Composite multilayer circuits

Industry

CPC
H05K3/4688

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/4688Composite multilayer circuits

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Component carrier having a double dielectric layer and method of ma...
- Patent number 12,207,399
- Issue date Jan 21, 2025
- AT&S (Chongqing) Company Limited
- Jeesoo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluoroscopic imaging-compatible and X-ray dose reducing electromagn...
- Patent number 12,193,169
- Issue date Jan 7, 2025
- RadWave Technologies Inc.
- Lev Koyrakh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-dielectric printed circuit board
- Patent number 12,120,811
- Issue date Oct 15, 2024
- Intel Corporation
- Arvind S
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 12,051,616
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated component carrier with a thermoplastic structure
- Patent number 12,048,089
- Issue date Jul 23, 2024
- AT&SAustria Technologie & Systemtechnik
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wiring substrate
- Patent number 12,028,967
- Issue date Jul 2, 2024
- Avary Holding(Shenzhen)Co., Ltd.
- Mao-Feng Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double-sided circuit non-oxide-based ceramic substrate and method f...
- Patent number 12,028,984
- Issue date Jul 2, 2024
- Hitachi Power Solutions Co., Ltd.
- Hideaki Takemori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer resin substrate, and method of manufacturing multilayer...
- Patent number 11,963,294
- Issue date Apr 16, 2024
- Murata Manufacturing Co., Ltd.
- Tomohiro Furumura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer substrate and multilayer substrate
- Patent number 11,924,980
- Issue date Mar 5, 2024
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating asymmetric board
- Patent number 11,917,769
- Issue date Feb 27, 2024
- SHENZHEN KINWONG ELECTRONIC CO., LTD.
- Jun Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer line structure and method for manufacturing thereof
- Patent number 11,862,564
- Issue date Jan 2, 2024
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming through-hole, and substrate for flexible printed...
- Patent number 11,856,695
- Issue date Dec 26, 2023
- Nippon Mektron, Ltd.
- Toshihiro Higashira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board
- Patent number 11,706,878
- Issue date Jul 18, 2023
- INNOGRIT TECHNOLOGIES CO., LTD.
- Yanwen Bai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing the same
- Patent number 11,696,391
- Issue date Jul 4, 2023
- AVARY HOLDING (SHENZHEN) CO., LTD.
- Mao-Feng Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin substrate and method for manufacturing resin substrate
- Patent number 11,659,652
- Issue date May 23, 2023
- Murata Manufacturing Co., Ltd.
- Ryosuke Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing wiring board
- Patent number 11,653,444
- Issue date May 16, 2023
- Dai Nippon Printing Co., Ltd.
- Naoko Okimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board
- Patent number 11,641,715
- Issue date May 2, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Eun Sun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite part with integral electronic instrumentation circuit and...
- Patent number 11,639,916
- Issue date May 2, 2023
- SAFRAN
- Sabri Janfaoui
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
- Patent number 11,631,611
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a circuit board
- Patent number 11,627,668
- Issue date Apr 11, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Yong-Chao Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composite substrate and method for manufacturing composite substrate
- Patent number 11,596,063
- Issue date Feb 28, 2023
- Murata Manufacturing Co., Ltd.
- Tsuyoshi Katsube
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for hybrid glass and organic packaging for radi...
- Patent number 11,503,704
- Issue date Nov 15, 2022
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated component carrier with a thermoplastic structure
- Patent number 11,483,923
- Issue date Oct 25, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier and method of manufacturing the same
- Patent number 11,412,622
- Issue date Aug 9, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Kristl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded component package structure and manufacturing method thereof
- Patent number 11,296,030
- Issue date Apr 5, 2022
- Advanced Semiconductor Engineering, Inc.
- Yu-Ju Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin multilayer substrate and electronic apparatus
- Patent number 11,266,016
- Issue date Mar 1, 2022
- Murata Manufacturing Co., Ltd.
- Yusuke Kamitsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Line structure and a method for producing the same
- Patent number 11,217,530
- Issue date Jan 4, 2022
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing touch structure and touch structure
- Patent number 11,184,985
- Issue date Nov 23, 2021
- BOE Technology Group Co., Ltd.
- Jing Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,089,694
- Issue date Aug 10, 2021
- Ibiden Co., Ltd.
- Masashi Awazu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Configuring a sealing structure sealing a component embedded in a c...
- Patent number 11,081,416
- Issue date Aug 3, 2021
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Abderrazzaq Ifis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK
- Publication number 20250040028
- Publication date Jan 30, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Patrick LENHARDT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, LIGHT-EMITTING SUBSTRATE, BACKLIGHT MODULE, DISPLAY...
- Publication number 20240355978
- Publication date Oct 24, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Nianqi YAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240284606
- Publication date Aug 22, 2024
- IBIDEN CO., LTD.
- Toshiki FURUTANI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240268038
- Publication date Aug 8, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE, ELECTRONIC STRUCTURE AND MANUFACTURING METHOD T...
- Publication number 20240258121
- Publication date Aug 1, 2024
- Siliconware Precision Industries Co., Ltd.
- Yi-Ling CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME
- Publication number 20240237233
- Publication date Jul 11, 2024
- LG Innotek Co., Ltd.
- Jong Bae SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20240164028
- Publication date May 16, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Seon Ha Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240155777
- Publication date May 9, 2024
- InnoLux Corporation
- Yuan-Lin WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240155778
- Publication date May 9, 2024
- Shinko Electric Industries Co., Ltd.
- Akihiro TAKEUCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME
- Publication number 20240138077
- Publication date Apr 25, 2024
- LG Innotek Co., Ltd.
- Jong Bae SHIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240107685
- Publication date Mar 28, 2024
- IBIDEN CO., LTD.
- Susumu KAGOHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER LINE STRUCTURE
- Publication number 20240088040
- Publication date Mar 14, 2024
- DAI NIPPON PRINTING CO., LTD.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240074037
- Publication date Feb 29, 2024
- Innolux Corporation
- Yung-Chi Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF PROCESSING SUBSTRATE
- Publication number 20240040704
- Publication date Feb 1, 2024
- VIA MECHANICS, LTD.
- Yasushi ITO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN DIELECTRIC SUBSTRATE FOR LOW THERMAL RESISTANCE AND LOW PARASI...
- Publication number 20230352384
- Publication date Nov 2, 2023
- Lumentum Operations LLC
- Wei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20230292448
- Publication date Sep 14, 2023
- IBIDEN CO., LTD.
- Kentaro WADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230290716
- Publication date Sep 14, 2023
- LG Innotek Co., Ltd.
- Jae Hun JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUOROSCOPIC IMAGING-COMPATIBLE AND X-RAY DOSE REDUCING ELECTROMAGN...
- Publication number 20230284395
- Publication date Sep 7, 2023
- RadWave Technologies Inc.
- Lev Koyrakh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20230239998
- Publication date Jul 27, 2023
- Avary Holding(Shenzhen)Co., Ltd.
- Mao-Feng HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230189451
- Publication date Jun 15, 2023
- Samsung Electro-Mechanics Co., Ltd.
- Ki Hwan You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ASYMMETRIC BOARD
- Publication number 20230164927
- Publication date May 25, 2023
- SHENZHEN KINWONG ELECTRONIC CO., LTD.
- Jun WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230127697
- Publication date Apr 27, 2023
- Avary Holding(Shenzhen)Co., Ltd.
- Mao-Feng HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Coreless Component Carrier With Embedded Components
- Publication number 20230128938
- Publication date Apr 27, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Allen ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CONDUCTOR AND RECTIFIER PACKAGE FOR POWER TRANSFER
- Publication number 20230067293
- Publication date Mar 2, 2023
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Yanghe Liu
- B60 - VEHICLES IN GENERAL
Information Patent Application
Laminated Component Carrier With a Thermoplastic Structure
- Publication number 20230054846
- Publication date Feb 23, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Thomas Krivec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH JOINING TYPE MULTI-LAYER PRINTED CIRCUIT BOARD AND MANUFACTUR...
- Publication number 20220386479
- Publication date Dec 1, 2022
- TSE CO., LTD.
- Doo Hwan PARK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME
- Publication number 20220369475
- Publication date Nov 17, 2022
- Avary Holding (Shenzhen) Co., Limited.
- YONG-CHAO WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20220322533
- Publication date Oct 6, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Eun Sun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Double-Sided Circuit Non-Oxide-Based Ceramic Substrate and Method f...
- Publication number 20220248537
- Publication date Aug 4, 2022
- Hitachi Power Solutions Co., Ltd.
- Hideaki TAKEMORI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer Circuit Board
- Publication number 20220217851
- Publication date Jul 7, 2022
- INNOGRIT TECHNOLOGIES CO., LTD
- Yanwen BAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Composite multilayer circuits

