comprising apertures or cavities

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CPC
H01L2224/13011

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/13011comprising apertures or cavities

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Supporting backplane, manufacturing method therefor and backplane
- Patent number 12,087,892
- Issue date Sep 10, 2024
- BOE Technology Group Co., Ltd.
- Zhiwei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 12,087,718
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive terminal for side facing packages
- Patent number 12,080,667
- Issue date Sep 3, 2024
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method of fluidic assembly of microchips on a substrate
- Patent number 11,942,450
- Issue date Mar 26, 2024
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Melina Haupt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad and die pillar design modifications to enable extreme...
- Patent number 11,875,988
- Issue date Jan 16, 2024
- NXP USA, INC.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with hollow interconnectors
- Patent number 11,876,074
- Issue date Jan 16, 2024
- NANYA TECHNOLOGY CORPORATION
- Yi-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive member cavities
- Patent number 11,699,639
- Issue date Jul 11, 2023
- Texas Instruments Incorporated
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 11,631,648
- Issue date Apr 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect using nanoporous metal locking structures
- Patent number 11,469,199
- Issue date Oct 11, 2022
- Meta Platforms Technologies, LLC
- John Michael Goward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eutectic electrode structure of flip-chip LED chip and flip-chip LE...
- Patent number 11,393,967
- Issue date Jul 19, 2022
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Anhe He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 11,257,767
- Issue date Feb 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 10,985,123
- Issue date Apr 20, 2021
- Murata Manufacturing Co., Ltd.
- Atsushi Kurokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Porous Cu on Cu surface for semiconductor packages
- Patent number 10,914,018
- Issue date Feb 9, 2021
- Infineon Technologies AG
- Norbert Pielmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eutectic electrode structure of flip-chip LED chip and flip-chip LE...
- Patent number 10,916,688
- Issue date Feb 9, 2021
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Anhe He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 10,833,033
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Horng Chang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Hollow metal pillar packaging scheme
- Patent number 10,825,804
- Issue date Nov 3, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pillar shaped for solder confinement
- Patent number 10,790,253
- Issue date Sep 29, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eutectic electrode structure of flip-chip LED chip and flip-chip LE...
- Patent number 10,707,395
- Issue date Jul 7, 2020
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Anhe He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expanded head pillar for bump bonds
- Patent number 10,636,758
- Issue date Apr 28, 2020
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pillar shaped for solder confinement
- Patent number 10,600,751
- Issue date Mar 24, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 10,580,748
- Issue date Mar 3, 2020
- Murata Manufacturing Co., Ltd.
- Atsushi Kurokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor detector, methods for manufa...
- Patent number 10,468,365
- Issue date Nov 5, 2019
- SHIMADZU CORPORATION
- Hiroyuki Kishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combing bump structure and manufacturing method thereof
- Patent number 10,446,514
- Issue date Oct 15, 2019
- NANYA TECHNOLOGY CORPORATION
- Po-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure having a side recess and semiconductor structure inc...
- Patent number 10,388,622
- Issue date Aug 20, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Horng Chang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Hollow metal pillar packaging scheme
- Patent number 10,354,986
- Issue date Jul 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect crack arrestor structure and methods
- Patent number 10,340,226
- Issue date Jul 2, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eutectic electrode structure of flip-chip LED chip and flip-chip LE...
- Patent number 10,297,736
- Issue date May 21, 2019
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Anhe He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact bump connection and contact bump and method for producing a...
- Patent number 10,292,270
- Issue date May 14, 2019
- SMARTRAC TECHNOLOGY GmbH
- Carsten Nieland
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Conductive pillar shaped for solder confinement
- Patent number 10,290,599
- Issue date May 14, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding electrode structure of flip-chip led chip and fabrication m...
- Patent number 10,276,750
- Issue date Apr 30, 2019
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Zhibai Zhong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES
- Publication number 20240413113
- Publication date Dec 12, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE DEVICE, SEMICONDUCTOR PA...
- Publication number 20240170431
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Chang-Kun KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PAD AND DIE PILLAR DESIGN MODIFICATIONS TO ENABLE EXTREME...
- Publication number 20240113069
- Publication date Apr 4, 2024
- NXP USA, Inc.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH HOLLOW INTERCONNECTORS
- Publication number 20240063176
- Publication date Feb 22, 2024
- NANYA TECHNOLOGY CORPORATION
- YI-HSIEN CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240014158
- Publication date Jan 11, 2024
- UNITED MICROELECTRONICS CORP.
- Chen-Hsiao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MEMBER CAVITIES
- Publication number 20230307327
- Publication date Sep 28, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares GUEVARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES
- Publication number 20230268302
- Publication date Aug 24, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares Guevara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20230253355
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Horng CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORTING BACKPLANE, MANUFACTURING METHOD THEREFOR AND BACKPLANE
- Publication number 20230131247
- Publication date Apr 27, 2023
- BOE TECHNOLOGY GROUP CO., LTD.
- Zhiwei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...
- Publication number 20230088776
- Publication date Mar 23, 2023
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Anhe HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL AND CONNECTION METHOD
- Publication number 20230075929
- Publication date Mar 9, 2023
- SONY GROUP CORPORATION
- JO UMEZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PAD AND DIE PILLAR DESIGN MODIFICATIONS TO ENABLE EXTREME...
- Publication number 20220352115
- Publication date Nov 3, 2022
- NXP USA, Inc.
- Kabir Mirpuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MEMBER CAVITIES
- Publication number 20220319961
- Publication date Oct 6, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Rafael Jose Lizares GUEVARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY CONDUCTIVE PILLAR, BONDING STRUCTURE, ELECTRONIC DEVIC...
- Publication number 20220293543
- Publication date Sep 15, 2022
- DIC CORPORATION
- Ryota YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS FLI BUMPS FOR REDUCING BUMP THICKNESS VARIATION SENSITIVITY...
- Publication number 20220165695
- Publication date May 26, 2022
- Intel Corporation
- Numair AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD OF FLUIDIC ASSEMBLY OF MICROCHIPS ON A SUBSTRATE
- Publication number 20220165702
- Publication date May 26, 2022
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Melina Haupt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...
- Publication number 20210126176
- Publication date Apr 29, 2021
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Anhe HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT USING NANOPOROUS METAL LOCKING STRUCTURES
- Publication number 20210098402
- Publication date Apr 1, 2021
- Facebook Technologies, LLC
- John Michael Goward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20210035938
- Publication date Feb 4, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Horng Chang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...
- Publication number 20200313059
- Publication date Oct 1, 2020
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Anhe HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Porous Cu on Cu Surface for Semiconductor Packages
- Publication number 20200291538
- Publication date Sep 17, 2020
- INFINEON TECHNOLOGIES AG
- Norbert Pielmeier
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
EXPANDED HEAD PILLAR FOR BUMP BONDS
- Publication number 20200258856
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT
- Publication number 20200083188
- Publication date Mar 12, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Crack Arrestor Structure and Methods
- Publication number 20190326228
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...
- Publication number 20190326240
- Publication date Oct 24, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Chih-Horng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...
- Publication number 20190267528
- Publication date Aug 29, 2019
- XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD
- Anhe HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT USING NANOPOROUS METAL LOCKING STRUCTURES
- Publication number 20190237420
- Publication date Aug 1, 2019
- Facebook Technologies, LLC
- John Michael Goward
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20190172807
- Publication date Jun 6, 2019
- MURATA MANUFACTURING CO., LTD.
- Atsushi KUROKAWA
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT
- Publication number 20190164921
- Publication date May 30, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20190115247
- Publication date Apr 18, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

