Compression bonding

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H01L2224/81201

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/81201Compression bonding

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Camera module, and photosensitive assembly and manufacturing method...
- Patent number 12,211,864
- Issue date Jan 28, 2025
- NINGBO SUNNY OPOTECH CO., LTD.
- Zhongyu Luan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic component
- Patent number 12,191,278
- Issue date Jan 7, 2025
- CONNECTEC AMERICA, INC.
- Katsunori Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures and methods for forming the same
- Patent number 12,148,725
- Issue date Nov 19, 2024
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillars as stops for precise chip-to-chip separation
- Patent number 12,142,590
- Issue date Nov 12, 2024
- Google LLC
- Erik Anthony Lucero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,119,323
- Issue date Oct 15, 2024
- Kioxia Corporation
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supporting backplane, manufacturing method therefor and backplane
- Patent number 12,087,892
- Issue date Sep 10, 2024
- BOE Technology Group Co., Ltd.
- Zhiwei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybridization bumps for fine pitch sensor arrays
- Patent number 12,051,665
- Issue date Jul 30, 2024
- Sensors Unlimited, Inc.
- Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die, a semiconductor die stack, and a semiconductor m...
- Patent number 12,046,573
- Issue date Jul 23, 2024
- SK hynix Inc.
- Jin Woong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driving substrate and manufacturing method thereof, and micro LED b...
- Patent number 11,894,353
- Issue date Feb 6, 2024
- BOE Technology Group Co., Ltd.
- Zhiwei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillars as stops for precise chip-to-chip separation
- Patent number 11,842,973
- Issue date Dec 12, 2023
- Google LLC
- Erik Anthony Lucero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package and semiconductor device
- Patent number 11,784,201
- Issue date Oct 10, 2023
- Canon Kabushiki Kaisha
- Kazuya Notsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding interconnection using laser and thermal compression
- Patent number 11,749,637
- Issue date Sep 5, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Min Ho Kim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric molded indium bump formation and INP planarization
- Patent number 11,694,981
- Issue date Jul 4, 2023
- Princeton Infrared Technologies, Inc.
- Martin H Ettenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-in-package with double-sided molding
- Patent number 11,670,618
- Issue date Jun 6, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillars as stops for precise chip-to-chip separation
- Patent number 11,574,885
- Issue date Feb 7, 2023
- Google LLC
- Erik Anthony Lucero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Bonding apparatus and method for using the same
- Patent number 11,552,044
- Issue date Jan 10, 2023
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- G02 - OPTICS
Information Patent Grant
Method and apparatus for embedding semiconductor devices
- Patent number 11,538,699
- Issue date Dec 27, 2022
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of bonding of semiconductor elements to substrates, and rel...
- Patent number 11,515,286
- Issue date Nov 29, 2022
- Kulicke and Soffa Industries, Inc.
- Adeel Ahmad Bajwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,515,202
- Issue date Nov 29, 2022
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 11,476,230
- Issue date Oct 18, 2022
- Kioxia Corporation
- Soichi Homma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming an integrated SiP module...
- Patent number 11,367,690
- Issue date Jun 21, 2022
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,289,372
- Issue date Mar 29, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced adhesive materials and processes for 3D applications
- Patent number 11,168,234
- Issue date Nov 9, 2021
- International Business Machines Corporation
- James L. Hedrick
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Superconducting bump bonds
- Patent number 11,133,450
- Issue date Sep 28, 2021
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packaging with low-force thermocompression bonding of oxidizable...
- Patent number 11,134,598
- Issue date Sep 28, 2021
- SET North America, LLC
- Eric Frank Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superconducting bump bonds
- Patent number 11,133,451
- Issue date Sep 28, 2021
- Google LLC
- Joshua Yousouf Mutus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 11,011,418
- Issue date May 18, 2021
- INVENSAS BONDING TECHNOLOGIES, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driving chip, display substrate, display device and method for manu...
- Patent number 10,971,465
- Issue date Apr 6, 2021
- BOE Technology Group Co., Ltd.
- Liqiang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method for using the same
- Patent number 10,923,453
- Issue date Feb 16, 2021
- Samsung Display Co., Ltd.
- Byoung Yong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level integration including design/co-design, structure proce...
- Patent number 10,811,305
