Components thermally connected to metal substrates or heat-sinks by insert mounting

Industry

CPC
H05K1/021

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K1/00Printed circuits

Current Industry

H05K1/021Components thermally connected to metal substrates or heat-sinks by insert mounting

Industries

Patents Grantslast 30 patents

Information Patent Grant
Film-closure apparatus for plastic film material, printed circuit b...
- Patent number 12,145,324
- Issue date Nov 19, 2024
- Green Light Packaging Limited
- Mark Bonning
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method and procedure for miniaturing a multi-layer PCB
- Patent number 12,150,237
- Issue date Nov 19, 2024
- VEEA INC.
- Robert Migliorino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing shielded printed wiring board and shielded...
- Patent number 12,150,239
- Issue date Nov 19, 2024
- TATSUTA ELECTRIC WIRE & CABLE CO., LTD.
- Sirou Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic compatibility contact between metal castings and pr...
- Patent number 12,150,251
- Issue date Nov 19, 2024
- Harman International Industries, Incorporated
- Jianing Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device including shielding member and heat radiating str...
- Patent number 12,150,238
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Wansang Ryu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Voltage regulator module with inductor-cooled power stage
- Patent number 12,150,236
- Issue date Nov 19, 2024
- Infineon Technologies Austria AG
- Gerald Deboy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic compatibility contact between metal castings and pr...
- Patent number 12,150,252
- Issue date Nov 19, 2024
- Harman International Industries, Incorporated
- Jianing Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heater having flexible printed wiring board and method for manufact...
- Patent number 12,144,068
- Issue date Nov 12, 2024
- Nippon Mektron, Ltd.
- Garo Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High frequency module and communication device
- Patent number 12,144,104
- Issue date Nov 12, 2024
- Murata Manufacturing Co., Ltd.
- Tetsuro Harada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,144,106
- Issue date Nov 12, 2024
- TPK Auto Tech (Xiamen) Limited
- Li Hua Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resetting different pair skew of printed circuit board traces
- Patent number 12,137,518
- Issue date Nov 5, 2024
- Dell Products L.P.
- Sandor Farkas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bus bar link for battery cell interconnections in a battery module
- Patent number 12,134,323
- Issue date Nov 5, 2024
- CPS Technology Holdings LLC
- Matthew R. Tyler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Circuit board for high frequency transmission and shielding method
- Patent number 12,127,331
- Issue date Oct 22, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD
- Zhi Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic control device
- Patent number 12,127,330
- Issue date Oct 22, 2024
- Hitachi Astemo, Ltd.
- Kiyoharu Ozaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic equipment
- Patent number 12,127,332
- Issue date Oct 22, 2024
- Sony Interactive Entertainment Inc.
- Yuta Tamaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate and memory system
- Patent number 12,127,346
- Issue date Oct 22, 2024
- Kioxia Corporation
- Kazuyuki Niitsuma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power conversion device
- Patent number 12,119,756
- Issue date Oct 15, 2024
- Hitachi Industrial Equipment Systems Co., Ltd.
- Fumihiro Sato
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic device
- Patent number 12,120,820
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Keiichi Ichikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and method of manufacturing thereof
- Patent number 12,120,812
- Issue date Oct 15, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Hao-Yi Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including heat dissipation structure
- Patent number 12,120,853
- Issue date Oct 15, 2024
- Samsung Electronics Co., Ltd.
- Junwhon Uhm
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic module and electronic device
- Patent number 12,114,418
- Issue date Oct 8, 2024
- Huawei Technologies Co., Ltd.
- Yongyao Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-ground vias for improved signal integrity for high-speed seri...
- Patent number 12,114,419
- Issue date Oct 8, 2024
- Dell Products L.P.
- William Andrew Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radio frequency module
- Patent number 12,113,566
- Issue date Oct 8, 2024
- Murata Manufacturing Co., Ltd.
- Shou Matsumoto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Switch module for a power tool
- Patent number 12,113,402
- Issue date Oct 8, 2024
- BLACK & DECKER INC.
- Eric W. Wachter
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Circuit board and circuit module
- Patent number 12,108,520
- Issue date Oct 1, 2024
- Shinko Electric Industries Co., Ltd.
- Kazuhiro Yoshida
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board comprising via
- Patent number 12,108,531
- Issue date Oct 1, 2024
- LG Innotek Co., Ltd
- Kyo Hun Koo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, semiconductor device, and electronic device
- Patent number 12,108,522
- Issue date Oct 1, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Takashi Miyamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielding process for SIP packaging
- Patent number 12,107,053
- Issue date Oct 1, 2024
- Weifang Goertek Microelectronics Co., Ltd.
- Juncheng Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board and electronic device
- Patent number 12,108,521
- Issue date Oct 1, 2024
- GUANGZHOU FANGBANG ELECTRONICS CO., LTD
- Zhi Su
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector with ground terminals and shielding ground ter...
- Patent number 12,107,370
- Issue date Oct 1, 2024
- Dongguan Luxshare Technologies Co., Ltd.
- Bin Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL MODULE
- Publication number 20240389217
- Publication date Nov 21, 2024
- InnoLight Technology PTE. LTD.
- Long CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD DEVICE AND IMAGE FORMING APPARATUS
- Publication number 20240389218
- Publication date Nov 21, 2024
- RICOH COMPANY, LTD.
- Ryosuke KAWASAKI
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...
- Publication number 20240389219
- Publication date Nov 21, 2024
- Dell Products L.P.
- William Andrew Smith
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND SYSTEM OF ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING
- Publication number 20240389289
- Publication date Nov 21, 2024
- Intel Corporation
- Kari Mansukoski
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR ALIGNING CONTACT SURFACES OF AN ELECTRICAL AND/OR ELECTR...
- Publication number 20240381542
- Publication date Nov 14, 2024
- ROBERT BOSCH GmbH
- Jivan Kapoor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES
- Publication number 20240373544
- Publication date Nov 7, 2024
- Murata Manufacturing Co., Ltd.
- Jahangir AFSHARIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240373545
- Publication date Nov 7, 2024
- Siliconware Precision Industries Co., Ltd.
- Hsiang-Hua HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND IMAGE DISPLAY DEVICE INCLUDING SAME
- Publication number 20240373547
- Publication date Nov 7, 2024
- LG ELECTRONICS INC.
- Geumsub SIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240373558
- Publication date Nov 7, 2024
- Innolux Corporation
- Chin-Lung Ting
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONFORMAL ELECTROMAGNETIC INTERFERENCE SHIELDING FILM
- Publication number 20240373608
- Publication date Nov 7, 2024
- Microsoft Technology Licensing, LLC
- Jaejin LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CABLE ASSEMBLY WITH CROSSTALK BARRIER
- Publication number 20240373609
- Publication date Nov 7, 2024
- 3M Innovative Properties Company
- Alexander W. Barr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR WITH THERMAL EXPAN...
- Publication number 20240372426
- Publication date Nov 7, 2024
- INFINITUM ELECTRIC INC.
- Rich Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible Hybrid Interconnect Circuits
- Publication number 20240373546
- Publication date Nov 7, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COST EFFECTIVE, MASS PRODUCIBLE TEMPERATURE CONTROLLED THERMAL IMAG...
- Publication number 20240361191
- Publication date Oct 31, 2024
- Seek Thermal, Inc.
- William J. Parrish
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
- Publication number 20240365465
- Publication date Oct 31, 2024
- MURATA MANUFACTURING CO., LTD.
- Yoshihito OTSUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High Speed Communication Jack
- Publication number 20240364059
- Publication date Oct 31, 2024
- Sentinel Connector Systems, Inc.
- Brett D. Robinson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINATION OF CABLES FOR A CONNECTOR
- Publication number 20240356251
- Publication date Oct 24, 2024
- Cisco Technology, Inc.
- David Nozadze
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERFERENCE SHIELDING IN COMPACT ELECTRONIC DEVICES
- Publication number 20240357731
- Publication date Oct 24, 2024
- Plume Design, Inc.
- Miroslav SAMARDZIJA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VERTICAL CAVITY SURFACE EMITTING LASER DEVICE WITH AN INTEGRATED GR...
- Publication number 20240348008
- Publication date Oct 17, 2024
- Lumentum Operations LLC
- Siu Kwan CHEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Board Structure and Printed Circuit Board Detection...
- Publication number 20240341030
- Publication date Oct 10, 2024
- Advanced ACEBIOTEK CO., LTD.
- Yi-Ping Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD MODULE AND TOUCH DISPLAY APPARATUS
- Publication number 20240341028
- Publication date Oct 10, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Xianfeng YANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT SPREADER FOR MODIFIED EDGE COOLING
- Publication number 20240334616
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Keiji Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCED-CROSSTALK, INTEGRATED LOW-PROFILE CURRENT SENSOR PCB MODULE
- Publication number 20240329090
- Publication date Oct 3, 2024
- SCHNEIDER ELECTRIC USA, INC.
- Adrian Abdala Rendon Hernandez
- G01 - MEASURING TESTING
Information Patent Application
SYSTEM AND METHOD OF FABRICATING OBJECTS USING ADDITIVE MANUFACTURI...
- Publication number 20240324106
- Publication date Sep 26, 2024
- Advanced Printed Electronic Solutions LLC
- Richard Neill
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
CAMERA MODULE
- Publication number 20240314922
- Publication date Sep 19, 2024
- LG Innotek Co., Ltd.
- Sang Yeal HAN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DISPLAY DEVICE WITH TOUCH PANEL HAVING X, Y AND DUMMY ELECTRODES
- Publication number 20240310945
- Publication date Sep 19, 2024
- Paneltouch Technologies LLC
- Shinya HASHIMOTO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT SYSTEMS
- Publication number 20240312927
- Publication date Sep 19, 2024
- Snap Inc.
- Stephen Andrew Steger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Board Cooling Configurations
- Publication number 20240314917
- Publication date Sep 19, 2024
- Microsoft Technology Licensing, LLC
- Ruslan NAGIMOV
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wireless Ultrasonic Transducer Apparatus
- Publication number 20240307917
- Publication date Sep 19, 2024
- NATIONAL CHIN-YI UNIVERSITY OF TECHNOLOGY
- Jian-Xing Wu
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240306288
- Publication date Sep 12, 2024
- Hitachi Astemo, Ltd.
- Takashi OGURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Components thermally connected to metal substrates or heat-sinks by insert mounting

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Film-closure apparatus for plastic film material, printed circuit b...

Method and procedure for miniaturing a multi-layer PCB

Method for manufacturing shielded printed wiring board and shielded...

Electromagnetic compatibility contact between metal castings and pr...

Electronic device including shielding member and heat radiating str...

Voltage regulator module with inductor-cooled power stage

Electromagnetic compatibility contact between metal castings and pr...

Heater having flexible printed wiring board and method for manufact...

High frequency module and communication device

Electronic device

Resetting different pair skew of printed circuit board traces

Bus bar link for battery cell interconnections in a battery module

Circuit board for high frequency transmission and shielding method

Electronic control device

Electronic equipment

Substrate and memory system

Power conversion device

Electronic device

Circuit board and method of manufacturing thereof

Electronic device including heat dissipation structure

Electronic module and electronic device

Micro-ground vias for improved signal integrity for high-speed seri...

Radio frequency module

Switch module for a power tool

Circuit board and circuit module

Circuit board comprising via

Circuit board, semiconductor device, and electronic device

Shielding process for SIP packaging

Circuit board and electronic device

Electrical connector with ground terminals and shielding ground ter...

Patents Applicationslast 30 patents

OPTICAL MODULE

CIRCUIT BOARD DEVICE AND IMAGE FORMING APPARATUS

MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERI...

APPARATUS AND SYSTEM OF ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING

METHOD FOR ALIGNING CONTACT SURFACES OF AN ELECTRICAL AND/OR ELECTR...

CIRCUIT ASSEMBLY INCLUDING GALLIUM NITRIDE DEVICES

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD AND IMAGE DISPLAY DEVICE INCLUDING SAME

ELECTRONIC DEVICE

CONFORMAL ELECTROMAGNETIC INTERFERENCE SHIELDING FILM

CABLE ASSEMBLY WITH CROSSTALK BARRIER

AXIAL FIELD ROTARY ENERGY DEVICE WITH PCB STATOR WITH THERMAL EXPAN...

Flexible Hybrid Interconnect Circuits

COST EFFECTIVE, MASS PRODUCIBLE TEMPERATURE CONTROLLED THERMAL IMAG...

HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE

High Speed Communication Jack

TERMINATION OF CABLES FOR A CONNECTOR

INTERFERENCE SHIELDING IN COMPACT ELECTRONIC DEVICES

VERTICAL CAVITY SURFACE EMITTING LASER DEVICE WITH AN INTEGRATED GR...

Printed Circuit Board Structure and Printed Circuit Board Detection...

CIRCUIT BOARD MODULE AND TOUCH DISPLAY APPARATUS

HEAT SPREADER FOR MODIFIED EDGE COOLING

REDUCED-CROSSTALK, INTEGRATED LOW-PROFILE CURRENT SENSOR PCB MODULE

SYSTEM AND METHOD OF FABRICATING OBJECTS USING ADDITIVE MANUFACTURI...

CAMERA MODULE

DISPLAY DEVICE WITH TOUCH PANEL HAVING X, Y AND DUMMY ELECTRODES

CIRCUIT SYSTEMS

Circuit Board Cooling Configurations

Wireless Ultrasonic Transducer Apparatus

ELECTRONIC DEVICE