comprising apertures or cavities

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Supporting backplane, manufacturing method therefor and backplane

Bump structure having a side recess and semiconductor structure inc...

Conductive terminal for side facing packages

Device and method of fluidic assembly of microchips on a substrate

Substrate pad and die pillar design modifications to enable extreme...

Semiconductor device with hollow interconnectors

Conductive member cavities

Bump structure having a side recess and semiconductor structure inc...

Interconnect using nanoporous metal locking structures

Eutectic electrode structure of flip-chip LED chip and flip-chip LE...

Interconnect crack arrestor structure and methods

Semiconductor apparatus

Porous Cu on Cu surface for semiconductor packages

Eutectic electrode structure of flip-chip LED chip and flip-chip LE...

Bump structure having a side recess and semiconductor structure inc...

Hollow metal pillar packaging scheme

Conductive pillar shaped for solder confinement

Eutectic electrode structure of flip-chip LED chip and flip-chip LE...

Expanded head pillar for bump bonds

Conductive pillar shaped for solder confinement

Semiconductor apparatus

Semiconductor device and semiconductor detector, methods for manufa...

Combing bump structure and manufacturing method thereof

Bump structure having a side recess and semiconductor structure inc...

Hollow metal pillar packaging scheme

Interconnect crack arrestor structure and methods

Eutectic electrode structure of flip-chip LED chip and flip-chip LE...

Contact bump connection and contact bump and method for producing a...

Conductive pillar shaped for solder confinement

Bonding electrode structure of flip-chip led chip and fabrication m...

Patents Applicationslast 30 patents

CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES

BONDING STRUCTURE OF SEMICONDUCTOR PACKAGE DEVICE, SEMICONDUCTOR PA...

SUBSTRATE PAD AND DIE PILLAR DESIGN MODIFICATIONS TO ENABLE EXTREME...

SEMICONDUCTOR DEVICE WITH HOLLOW INTERCONNECTORS

COPPER PILLAR BUMP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

CONDUCTIVE MEMBER CAVITIES

CONDUCTIVE TERMINAL FOR SIDE FACING PACKAGES

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

SUPPORTING BACKPLANE, MANUFACTURING METHOD THEREFOR AND BACKPLANE

Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...

TERMINAL AND CONNECTION METHOD

SUBSTRATE PAD AND DIE PILLAR DESIGN MODIFICATIONS TO ENABLE EXTREME...

CONDUCTIVE MEMBER CAVITIES

ELECTRICALLY CONDUCTIVE PILLAR, BONDING STRUCTURE, ELECTRONIC DEVIC...

POROUS FLI BUMPS FOR REDUCING BUMP THICKNESS VARIATION SENSITIVITY...

DEVICE AND METHOD OF FLUIDIC ASSEMBLY OF MICROCHIPS ON A SUBSTRATE

Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...

INTERCONNECT USING NANOPOROUS METAL LOCKING STRUCTURES

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...

Porous Cu on Cu Surface for Semiconductor Packages

EXPANDED HEAD PILLAR FOR BUMP BONDS

CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT

Interconnect Crack Arrestor Structure and Methods

BUMP STRUCTURE HAVING A SIDE RECESS AND SEMICONDUCTOR STRUCTURE INC...

Eutectic Electrode Structure of Flip-chip LED Chip and Flip-chip LE...

INTERCONNECT USING NANOPOROUS METAL LOCKING STRUCTURES

SEMICONDUCTOR APPARATUS

CONDUCTIVE PILLAR SHAPED FOR SOLDER CONFINEMENT

ROOM TEMPERATURE METAL DIRECT BONDING