- Issue date Oct 20, 2020
- International Business Machines Corporation
- Li-Wen Hung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062177
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Han Min LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PARTIALLY FLATTENING A SUBSTRATE, BONDING...
- Publication number 20250022836
- Publication date Jan 16, 2025
- Stroke Precision Advanced Engineering Co., Ltd.
- Chingju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP MOUNTING STRUCTURE AND FLIP-CHIP MOUNTING METHOD
- Publication number 20240387444
- Publication date Nov 21, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- TAKAHIRO KUMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20240332241
- Publication date Oct 3, 2024
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER SUBSTRATE AND METHOD FOR PRODUCING DEVICE USING THE INTE...
- Publication number 20240321705
- Publication date Sep 26, 2024
- Tanaka Kikinzoku Kogyo K.K.
- Koichi SAKAIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...
- Publication number 20240258258
- Publication date Aug 1, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Shih-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240234357
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- JEONGWEON SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION
- Publication number 20240162179
- Publication date May 16, 2024
- Google LLC
- Erik Anthony Lucero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS CONFIGURED TO TRANSFER ELECTRONIC COMPONENT, METHOD FOR B...
- Publication number 20240145427
- Publication date May 2, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Chingju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128217
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR BOND...
- Publication number 20240105671
- Publication date Mar 28, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240047446
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING METHOD
- Publication number 20240038705
- Publication date Feb 1, 2024
- Institute of Semiconductors, Guangdong Academy of Sciences
- Yunzhi LING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ION MICROTRAP ASSEMBLY AND METHOD OF MAKING OF MAKING SUCH AN ASSEMBLY
- Publication number 20230402362
- Publication date Dec 14, 2023
- NPL Management Limited
- Alastair SINCLAIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230402424
- Publication date Dec 14, 2023
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR BGA COPLANARITY AND WARPAGE CONTROL
- Publication number 20230395559
- Publication date Dec 7, 2023
- NVIDIA Corporation
- Dongji Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPRESSION SYSTEM CALIBRATION
- Publication number 20230378120
- Publication date Nov 23, 2023
- The Boeing Company
- Peter D. Brewer
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BUMP STRUCTURES FOR LOW TEMPERATURE CHIP BONDING
- Publication number 20230369270
- Publication date Nov 16, 2023
- Northrop Grumman Systems Corporation
- JUSTIN C. HACKLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP BONDING METHOD AND CHIP USED THEREIN
- Publication number 20230326894
- Publication date Oct 12, 2023
- Chipbond Technology Corporation
- Fei-Jain Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRIDIZATION BUMPS FOR FINE PITCH SENSOR ARRAYS
- Publication number 20230307398
- Publication date Sep 28, 2023
- Sensors Unlimited, Inc.
- Wei Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20230238344
- Publication date Jul 27, 2023
- Kabushiki Kaisha Toshiba
- Tomohiro SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Joining and Insulating Power Electronic Semiconductor Components
- Publication number 20230215838
- Publication date Jul 6, 2023
- SIEMENS AKTIENGESELLSCHAFT
- Bernd Müller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE INCLUDING A WIRING PAD AND METHOD FOR MANUFACTURING...
- Publication number 20230207573
- Publication date Jun 29, 2023
- SAMSUNG DISPLAY CO., LTD.
- JI WOONG CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING LIGHT-EMITTING UNIT AND LIGHT-EMITTING UNIT
- Publication number 20230207756
- Publication date Jun 29, 2023
- Nichia Corporation.
- Motokazu YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION
- Publication number 20230187401
- Publication date Jun 15, 2023
- Google LLC
- Erik Anthony Lucero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...
- Publication number 20230139612
- Publication date May 4, 2023
- SK HYNIX INC.
- Jin Woong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTING BACKPLANE, MANUFACTURING METHOD THEREFOR AND BACKPLANE
- Publication number 20230131247
- Publication date Apr 27, 2023
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhiwei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR USING A BUFFER SHEET
- Publication number 20230095879
- Publication date Mar 30, 2023
- Showa Denko Materials Co., Ltd.
- Yuta Koseki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL AND CONNECTION METHOD
- Publication number 20230075929
- Publication date Mar 9, 2023
- SONY GROUP CORPORATION
- JO UMEZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL FILM FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURI...
- Publication number 20230027838
- Publication date Jan 26, 2023
- Doosan Corporation
- Taejin CHOI
- H01 - BASIC ELECTRIC ELEMENTS

Compression bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Camera module, and photosensitive assembly and manufacturing method...

Method for manufacturing electronic component

Bonding structures and methods for forming the same

Pillars as stops for precise chip-to-chip separation

Semiconductor device and method of manufacturing semiconductor device

Supporting backplane, manufacturing method therefor and backplane

Hybridization bumps for fine pitch sensor arrays

Semiconductor die, a semiconductor die stack, and a semiconductor m...

Driving substrate and manufacturing method thereof, and micro LED b...

Pillars as stops for precise chip-to-chip separation

Package and semiconductor device

Hybrid bonding interconnection using laser and thermal compression

Dielectric molded indium bump formation and INP planarization

System-in-package with double-sided molding

Pillars as stops for precise chip-to-chip separation

Bonding apparatus and method for using the same

Method and apparatus for embedding semiconductor devices

Methods of bonding of semiconductor elements to substrates, and rel...

3D IC method and device

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and method of forming an integrated SiP module...

3D IC method and device

Enhanced adhesive materials and processes for 3D applications

Superconducting bump bonds

3D packaging with low-force thermocompression bonding of oxidizable...

Superconducting bump bonds

3D IC method and device

Driving chip, display substrate, display device and method for manu...

Bonding apparatus and method for using the same

Wafer level integration including design/co-design, structure proce...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

APPARATUS AND METHOD FOR PARTIALLY FLATTENING A SUBSTRATE, BONDING...

FLIP-CHIP MOUNTING STRUCTURE AND FLIP-CHIP MOUNTING METHOD

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

INTERPOSER SUBSTRATE AND METHOD FOR PRODUCING DEVICE USING THE INTE...

SEMICONDUCTOR PACKAGE INCLUDING BALL GRID ARRAY CONNECTIONS WITH IM...

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION

APPARATUS CONFIGURED TO TRANSFER ELECTRONIC COMPONENT, METHOD FOR B...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

APPARATUS FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR BOND...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

SUBSTRATE BONDING METHOD

ION MICROTRAP ASSEMBLY AND METHOD OF MAKING OF MAKING SUCH AN ASSEMBLY

SEMICONDUCTOR PACKAGE

APPARATUS AND METHOD FOR BGA COPLANARITY AND WARPAGE CONTROL

COMPRESSION SYSTEM CALIBRATION

BUMP STRUCTURES FOR LOW TEMPERATURE CHIP BONDING

FLIP CHIP BONDING METHOD AND CHIP USED THEREIN

HYBRIDIZATION BUMPS FOR FINE PITCH SENSOR ARRAYS

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME

Joining and Insulating Power Electronic Semiconductor Components

DISPLAY DEVICE INCLUDING A WIRING PAD AND METHOD FOR MANUFACTURING...

METHOD FOR PRODUCING LIGHT-EMITTING UNIT AND LIGHT-EMITTING UNIT

PILLARS AS STOPS FOR PRECISE CHIP-TO-CHIP SEPARATION

SEMICONDUCTOR DIE, A SEMICONDUCTOR DIE STACK, A SEMICONDUCTOR MODUL...

SUPPORTING BACKPLANE, MANUFACTURING METHOD THEREFOR AND BACKPLANE

METHOD FOR USING A BUFFER SHEET

TERMINAL AND CONNECTION METHOD

UNDERFILL FILM FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURI...