comprising an eutectic alloy

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H01L2224/32502

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/32502comprising an eutectic alloy

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Photocoupler
- Patent number 11,688,823
- Issue date Jun 27, 2023
- Kabushiki Kaisha Toshiba
- Mami Fujihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,276,629
- Issue date Mar 15, 2022
- Kabushiki Kaisha Toshiba
- Fumiyoshi Kawashiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-junction LED with eutectic bonding and method of manufacturin...
- Patent number 11,251,167
- Issue date Feb 15, 2022
- SUNDIODE KOREA
- James Chinmo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and methods of packaging thereof
- Patent number 10,297,583
- Issue date May 21, 2019
- Infineon Technologies AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for eutectic bonding
- Patent number 9,935,077
- Issue date Apr 3, 2018
- Robert Bosch GmbH
- Ralf Hausner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power radio frequency amplifier architecture
- Patent number 9,742,445
- Issue date Aug 22, 2017
- BAE Systems Information and Electronic Systems Integration Inc.
- Robert Actis
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Substrate composite, method and device for bonding of substrates
- Patent number 9,682,539
- Issue date Jun 20, 2017
- Erich Thallner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-power electronic device packages and methods
- Patent number 9,601,327
- Issue date Mar 21, 2017
- The Board of Regents of the University of Oklahoma
- Patrick J. McCann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an embedded surface mount device and...
- Patent number 9,589,938
- Issue date Mar 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 9,589,871
- Issue date Mar 7, 2017
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package assembly and manufacturing method thereof
- Patent number 9,508,677
- Issue date Nov 29, 2016
- Silergy Semiconductor Technology (Hangzhou) Ltd.
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an embedded surface mount device an...
- Patent number 9,461,020
- Issue date Oct 4, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Der-Chyang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die substrate assembly and method
- Patent number 9,324,674
- Issue date Apr 26, 2016
- Ampleon Netherlands B.V.
- Johannes Wilhelmus van Rijckevorsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed wafer packages
- Patent number 9,287,237
- Issue date Mar 15, 2016
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an embedded surface mount device and...
- Patent number 9,224,709
- Issue date Dec 29, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eutectic solder structure for chip
- Patent number 9,214,443
- Issue date Dec 15, 2015
- Lextar Electronics Corporation
- Yi-Jyun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding wafers and structure of bonding part
- Patent number 9,136,232
- Issue date Sep 15, 2015
- Omron Corporation
- Takeshi Fujiwara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor composite apparatus, method for manufacturing the sem...
- Patent number 9,093,562
- Issue date Jul 28, 2015
- Oki Data Corporation
- Mitsuhiko Ogihara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Semiconductor device and power source device
- Patent number 9,082,756
- Issue date Jul 14, 2015
- Fujitsu Limited
- Kozo Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed wafer packages
- Patent number 8,975,105
- Issue date Mar 10, 2015
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and methods of packaging thereof
- Patent number 8,846,452
- Issue date Sep 30, 2014
- Infineon Technologies AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method of semiconductor device,...
- Patent number 8,728,867
- Issue date May 20, 2014
- Fujitsu Limited
- Kozo Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding with metal germanium silicon material
- Patent number 8,592,926
- Issue date Nov 26, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Substrate bonding with metal germanium silicon material
- Patent number 8,058,143
- Issue date Nov 15, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Flip-chip packaging method for light emitting diode with eutectic l...
- Patent number 7,569,420
- Issue date Aug 4, 2009
- Huga Optotech Inc.
- Ching-Wen Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip packaging structure for light emitting diode and method t...
- Patent number 7,408,204
- Issue date Aug 5, 2008
- Huga Optotech Inc.
- Ching-Wen Tung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL JOINTED BODY, SEMICONDUCTOR DEVICE, WAVE GUIDE TUBE, AND METH...
- Publication number 20230054798
- Publication date Feb 23, 2023
- Mitsubishi Electric Corporation
- Takashi IJIMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID METAL THERMAL INTERFACE
- Publication number 20220375817
- Publication date Nov 24, 2022
- Indium Corporation
- Ross B. Berntson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Chip Integration of III-Nitride-based Materials for O...
- Publication number 20220278073
- Publication date Sep 1, 2022
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- John Michael Dallesasse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210090903
- Publication date Mar 25, 2021
- Kabushiki Kaisha Toshiba
- Tatsuo Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210035893
- Publication date Feb 4, 2021
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-JUNCTION LED WITH EUTECTIC BONDING AND METHOD OF MANUFACTURIN...
- Publication number 20200402964
- Publication date Dec 24, 2020
- SUNDIODE KOREA
- James Chinmo KIM
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
PHOTOCOUPLER
- Publication number 20200161494
- Publication date May 21, 2020
- Kabushiki Kaisha Toshiba
- Mami Fujihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interconnect Structure a...
- Publication number 20170062390
- Publication date Mar 2, 2017
- STATS ChipPAC Pte Ltd.
- Linda Pei Ee Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160300782
- Publication date Oct 13, 2016
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE ASSEMBLY AND MANUFACTURING METHOD THEREOF
- Publication number 20160284663
- Publication date Sep 29, 2016
- SILERGY SEMICONDUCTOR TECHNOLOGY (HANGZHOU) LTD
- Jiaming Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CONNECTING A SUBSTRATE AND CHIP ASSEMBLY
- Publication number 20160126165
- Publication date May 5, 2016
- INFINEON TECHNOLOGIES AG
- Paul FRANK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Power Electronic Device Packages and Methods
- Publication number 20160049351
- Publication date Feb 18, 2016
- BOARD OF REGENTS UNIVERSITY OF OKLAHOMA
- Patrick J. McCann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED SURFACE MOUNT DEVICE AND...
- Publication number 20150228606
- Publication date Aug 13, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SUBSTRATE ASSEMBLY AND METHOD
- Publication number 20150179599
- Publication date Jun 25, 2015
- NXP B.V.
- Johannes Wilhelmus van Rijckevorsel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EUTECTIC SOLDER STRUCTURE FOR CHIP
- Publication number 20150108650
- Publication date Apr 23, 2015
- Lextar Electronics Corporation
- Yi-Jyun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING WAFERS AND STRUCTURE OF BONDING PART
- Publication number 20140339710
- Publication date Nov 20, 2014
- Takeshi Fujiwara
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20140235016
- Publication date Aug 21, 2014
- SIGETRONICS Inc.
- Jong-Moon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND POWER SOURCE DEVICE
- Publication number 20140203444
- Publication date Jul 24, 2014
- Fujitsu Limited
- Kozo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package and Methods of Packaging Thereof
- Publication number 20140057393
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Dietrich Bonart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20130234298
- Publication date Sep 12, 2013
- Kabushiki Kaisha Toshiba
- Satoshi MITSUGI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HERMETICALLY SEALED WAFER PACKAGES
- Publication number 20120319261
- Publication date Dec 20, 2012
- Raytheon Company
- Cody B. Moody
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE,...
- Publication number 20120211901
- Publication date Aug 23, 2012
- FUJITSU LIMITED
- Kozo SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL
- Publication number 20120068325
- Publication date Mar 22, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Ruben B. Montez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor composite apparatus, method for manufacturing the sem...
- Publication number 20110081738
- Publication date Apr 7, 2011
- Oki Data Corporation
- Mitsuhiko Ogihara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL
- Publication number 20100181676
- Publication date Jul 22, 2010
- RUBEN B. MONTEZ
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Chip Package System Vertical Interconnect
- Publication number 20100084755
- Publication date Apr 8, 2010
- Mark Allen Gerber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip-Chip Packaging Structure For Light Emitting Diode And Method T...
- Publication number 20090124031
- Publication date May 14, 2009
- Ching-Wen Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-Chip Packaging Structure for Light Emitting Diode and Method T...
- Publication number 20080121920
- Publication date May 29, 2008
- HUGA OPTOTECH INC.
- Ching-Wen TUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor composite apparatus, method for manufacturing the sem...
- Publication number 20060097354
- Publication date May 11, 2006
- Mitsuhiko Ogihara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

