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H01L2223/54413

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

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H01L2223/54413comprising digital information

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Shield package
- Patent number 12,016,165
- Issue date Jun 18, 2024
- Tatsuta Electric Wire & Cable Co., Ltd.
- Hiroaki Umeda
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Physically unclonable function circuitry of a package substrate and...
- Patent number 11,990,419
- Issue date May 21, 2024
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic circuit board, heat-dissipating member, and aluminum-diamon...
- Patent number 11,983,586
- Issue date May 14, 2024
- DENKA COMPANY LIMITED
- Daisuke Goto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display device having information code on a lateral side of display...
- Patent number 11,923,316
- Issue date Mar 5, 2024
- Samsung Display Co., Ltd.
- Sun Kwun Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask design for improved attach position
- Patent number 11,862,478
- Issue date Jan 2, 2024
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure chips with serial numbers
- Patent number 11,688,694
- Issue date Jun 27, 2023
- ASML Netherlands B.V.
- Johannes Cornelis Jacobus De Langen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems for direct transfer of semiconductor device die
- Patent number 11,562,990
- Issue date Jan 24, 2023
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with indications of die-specific information
- Patent number 11,532,490
- Issue date Dec 20, 2022
- Micron Technology, Inc.
- Federico Pio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct transfer of semiconductor devices from a substrate
- Patent number 11,515,293
- Issue date Nov 29, 2022
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shield package and method of manufacturing shield package
- Patent number 11,510,349
- Issue date Nov 22, 2022
- Tatsuta Electric Wire & Cable Co., Ltd.
- Hiroaki Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microchip affixing probe and method of use
- Patent number 11,491,738
- Issue date Nov 8, 2022
- P-CHIP IP HOLDINGS INC.
- Ziye “Jay” Qian
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method for transfer of semiconductor devices onto glass substrates
- Patent number 11,488,940
- Issue date Nov 1, 2022
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and method for manufacturing display device
- Patent number 11,487,170
- Issue date Nov 1, 2022
- Japan Display Inc.
- Yasushi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mask design for improved attach position
- Patent number 11,393,698
- Issue date Jul 19, 2022
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic semiconductor component and method for producing an elec...
- Patent number 11,367,691
- Issue date Jun 21, 2022
- OSRAM OLED GmbH
- Matthias Kiessling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit product customizations for identification code v...
- Patent number 11,315,883
- Issue date Apr 26, 2022
- Advanced Micro Devices, Inc.
- Suming Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Marking method
- Patent number 11,227,969
- Issue date Jan 18, 2022
- Azur Space Solar Power GmbH
- Wolfgang Koestler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improved transfer of semiconductor die
- Patent number 11,152,339
- Issue date Oct 19, 2021
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dampening a force applied to an electrically-actuatable e...
- Patent number 11,069,551
- Issue date Jul 20, 2021
- Rohinni, LLC
- Justin Wendt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package authentication feature
- Patent number 11,063,000
- Issue date Jul 13, 2021
- Infineon Technologies AG
- Stefan Dankowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Secure chips with serial numbers
- Patent number 11,004,800
- Issue date May 11, 2021
- ASML Netherlands B.V.
- Johannes Cornelis Jacobus De Langen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Secure permanent integrated circuit personalization
- Patent number 10,978,303
- Issue date Apr 13, 2021
- Michael C. Smayling
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus for direct transfer of semiconductor device die
- Patent number 10,910,354
- Issue date Feb 2, 2021
- Rohinni, LLC
- Cody Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microchip affixing probe and method of use
- Patent number 10,882,258
- Issue date Jan 5, 2021
- Pharmaseq, Inc.
- Ziye Jay Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip parts and method for manufacturing the same, circuit assembly...
- Patent number 10,867,945
- Issue date Dec 15, 2020
- Rohm Co., Ltd.
- Hiroki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elastic wave device
- Patent number 10,847,472
- Issue date Nov 24, 2020
- Murata Manufacturing Co., Ltd.
- Masaharu Fujiya
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Secure chips with serial numbers
- Patent number 10,714,427
- Issue date Jul 14, 2020
- ASML Netherlands B.V.
- Johannes Cornelis Jacobus De Langen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Compact laser device
- Patent number 10,707,646
- Issue date Jul 7, 2020
- TRUMPF PHOTONIC COMPONENTS GMBH
- Philipp Henning Gerlach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device wafer processing method
- Patent number 10,679,897
- Issue date Jun 9, 2020
- Disco Corporation
- Koichi Shigematsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overlay measurement method and apparatus
- Patent number 10,679,881
- Issue date Jun 9, 2020
- Semiconductor Manufacturing International (Shanghai) Corporation
- Qiang Wu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
