comprising an intermetallic compound

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CPC
H01L2224/32503

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/32503comprising an intermetallic compound

Industries

Patents Grantslast 30 patents

Information Patent Grant
Diffusion soldering with contaminant protection
- Patent number 12,087,723
- Issue date Sep 10, 2024
- Infineon Technologies Austria AG
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal joint, metal joint production method, semiconductor device, a...
- Patent number 12,076,967
- Issue date Sep 3, 2024
- Mitsubishi Electric Corporation
- Takashi Ijima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating a semiconductor device
- Patent number 11,817,417
- Issue date Nov 14, 2023
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Diffusion soldering with contaminant protection
- Patent number 11,610,861
- Issue date Mar 21, 2023
- Infineon Technologies Austria AG
- Victor Verdugo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering a conductor to an aluminum layer
- Patent number 11,424,217
- Issue date Aug 23, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced solder alloys for electronic interconnects
- Patent number 11,411,150
- Issue date Aug 9, 2022
- Alpha Assembly Solutions Inc.
- Morgana de Avila Ribas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,380,862
- Issue date Jul 5, 2022
- Apple Inc.
- Andreas Bibi
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Non-eutectic bonding
- Patent number 11,141,810
- Issue date Oct 12, 2021
- TECHNI HOLDING AS
- Andreas Larsson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy and junction structure using same
- Patent number 11,135,683
- Issue date Oct 5, 2021
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Hidetoshi Kitaura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic packaging structure
- Patent number 11,114,387
- Issue date Sep 7, 2021
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser bonding method
- Patent number 11,107,790
- Issue date Aug 31, 2021
- Electronics and Telecommunications Research Institute
- Kwang-Seong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure and method of manufacturing the same
- Patent number 11,094,661
- Issue date Aug 17, 2021
- Kabushiki Kaisha Toyota Chuo Kenkyusho
- Hirofumi Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 10,964,900
- Issue date Mar 30, 2021
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated stress mitigation layer and power electronic assemblie...
- Patent number 10,879,209
- Issue date Dec 29, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronic assemblies with high purity aluminum plated substr...
- Patent number 10,804,236
- Issue date Oct 13, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack type power module and method of manufacturing the same
- Patent number 10,748,834
- Issue date Aug 18, 2020
- Hyundai Motor Company
- Kwang-Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated stress mitigation layer and power electronic assemblie...
- Patent number 10,700,036
- Issue date Jun 30, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 10,636,766
- Issue date Apr 28, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die with metallized sidewall and method of manufacturing
- Patent number 10,535,588
- Issue date Jan 14, 2020
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing electronic device with multi-layer contact
- Patent number 10,475,761
- Issue date Nov 12, 2019
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 10,411,210
- Issue date Sep 10, 2019
- Apple Inc.
- Andreas Bibl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 10,312,211
- Issue date Jun 4, 2019
- Toyota Jidosha Kabushiki Kaisha
- Takuya Kadoguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,249,604
- Issue date Apr 2, 2019
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,211,194
- Issue date Feb 19, 2019
- Samsung Electronics Co., Ltd.
- Kunmo Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-transfer printing with volatile adhesive layer
- Patent number 10,157,880
- Issue date Dec 18, 2018
- X-CELEPRINT LIMITED
- Salvatore Bonafede
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Core-Shell Particle Die-Attach Material
- Publication number 20240182757
- Publication date Jun 6, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding
- Publication number 20240105545
- Publication date Mar 28, 2024
- Apple Inc.
- Jiongxin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Power Semiconductor Device
- Publication number 20240096842
- Publication date Mar 21, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240071875
- Publication date Feb 29, 2024
- Rohm Co., Ltd.
- Hiroyuki TAJIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Fabricating a Semiconductor Device
- Publication number 20240038714
- Publication date Feb 1, 2024
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20240008298
- Publication date Jan 4, 2024
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
DELAMINATION/CRACKING IMPROVEMENT AT SOLDER JOINTS IN MICROELECTRON...
- Publication number 20230326899
- Publication date Oct 12, 2023
- Qorvo US, Inc.
- Yinbao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MATERIAL, LAYER STRUCTURE, CHIP PACKAGE, METHOD OF FORMING A...
- Publication number 20230095749
- Publication date Mar 30, 2023
- Alexander Heinrich
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20230078615
- Publication date Mar 16, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Yasuaki YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM HAVING INTERMETALLIC CONNECTION STRUCTURE WITH CE...
- Publication number 20230027669
- Publication date Jan 26, 2023
- INFINEON TECHNOLOGIES AG
- Chee Yang NG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20220293876
- Publication date Sep 15, 2022
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
TRANSISTOR PACKAGES WITH IMPROVED DIE ATTACH
- Publication number 20220139852
- Publication date May 5, 2022
- Cree, Inc.
- Arthur Pun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER BONDING METHOD AND A SEMICONDUCTOR PACKAGE INCLUDING A BONDIN...
- Publication number 20210358885
- Publication date Nov 18, 2021
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kwang-Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20210257572
- Publication date Aug 19, 2021
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
Power Semiconductor Device and Method for Fabricating a Power Semic...
- Publication number 20210225795
- Publication date Jul 22, 2021
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20210111143
- Publication date Apr 15, 2021
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED STRESS MITIGATION LAYER AND POWER ELECTRONIC ASSEMBLIE...
- Publication number 20200286849
- Publication date Sep 10, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY
- Publication number 20200219848
- Publication date Jul 9, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC ASSEMBLIES WITH HIGH PURITY ALUMINUM PLATED SUBSTR...
- Publication number 20200135681
- Publication date Apr 30, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENCAPSULATED STRESS MITIGATION LAYER AND POWER ELECTRONIC ASSEMBLIE...
- Publication number 20200126946
- Publication date Apr 23, 2020
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Shailesh N. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device with Multi-Layer Contact and System
- Publication number 20200075530
- Publication date Mar 5, 2020
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER BONDING METHOD
- Publication number 20200075535
- Publication date Mar 5, 2020
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Kwang-Seong CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD FOR MA...
- Publication number 20200043888
- Publication date Feb 6, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Hiroaki TATSUMI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
STACK TYPE POWER MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190326195
- Publication date Oct 24, 2019
- Hyundai Motor Company
- Kwang-Joon HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING TO A BOARD
- Publication number 20190013308
- Publication date Jan 10, 2019
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Electronic Device With Multi-Layer Contact
- Publication number 20190006311
- Publication date Jan 3, 2019
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGING STRUCTURE
- Publication number 20180358307
- Publication date Dec 13, 2018
- Industrial Technology Research Institute
- Jing-Yao Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES
- Publication number 20180342463
- Publication date Nov 29, 2018
- Intel Corporation
- Taylor GAINES
- H01 - BASIC ELECTRIC ELEMENTS

comprising an intermetallic compound

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Diffusion soldering with contaminant protection

Metal joint, metal joint production method, semiconductor device, a...

Electronic device with multi-layer contact and system

Semiconductor device and method for fabricating a semiconductor device

Light emitting diode display with redundancy scheme

Diffusion soldering with contaminant protection

Chip assembly

Soldering a conductor to an aluminum layer

Advanced solder alloys for electronic interconnects

Light emitting diode display with redundancy scheme

Non-eutectic bonding

Solder alloy and junction structure using same

Electronic packaging structure

Laser bonding method

Bonded structure and method of manufacturing the same

Semiconductor packages with an intermetallic layer

Light emitting diode display with redundancy scheme

Method and apparatus for creating a bond between objects based on f...

Encapsulated stress mitigation layer and power electronic assemblie...

Power electronic assemblies with high purity aluminum plated substr...

Stack type power module and method of manufacturing the same

Encapsulated stress mitigation layer and power electronic assemblie...

Chip assembly

Die with metallized sidewall and method of manufacturing

Method for producing electronic device with multi-layer contact

Light emitting diode display with redundancy scheme

Method of manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Micro-transfer printing with volatile adhesive layer

Patents Applicationslast 30 patents

Core-Shell Particle Die-Attach Material

Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding

Method for Fabricating a Power Semiconductor Device

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

SEMICONDUCTOR DEVICE

Semiconductor Device and Method for Fabricating a Semiconductor Device

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

DELAMINATION/CRACKING IMPROVEMENT AT SOLDER JOINTS IN MICROELECTRON...

SOLDER MATERIAL, LAYER STRUCTURE, CHIP PACKAGE, METHOD OF FORMING A...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

ELECTRONIC SYSTEM HAVING INTERMETALLIC CONNECTION STRUCTURE WITH CE...

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

TRANSISTOR PACKAGES WITH IMPROVED DIE ATTACH

LASER BONDING METHOD AND A SEMICONDUCTOR PACKAGE INCLUDING A BONDIN...

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

Power Semiconductor Device and Method for Fabricating a Power Semic...

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE

ENCAPSULATED STRESS MITIGATION LAYER AND POWER ELECTRONIC ASSEMBLIE...

METHOD OF FORMING A CHIP ASSEMBLY AND CHIP ASSEMBLY

POWER ELECTRONIC ASSEMBLIES WITH HIGH PURITY ALUMINUM PLATED SUBSTR...

ENCAPSULATED STRESS MITIGATION LAYER AND POWER ELECTRONIC ASSEMBLIE...

Electronic Device with Multi-Layer Contact and System

LASER BONDING METHOD

SEMICONDUCTOR DEVICE, POWER CONVERSION APPARATUS, AND METHOD FOR MA...

STACK TYPE POWER MODULE AND METHOD OF MANUFACTURING THE SAME

DIE BONDING TO A BOARD

Method for Producing Electronic Device With Multi-Layer Contact

ELECTRONIC PACKAGING STRUCTURE

CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES