comprising an intermetallic compound

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CPC
H01L2224/16507

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/16507comprising an intermetallic compound

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 12,255,167
- Issue date Mar 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with a barrier layer
- Patent number 11,984,419
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure with a barrier layer
- Patent number 11,469,203
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with an intermetallic layer
- Patent number 11,049,833
- Issue date Jun 29, 2021
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with a barrier layer and method for forming the same
- Patent number 10,811,377
- Issue date Oct 20, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and semiconductor package including the same
- Patent number 10,573,588
- Issue date Feb 25, 2020
- Samsung Electronics Co., Ltd.
- Hohyeuk Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods to enable a full intermetallic interconnect
- Patent number 10,170,446
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump stretching method
- Patent number 10,163,835
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-transfer printing with volatile adhesive layer
- Patent number 10,157,880
- Issue date Dec 18, 2018
- X-CELEPRINT LIMITED
- Salvatore Bonafede
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder paste, joining method using the same and joined structure
- Patent number 10,010,980
- Issue date Jul 3, 2018
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump stretching method for forming a solder bump joint in a...
- Patent number 9,978,709
- Issue date May 22, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Transient interface gradient bonding for metal bonds
- Patent number 9,865,565
- Issue date Jan 9, 2018
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump stretching method and device for performing the same
- Patent number 9,842,817
- Issue date Dec 12, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,812,418
- Issue date Nov 7, 2017
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,761,552
- Issue date Sep 12, 2017
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Localized sealing of interconnect structures in small gaps
- Patent number 9,685,420
- Issue date Jun 20, 2017
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure having dies with connectors
- Patent number 9,653,423
- Issue date May 16, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical apparatus
- Patent number 9,640,508
- Issue date May 2, 2017
- Fujitsu Limited
- Taiki Uemura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming semiconductor packages with an intermetallic lay...
- Patent number 9,564,409
- Issue date Feb 7, 2017
- Semiconductor Components Industries, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,530,745
- Issue date Dec 27, 2016
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic apparatus and method for fabricating the same
- Patent number 9,490,232
- Issue date Nov 8, 2016
- Fujitsu Limited
- Kozo Shimizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump joint in a device including lamellar structures
- Patent number 9,475,145
- Issue date Oct 25, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacture of coated copper pillars
- Patent number 9,331,040
- Issue date May 3, 2016
- Atotech Deutschland GmbH
- Thomas Beck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure having dies with connectors
- Patent number 9,299,680
- Issue date Mar 29, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment in electroless process for adhesion enhancement
- Patent number 9,230,934
- Issue date Jan 5, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump including diffusion barrier bi-layer and manufacturing method...
- Patent number 9,209,122
- Issue date Dec 8, 2015
- Research & Business Foundation Sungkyunkwan University
- Hoojeong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and the method to manufacture thereof
- Patent number 9,171,818
- Issue date Oct 27, 2015
- Cyntec Co., Ltd.
- Da-Jung Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Solder bump joining structure with low resistance joining member
- Patent number 9,129,884
- Issue date Sep 8, 2015
- Shinko Electric Industries Co., Ltd.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder paste, joining method using the same and joined structure
- Patent number 9,044,816
- Issue date Jun 2, 2015
- MURATA MANUFACTURING CO., LTD.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump structure and electronic packaging solder joint structure and...
- Patent number 9,024,441
- Issue date May 5, 2015
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER
- Publication number 20250183217
- Publication date Jun 5, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SCHEME FOR SEMICONDUCTOR PACKAGING
- Publication number 20250149488
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER
- Publication number 20240297138
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240243086
- Publication date Jul 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Sheng-Hsiang HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230132054
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Wooram MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER AND METHOD FOR MANUFACTURING...
- Publication number 20220367398
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING PACKAGE STRUCTURE WITH A BARRIER LAYER
- Publication number 20210035937
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLARS HAVING IMPROVED INTEGRITY AND METHODS OF MAKING THE...
- Publication number 20200266165
- Publication date Aug 20, 2020
- Rohm and Haas Electronic Materials L.L.C.
- Ravi Pokhrel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP STRETCHING METHOD
- Publication number 20180108632
- Publication date Apr 19, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun YANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STUD BUMP AND PACKAGE STRUCTURE THEREOF AND METHOD OF MANUFACTURING...
- Publication number 20150194409
- Publication date Jul 9, 2015
- WIRE TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150091162
- Publication date Apr 2, 2015
- Shinko Electric Industries Co., LTD.
- Kei Murayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pillar Structure having a Non-Planar Surface for Semiconductor Devices
- Publication number 20140302669
- Publication date Oct 9, 2014
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Structure Having Dies with Connectors
- Publication number 20140264843
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface Treatment in Electroless Process for Adhesion Enhancement
- Publication number 20140264841
- Publication date Sep 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONAL MATERIAL SYSTEMS AND PROCESSES FOR PACKAGE-LEVEL INTERCO...
- Publication number 20140225265
- Publication date Aug 14, 2014
- Rajen S. Sidhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, ELECTRONIC APPARATUS INCLUDING THE SAME, AND...
- Publication number 20140159235
- Publication date Jun 12, 2014
- Fujitsu Limited
- Muneyuki Odaira
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pillar Structure having a Non-Planar Surface for Semiconductor Devices
- Publication number 20130292827
- Publication date Nov 7, 2013
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure and Substrate Bonding Method
- Publication number 20130285248
- Publication date Oct 31, 2013
- ASIA PACIFIC MICROSYSTEMS, INC.
- Hung-Lin Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SOLDER BUMP STRETCHING METHOD FOR FORMING A SOLDER BUMP JOINT IN A...
- Publication number 20130221521
- Publication date Aug 29, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Su-Chun Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUMP STRUCTURE AND ELECTRONIC PACKAGING SOLDER JOINT STRUCTURE AND...
- Publication number 20130168851
- Publication date Jul 4, 2013
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP INCLUDING DIFFUSION BARRIER BI-LAYER AND MANUFACTURING METHOD...
- Publication number 20130154089
- Publication date Jun 20, 2013
- Hoojeong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND THE METHOD TO MANUFACTURE THEREOF
- Publication number 20130146341
- Publication date Jun 13, 2013
- CYNTEC CO., LTD.
- DA-JUNG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING STUDS USED FOR SELF-ALIGNMENT OF SOLDER BUMPS
- Publication number 20130119536
- Publication date May 16, 2013
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PILLAR STRUCTURE HAVING A NON-PLANAR SURFACE FOR SEMICONDUCTOR DEVICES
- Publication number 20130056869
- Publication date Mar 7, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, A...
- Publication number 20120211549
- Publication date Aug 23, 2012
- Fujitsu Limited
- Takatoyo YAMAKAMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND ASSEMBLING METHOD THEREOF
- Publication number 20120161336
- Publication date Jun 28, 2012
- Industrial Technology Research Institute
- Yu-Min Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Paste, Joining Method Using the Same and Joined Structure
- Publication number 20120156512
- Publication date Jun 21, 2012
- Murata Manufacturing Co., Ltd.
- Kosuke Nakano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CREATION OF LEAD-FREE SOLDER JOINT WITH INTERMETALLICS
- Publication number 20120083113
- Publication date Apr 5, 2012
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pillar Structure having a Non-Planar Surface for Semiconductor Devices
- Publication number 20110193220
- Publication date Aug 11, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tin-Hao Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISMS FOR FORMING COPPER PILLAR BUMPS
- Publication number 20110101527
- Publication date May 5, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Da CHENG
- H01 - BASIC ELECTRIC ELEMENTS

comprising an intermetallic compound

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor packages with an intermetallic layer

Package structure with a barrier layer

Method for forming package structure with a barrier layer

Semiconductor packages with an intermetallic layer

Package structure with a barrier layer and method for forming the same

Package substrate and semiconductor package including the same

Structures and methods to enable a full intermetallic interconnect

Solder bump stretching method

Micro-transfer printing with volatile adhesive layer

Solder paste, joining method using the same and joined structure

Solder bump stretching method for forming a solder bump joint in a...

Transient interface gradient bonding for metal bonds

Solder bump stretching method and device for performing the same

Electronic apparatus and method for fabricating the same

Electronic apparatus and method for fabricating the same

Localized sealing of interconnect structures in small gaps

Integrated circuit structure having dies with connectors

Electrical apparatus

Methods of forming semiconductor packages with an intermetallic lay...

Electronic apparatus and method for fabricating the same

Electronic apparatus and method for fabricating the same

Solder bump joint in a device including lamellar structures

Manufacture of coated copper pillars

Integrated circuit structure having dies with connectors

Surface treatment in electroless process for adhesion enhancement

Bump including diffusion barrier bi-layer and manufacturing method...

Package structure and the method to manufacture thereof

Solder bump joining structure with low resistance joining member

Solder paste, joining method using the same and joined structure

Bump structure and electronic packaging solder joint structure and...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER

BONDING SCHEME FOR SEMICONDUCTOR PACKAGING

PACKAGE STRUCTURE WITH A BARRIER LAYER

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE WITH A BARRIER LAYER AND METHOD FOR MANUFACTURING...

METHOD FOR FORMING PACKAGE STRUCTURE WITH A BARRIER LAYER

COPPER PILLARS HAVING IMPROVED INTEGRITY AND METHODS OF MAKING THE...

SOLDER BUMP STRETCHING METHOD

STUD BUMP AND PACKAGE STRUCTURE THEREOF AND METHOD OF MANUFACTURING...

SEMICONDUCTOR DEVICE

Pillar Structure having a Non-Planar Surface for Semiconductor Devices

Integrated Circuit Structure Having Dies with Connectors

Surface Treatment in Electroless Process for Adhesion Enhancement

FUNCTIONAL MATERIAL SYSTEMS AND PROCESSES FOR PACKAGE-LEVEL INTERCO...

ELECTRONIC COMPONENT, ELECTRONIC APPARATUS INCLUDING THE SAME, AND...

Pillar Structure having a Non-Planar Surface for Semiconductor Devices

Package Structure and Substrate Bonding Method

SOLDER BUMP STRETCHING METHOD FOR FORMING A SOLDER BUMP JOINT IN A...

BUMP STRUCTURE AND ELECTRONIC PACKAGING SOLDER JOINT STRUCTURE AND...

BUMP INCLUDING DIFFUSION BARRIER BI-LAYER AND MANUFACTURING METHOD...

PACKAGE STRUCTURE AND THE METHOD TO MANUFACTURE THEREOF

METHOD FOR FORMING STUDS USED FOR SELF-ALIGNMENT OF SOLDER BUMPS

PILLAR STRUCTURE HAVING A NON-PLANAR SURFACE FOR SEMICONDUCTOR DEVICES

ELECTROCONDUCTIVE BONDING MATERIAL, METHOD FOR BONDING CONDUCTOR, A...

SEMICONDUCTOR DEVICE AND ASSEMBLING METHOD THEREOF

Solder Paste, Joining Method Using the Same and Joined Structure

CREATION OF LEAD-FREE SOLDER JOINT WITH INTERMETALLICS

Pillar Structure having a Non-Planar Surface for Semiconductor Devices

MECHANISMS FOR FORMING COPPER PILLAR BUMPS