comprising at least one plating chamber

Industry

CPC
H01L21/6723

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/6723comprising at least one plating chamber

Industries

Patents Grantslast 30 patents

Information Patent Grant
Adaptive focusing and transport system for electroplating
- Patent number 11,942,341
- Issue date Mar 26, 2024
- ASMPT NEXX, INC.
- Arthur Keigler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adaptive focusing and transport system for electroplating
- Patent number 11,887,874
- Issue date Jan 30, 2024
- ASMPT NEXX, INC.
- Arthur Keigler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for plate-up detection
- Patent number 11,781,238
- Issue date Oct 10, 2023
- Applied Materials, Inc.
- Matthew Heller
- B08 - CLEANING
Information Patent Grant
Plating systems having reduced air entrainment
- Patent number 11,739,434
- Issue date Aug 29, 2023
- Applied Materials, Inc.
- Cameron Law
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for electrochemically processing semiconductor substrates
- Patent number 11,643,744
- Issue date May 9, 2023
- SPTS Technologies Limited
- John Macneil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for controlling substrate approach toward a tar...
- Patent number 11,621,187
- Issue date Apr 4, 2023
- Lam Research Corporation
- Douglas Hill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-oxidative metal removal in through mask interconnect fabric...
- Patent number 11,610,782
- Issue date Mar 21, 2023
- Lam Research Corporation
- Kari Thorkelsson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High pressure and high temperature anneal chamber
- Patent number 11,469,113
- Issue date Oct 11, 2022
- Applied Materials, Inc.
- Jean Delmas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High pressure and high temperature anneal chamber
- Patent number 11,462,417
- Issue date Oct 4, 2022
- Applied Materials, Inc.
- Jean Delmas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method and plating apparatus
- Patent number 11,447,885
- Issue date Sep 20, 2022
- Ebara Corporation
- Jumpei Fujikata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Automated substrate holder loading device
- Patent number 11,443,969
- Issue date Sep 13, 2022
- Atotech Deutschland GmbH
- Rüdiger Pretscher
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal liner passivation and adhesion enhancement by zinc doping
- Patent number 11,424,158
- Issue date Aug 23, 2022
- Lam Research Corporation
- Yezdi N. Dordi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Treatment device, plating apparatus including the same, conveying d...
- Patent number 11,396,714
- Issue date Jul 26, 2022
- Ebara Corporation
- Kenya Ito
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate transfer device, transfer method and photolithography app...
- Patent number 11,367,636
- Issue date Jun 21, 2022
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Fulong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating method and plating apparatus
- Patent number 11,286,577
- Issue date Mar 29, 2022
- Ebara Corporation
- Ryuya Koizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic cleaning system and method
- Patent number 11,286,849
- Issue date Mar 29, 2022
- General Electric Company
- Bernard Patrick Bewlay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling chemical concentration in electrolyte and sem...
- Patent number 11,280,021
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yung-Chang Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Film forming method and substrate processing system
- Patent number 11,171,004
- Issue date Nov 9, 2021
- Tokyo Electron Limited
- Takashi Sameshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scheduler, substrate processing apparatus, and substrate conveyance...
- Patent number 11,099,546
- Issue date Aug 24, 2021
- Ebara Corporation
- Koji Nonobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating system, a plating system control method, and a storage medi...
- Patent number 11,098,414
- Issue date Aug 24, 2021
- Ebara Corporation
- Takashi Mitsuya
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for electrochemically processing semiconductor substrates
- Patent number 11,066,754
- Issue date Jul 20, 2021
- SPTS Technologies Limited
- John Macneil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate holder and plating apparatus
- Patent number 11,015,261
- Issue date May 25, 2021
- Ebara Corporation
- Yoshitaka Mukaiyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 10,991,604
- Issue date Apr 27, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jyh-Shiou Hsu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing device, method for controlling substrate proce...
- Patent number 10,991,605
- Issue date Apr 27, 2021
- Ebara Corporation
- Junitsu Yamakawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrolytic plating apparatus
- Patent number 10,985,006
- Issue date Apr 20, 2021
- TOSHIBA MEMORY CORPORATION
- Fumito Shoji
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroplating device
- Patent number 10,968,530
- Issue date Apr 6, 2021
- Ebara Corporation
- Mitsuhiro Shamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and method of manufacturing semicond...
- Patent number 10,923,366
- Issue date Feb 16, 2021
- Kokusai Electric Corporation
- Yusaku Okajima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus and plating method
- Patent number 10,889,911
- Issue date Jan 12, 2021
- Ebara Corporation
- Masashi Shimoyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating method and plating apparatus
- Patent number 10,865,492
- Issue date Dec 15, 2020
- Ebara Corporation
- Jumpei Fujikata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 10,851,468
- Issue date Dec 1, 2020
- Tokyo Electron Limited
- Tadashi Iino
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR FILM PLATING PERIMETER MAPPING AND COMPENSATION
