensor interposer employing castellated through-vias

Mating backplane for high speed, high density electrical connector

Microelectronic assemblies having conductive structures with differ...

Board having conductive layer for shielding electronic component an...

Thermally enhanced semiconductor package with at least one heat ext...

Electrostatic discharge protection for sensors in wound therapy

Flexible printed circuit board and display device

Printed circuit board (PCB) including heatsinks

Printed-circuit isolation barrier for co-site interference mitigation

Heatsink based power delivery for CPUs

Printed circuit board for galvanic effect reduction

Multi-functional PCB for assembling GaN-based power converter and m...

Electronic device and circuit board module thereof

Power converter

Test element support

Patents Applicationslast 30 patents

CIRCUIT BOARD MODULE AND TOUCH DISPLAY APPARATUS

SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF STORAGE DEVICES

BIOPOLYMER-BASED ELECTROMAGENTIC INTERFERRENCE SHIELDING MATERIALS

ELECTRONIC APPARATUS

HEATSINK BASED POWER DELIVERY FOR CPUS

Electronic Device

SURGE PROTECTIVE DEVICES

TECHNOLOGIES FOR A FLEXIBLE 3D POWER PLANE IN A CHASSIS

WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC U...

Thermal Conduction - Electrical Conduction Isolated Circuit Board w...

CIRCUIT BOARD UNIT AND ELECTRONIC APPARATUS

THERMAL SUBSTRATE WITH HIGH-RESISTANCE MAGNIFICATION AND POSITIVE T...

Carrier Substrate

SYSTEM AND APPARATUS FOR FACILITATING ROBUST AUTOMOTIVE ETHERNET

CIRCUIT BOARD AND ELECTRONIC COMPONENT

ELECTRICAL DEVICE

ELECTRONIC DEVICE

Flexible Connector with Permeability Shield to Reduce Antenna Loss

LIGHT-EMITTING MODULE, METHOD OF MANUFACTURING WIRING SUBSTRATE, AN...

ISOLATOR

PRINTED CIRCUIT BOARD

Power Supply Cooling Structure

PRINTED CIRCUIT BOARD ASSEMBLY EMBEDDED THERMAL MANAGEMENT SYSTEM U...

PRINTED WIRING BOARD AND INFORMATION PROCESSING APPARATUS

ELECTROSTATIC DISCHARGE PROTECTION ARRANGEMENT FOR FREQUENCY CONVERTER

OUTLET HEAT SINK FOR COOLING SYSTEM OF A SUPERCOMPUTER ELECTRONIC B...

WIRING BASE AND ELECTRONIC DEVICE

POWER MODULE

ELECTRONIC CONTROL DEVICE AND GROUND LINE ROUTING METHOD

TEXTURED METAL CORE PRINTED CIRCUIT BOARDS FOR IMPROVED THERMAL DIS...