Compression bonding

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H01L2224/84201

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/84201Compression bonding

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Patents Grantslast 30 patents

Information Patent Grant
Conductor strip with contact areas having cutouts
- Patent number 9,406,592
- Issue date Aug 2, 2016
- Continental Automotive GmbH
- Nico Kohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including underfill layers
- Patent number 8,816,509
- Issue date Aug 26, 2014
- Samsung Electronics Co., Ltd.
- Ji-Seok Hong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH BACKSIDE LEAD FOR CLOCK TREE OR POW...
- Publication number 20230290765
- Publication date Sep 14, 2023
- MICROCHIP TECHNOLOGY INCORPORATED
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND JIG SET
- Publication number 20230154889
- Publication date May 18, 2023
- Fuji Electric Co., Ltd.
- Manabu ISHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CIRCUIT AND METHOD FOR PRODUCING THE SEMICONDUCTOR CI...
- Publication number 20150357303
- Publication date Dec 10, 2015
- CONTINENTAL AUTOMOTIVE GMBH
- Nico Kohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20130193588
- Publication date Aug 1, 2013
- Samsung Electronics Co., Ltd.
- Ji-Seok Hong
- H01 - BASIC ELECTRIC ELEMENTS