- Publication number 20240145251
- Publication date May 2, 2024
- Applied Materials, Inc.
- Kyle M. Hanson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PREPARATION METHOD OF FAN-IN PACKAGE STRUCTURE, AND FAN-IN PACKAGE...
- Publication number 20240063036
- Publication date Feb 22, 2024
- Forehope Electronic (Ningbo) Co., Ltd.
- Zhenghong HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURE AND FAN-OUT PACKAGING METHOD
- Publication number 20230377918
- Publication date Nov 23, 2023
- Forehope Electronic (Ningbo) Co., Ltd.
- Yuan GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING SYSTEMS HAVING REDUCED AIR ENTRAINMENT
- Publication number 20230349064
- Publication date Nov 2, 2023
- Applied Materials, Inc.
- Cameron Law
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR MANUFACTURING SOLAR CELL, SOLAR MODULE, AND POWER GENERA...
- Publication number 20230290901
- Publication date Sep 14, 2023
- Solarlab Aiko Europe GmbH
- Yongqian WANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF CONTROLLING CHEMICAL CONCENTRATION IN ELECTROLYTE
- Publication number 20230265578
- Publication date Aug 24, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Chang HUANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Systems and Methods for Controlling Substrate Approach Toward a Tar...
- Publication number 20230245917
- Publication date Aug 3, 2023
- LAM RESEARCH CORPORATION
- Douglas Hill
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ADAPTIVE FOCUSING AND TRANSPORT SYSTEM FOR ELECTROPLATING
- Publication number 20230238260
- Publication date Jul 27, 2023
- ASMPT NEXX, INC.
- Arthur KEIGLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CLEANING SEMICONDUCTOR DEVICES
- Publication number 20230130419
- Publication date Apr 27, 2023
- ASMPT NEXX, INC.
- William SOLARI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING SAME
- Publication number 20220344203
- Publication date Oct 27, 2022
- ChangXin Memory Technologies, Inc.
- Ke MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FABRICATION OF MICRO-LED DISPLAYS
- Publication number 20220293435
- Publication date Sep 15, 2022
- Applied Materials, Inc.
- Hou T. Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF MICRO-LED DISPLAYS WITH REWORK OR TRANSFER LINE
- Publication number 20220293441
- Publication date Sep 15, 2022
- Applied Materials, Inc.
- Hou T. Ng
- B08 - CLEANING
Information Patent Application
PLATING METHOD AND PLATING APPARATUS
- Publication number 20220170175
- Publication date Jun 2, 2022
- EBARA CORPORATION
- Ryuya Koizumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20220154342
- Publication date May 19, 2022
- TOKYO ELECTRON LIMITED
- Katsuhiro Morikawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ADAPTIVE FOCUSING AND TRANSPORT SYSTEM FOR ELECTROPLATING
- Publication number 20220148891
- Publication date May 12, 2022
- ASM NEXX, INC.
- Arthur KEIGLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSI...
- Publication number 20220084813
- Publication date Mar 17, 2022
- KIOXIA Corporation
- Makoto IYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS SEMICONDUCTOR BONDING STRUCTURE, ELECTROLESS PLATING SY...
- Publication number 20220056589
- Publication date Feb 24, 2022
- Advanced Semiconductor Engineering, Inc.
- Chun-Wei CHIANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLESS PLATING PROCESS
- Publication number 20220010452
- Publication date Jan 13, 2022
- Intel Corporation
- Chandrasekharan NAIR
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
RESIN MOLDING APPARATUS AND CLEANING METHOD
- Publication number 20210351045
- Publication date Nov 11, 2021
- Apic Yamada Corporation
- Masahiko FUJISAWA
- B08 - CLEANING
Information Patent Application
APPARATUS FOR ELECTROCHEMICALLY PROCESSING SEMICONDUCTOR SUBSTRATES
- Publication number 20210317592
- Publication date Oct 14, 2021
- SPTS TECHNOLOGIES LIMITED
- JOHN MACNEIL
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING METHOD AND PLATING APPARATUS
- Publication number 20210062354
- Publication date Mar 4, 2021
- EBARA CORPORATION
- Jumpei FUJIKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCHEDULER, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE CONVEYANCE...
- Publication number 20210011462
- Publication date Jan 14, 2021
- EBARA CORPORATION
- Koji Nonobe
- G05 - CONTROLLING REGULATING
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
- Publication number 20210010148
- Publication date Jan 14, 2021
- SCREEN Holdings Co., Ltd.
- Hisashi NISHIKIUCHI
- B08 - CLEANING
Information Patent Application
SYSTEMS AND METHODS FOR PLATE-UP DETECTION
- Publication number 20200370198
- Publication date Nov 26, 2020
- Applied Materials, Inc.
- Matthew Heller
- B08 - CLEANING
Information Patent Application
METAL LINER PASSIVATION AND ADHESION ENHANCEMENT BY ZINC DOPING
- Publication number 20200365453
- Publication date Nov 19, 2020
- LAM RESEARCH CORPORATION
- Yezdi N. DORDI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTRO-OXIDATIVE METAL REMOVAL IN THROUGH MASK INTERCONNECT FABRIC...
- Publication number 20200279754
- Publication date Sep 3, 2020
- LAM RESEARCH CORPORATION
- Kari Thorkelsson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATING METHOD AND PLATING APPARATUS
- Publication number 20200232115
- Publication date Jul 23, 2020
- EBARA CORPORATION
- Ryuya Koizumi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Systems and Methods for Controlling Substrate Approach Toward a Tar...
- Publication number 20200219754
- Publication date Jul 9, 2020
- LAM RESEARCH CORPORATION
- Douglas Hill
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20200208292
- Publication date Jul 2, 2020
- EBARA CORPORATION
- Masashi Shimoyama
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING SYSTEMS HAVING REDUCED AIR ENTRAINMENT
- Publication number 20200152467
- Publication date May 14, 2020
- Applied Materials, Inc.
- Cameron Law
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