comprising an eutectic alloy

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Photocoupler

Semiconductor device

Multi-junction LED with eutectic bonding and method of manufacturin...

Semiconductor device package and methods of packaging thereof

Apparatus for eutectic bonding

High power radio frequency amplifier architecture

Substrate composite, method and device for bonding of substrates

High-power electronic device packages and methods

Semiconductor device including an embedded surface mount device and...

Semiconductor package structure and method for manufacturing the same

Chip package assembly and manufacturing method thereof

Semiconductor package including an embedded surface mount device an...

Die substrate assembly and method

Hermetically sealed wafer packages

Semiconductor device including an embedded surface mount device and...

Eutectic solder structure for chip

Method for bonding wafers and structure of bonding part

Semiconductor composite apparatus, method for manufacturing the sem...

Semiconductor device and power source device

Hermetically sealed wafer packages

Semiconductor device package and methods of packaging thereof

Semiconductor device, manufacturing method of semiconductor device,...

Substrate bonding with metal germanium silicon material

Substrate bonding with metal germanium silicon material

Flip-chip packaging method for light emitting diode with eutectic l...

Flip-chip packaging structure for light emitting diode and method t...

Patents Applicationslast 30 patents

METAL JOINTED BODY, SEMICONDUCTOR DEVICE, WAVE GUIDE TUBE, AND METH...

LIQUID METAL THERMAL INTERFACE

Heterogeneous Chip Integration of III-Nitride-based Materials for O...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

MULTI-JUNCTION LED WITH EUTECTIC BONDING AND METHOD OF MANUFACTURIN...

PHOTOCOUPLER

Semiconductor Device and Method of Forming Interconnect Structure a...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

CHIP PACKAGE ASSEMBLY AND MANUFACTURING METHOD THEREOF

METHOD OF CONNECTING A SUBSTRATE AND CHIP ASSEMBLY

High-Power Electronic Device Packages and Methods

SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED SURFACE MOUNT DEVICE AND...

DIE SUBSTRATE ASSEMBLY AND METHOD

EUTECTIC SOLDER STRUCTURE FOR CHIP

METHOD FOR BONDING WAFERS AND STRUCTURE OF BONDING PART

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND POWER SOURCE DEVICE

Semiconductor Device Package and Methods of Packaging Thereof

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

HERMETICALLY SEALED WAFER PACKAGES

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE,...

SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL

Semiconductor composite apparatus, method for manufacturing the sem...

SUBSTRATE BONDING WITH METAL GERMANIUM SILICON MATERIAL

Semiconductor Chip Package System Vertical Interconnect

Flip-Chip Packaging Structure For Light Emitting Diode And Method T...

Flip-Chip Packaging Structure for Light Emitting Diode and Method T...

Semiconductor composite apparatus, method for manufacturing the sem...