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Component carrier having a double dielectric layer and method of ma...

Fluoroscopic imaging-compatible and X-ray dose reducing electromagn...

Multi-dielectric printed circuit board

Wafer level chip scale packaging intermediate structure apparatus a...

Laminated component carrier with a thermoplastic structure

Method of manufacturing wiring substrate

Double-sided circuit non-oxide-based ceramic substrate and method f...

Multilayer resin substrate, and method of manufacturing multilayer...

Method for manufacturing multilayer substrate and multilayer substrate

Method for fabricating asymmetric board

Multi-layer line structure and method for manufacturing thereof

Method for forming through-hole, and substrate for flexible printed...

Multilayer circuit board

Wiring substrate and method of manufacturing the same

Resin substrate and method for manufacturing resin substrate

Wiring board and method for manufacturing wiring board

Printed circuit board

Composite part with integral electronic instrumentation circuit and...

Wafer level chip scale packaging intermediate structure apparatus a...

Method for manufacturing a circuit board

Composite substrate and method for manufacturing composite substrate

Systems and methods for hybrid glass and organic packaging for radi...

Laminated component carrier with a thermoplastic structure

Component carrier and method of manufacturing the same

Embedded component package structure and manufacturing method thereof

Resin multilayer substrate and electronic apparatus

Line structure and a method for producing the same

Method of manufacturing touch structure and touch structure

Printed wiring board and method for manufacturing printed wiring board

Configuring a sealing structure sealing a component embedded in a c...

Patents Applicationslast 30 patents

RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK

CIRCUIT BOARD, LIGHT-EMITTING SUBSTRATE, BACKLIGHT MODULE, DISPLAY...

WIRING SUBSTRATE

PRINTED WIRING BOARD

ELECTRONIC PACKAGE, ELECTRONIC STRUCTURE AND MANUFACTURING METHOD T...

CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

ELECTRONIC DEVICE

WIRING SUBSTRATE

CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME

PRINTED WIRING BOARD

MULTI-LAYER LINE STRUCTURE

METHOD OF MANUFACTURING ELECTRONIC DEVICE

METHOD OF PROCESSING SUBSTRATE

THIN DIELECTRIC SUBSTRATE FOR LOW THERMAL RESISTANCE AND LOW PARASI...

PRINTED WIRING BOARD

CIRCUIT BOARD

FLUOROSCOPIC IMAGING-COMPATIBLE AND X-RAY DOSE REDUCING ELECTROMAGN...

METHOD OF MANUFACTURING WIRING SUBSTRATE

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR FABRICATING ASYMMETRIC BOARD

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Coreless Component Carrier With Embedded Components

PRINTED CONDUCTOR AND RECTIFIER PACKAGE FOR POWER TRANSFER

Laminated Component Carrier With a Thermoplastic Structure

BATCH JOINING TYPE MULTI-LAYER PRINTED CIRCUIT BOARD AND MANUFACTUR...

CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD

Double-Sided Circuit Non-Oxide-Based Ceramic Substrate and Method f...

Multilayer Circuit Board