comprising at least one plating chamber

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Adaptive focusing and transport system for electroplating

Adaptive focusing and transport system for electroplating

Systems and methods for plate-up detection

Plating systems having reduced air entrainment

Apparatus for electrochemically processing semiconductor substrates

Systems and methods for controlling substrate approach toward a tar...

Electro-oxidative metal removal in through mask interconnect fabric...

High pressure and high temperature anneal chamber

High pressure and high temperature anneal chamber

Plating method and plating apparatus

Automated substrate holder loading device

Metal liner passivation and adhesion enhancement by zinc doping

Treatment device, plating apparatus including the same, conveying d...

Substrate transfer device, transfer method and photolithography app...

Plating method and plating apparatus

Ultrasonic cleaning system and method

Method of controlling chemical concentration in electrolyte and sem...

Film forming method and substrate processing system

Scheduler, substrate processing apparatus, and substrate conveyance...

Plating system, a plating system control method, and a storage medi...

Apparatus for electrochemically processing semiconductor substrates

Substrate holder and plating apparatus

Method of manufacturing semiconductor structure

Substrate processing device, method for controlling substrate proce...

Electrolytic plating apparatus

Electroplating device

Substrate processing apparatus and method of manufacturing semicond...

Plating apparatus and plating method

Plating method and plating apparatus

Substrate processing apparatus and substrate processing method

Patents Applicationslast 30 patents

SEMICONDUCTOR FILM PLATING PERIMETER MAPPING AND COMPENSATION

PREPARATION METHOD OF FAN-IN PACKAGE STRUCTURE, AND FAN-IN PACKAGE...

FAN-OUT PACKAGE STRUCTURE AND FAN-OUT PACKAGING METHOD

PLATING SYSTEMS HAVING REDUCED AIR ENTRAINMENT

METHOD FOR MANUFACTURING SOLAR CELL, SOLAR MODULE, AND POWER GENERA...

METHOD OF CONTROLLING CHEMICAL CONCENTRATION IN ELECTROLYTE

Systems and Methods for Controlling Substrate Approach Toward a Tar...

ADAPTIVE FOCUSING AND TRANSPORT SYSTEM FOR ELECTROPLATING

METHOD FOR CLEANING SEMICONDUCTOR DEVICES

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING SAME

SYSTEMS AND METHODS FOR FABRICATION OF MICRO-LED DISPLAYS

FABRICATION OF MICRO-LED DISPLAYS WITH REWORK OR TRANSFER LINE

PLATING METHOD AND PLATING APPARATUS

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

ADAPTIVE FOCUSING AND TRANSPORT SYSTEM FOR ELECTROPLATING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSI...

ELECTROLESS SEMICONDUCTOR BONDING STRUCTURE, ELECTROLESS PLATING SY...

ELECTROLESS PLATING PROCESS

RESIN MOLDING APPARATUS AND CLEANING METHOD

APPARATUS FOR ELECTROCHEMICALLY PROCESSING SEMICONDUCTOR SUBSTRATES

PLATING METHOD AND PLATING APPARATUS

SCHEDULER, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE CONVEYANCE...

SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD

SYSTEMS AND METHODS FOR PLATE-UP DETECTION

METAL LINER PASSIVATION AND ADHESION ENHANCEMENT BY ZINC DOPING

ELECTRO-OXIDATIVE METAL REMOVAL IN THROUGH MASK INTERCONNECT FABRIC...

PLATING METHOD AND PLATING APPARATUS

Systems and Methods for Controlling Substrate Approach Toward a Tar...

PLATING APPARATUS AND PLATING METHOD

PLATING SYSTEMS HAVING REDUCED AIR ENTRAINMENT