ENCLOSURE
- Publication number 20240417244
- Publication date Dec 19, 2024
- SCHOTT AG
- Jens Ulrich Thomas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR MODULE AND METHOD OF INCREASING PIN ALIGNMENT A...
- Publication number 20240404961
- Publication date Dec 5, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Herbrandt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE EQUIPPED WITH A UNIQUE CODE FOR A HEAT DISSIPATIO...
- Publication number 20240395659
- Publication date Nov 28, 2024
- LX Semicon Co., Ltd.
- Min Yup JANG
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
MANUFACTURING METHOD OF A HEAT DISSIPATION SUBSTRATE EQUIPPED WITH...
- Publication number 20240395565
- Publication date Nov 28, 2024
- LX Semicon Co., Ltd.
- Min Yup JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371785
- Publication date Nov 7, 2024
- Powertech Technology Inc.
- Ching-Wei Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BARCODE READABILITY ENHANCEMENT STRUCTURES AND METHOD
- Publication number 20240339416
- Publication date Oct 10, 2024
- INFINEON TECHNOLOGIES AG
- Charles Rimbert-Riviere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240194612
- Publication date Jun 13, 2024
- SAMSUNG DISPLAY CO., LTD.
- Sun Kwun SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE, SEMICONDUCTOR DEVICE, AND APPARATUS
- Publication number 20240186259
- Publication date Jun 6, 2024
- Canon Kabushiki Kaisha
- IKUTO KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE,...
- Publication number 20240178152
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH MARKING PATTERNS
- Publication number 20240170413
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Jae Gwon JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE
- Publication number 20240145398
- Publication date May 2, 2024
- Siliconware Precision Industries Co., Ltd.
- Cheng-Liang HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR IMPRINTING UNIQUE IDENTIFIERS ON SEMICONDUCTO...
- Publication number 20240143957
- Publication date May 2, 2024
- Digitho Technologies Inc.
- Richard BEAUDRY
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE STRUCTURE AND PACKAGE MODULE THEREOF
- Publication number 20240047369
- Publication date Feb 8, 2024
- AZUREWAVE TECHNOLOGIES, INC.
- CHIH-HAO LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND ELECTROMAGNETIC INTERFERENCE SHIELDING P...
- Publication number 20240047373
- Publication date Feb 8, 2024
- AZUREWAVE TECHNOLOGIES, INC.
- CHIH-HAO LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230395522
- Publication date Dec 7, 2023
- KIOXIA Corporation
- Makoto MINAMINAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURE CHIPS WITH SERIAL NUMBERS
- Publication number 20230369237
- Publication date Nov 16, 2023
- ASML NETHERLANDS B.V.
- Johannes Cornelis Jacobus De Langen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTEGRATED DEVICE PACKAGE WITH REDUCED THICKNESS
- Publication number 20230345685
- Publication date Oct 26, 2023
- Skyworks Solutions, Inc.
- Anthony James LoBianco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDED INTEGRATED DEVICE PACKAGE
- Publication number 20230345684
- Publication date Oct 26, 2023
- Skyworks Solutions, Inc.
- Anthony James LoBianco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230317590
- Publication date Oct 5, 2023
- Samsung Electronics Co., Ltd.
- Jongyoun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOVOLTAIC CELL, METHOD FOR FORMING SAME, AND PHOTOVOLTAIC MODULE
- Publication number 20230282754
- Publication date Sep 7, 2023
- JINKO SOLAR (HAINING) CO., LTD.
- Nannan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISAGGREGATED ENTROPY SERVICES FOR MICROELECTRONIC ASSEMBLIES
- Publication number 20230187371
- Publication date Jun 15, 2023
- Intel Corporation
- Rachael J. Parker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT FOR IC PACKAGE
- Publication number 20230170285
- Publication date Jun 1, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Ruby Ann Merto Camenforte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH INDICATIONS OF DIE-SPECIFIC INFORMATION
- Publication number 20230121141
- Publication date Apr 20, 2023
- Micron Technology, Inc.
- Federico Pio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND ALUMINUM-DIAMON...
- Publication number 20230042932
- Publication date Feb 9, 2023
- DENKA COMPANY LIMITED
- Daisuke GOTO
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20220344283
- Publication date Oct 27, 2022
- WINBOND ELECTRONICS CORP.
- Chi-Ching Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mask Design for Improved Attach Position
- Publication number 20220310408
- Publication date Sep 29, 2022
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mask Design for Improved Attach Position
- Publication number 20220199423
- Publication date Jun 23, 2022
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC COMPONENT, SYSTEM AND METHOD FOR PRODUCING SAME
- Publication number 20220181266
- Publication date Jun 9, 2022
- Osram Opto Semiconductors GmbH
- Michael BRANDL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE MANAGEMENT METHOD AND SHEET CUTTING MACHINE
- Publication number 20220020696
- Publication date Jan 20, 2022
- Disco Corporation
- Yoshinobu SAITO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHYSICALLY UNCLONABLE FUNCTION CIRCUITRY OF A PACKAGE SUBSTRATE AND...
- Publication number 20210398909
- Publication date Dec 23, 2021
- Intel Corporation
- Georgios Dogiamis
- H01 - BASIC ELECTRIC ELEMENTS

comprising digital information

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Shield package

Physically unclonable function circuitry of a package substrate and...

Ceramic circuit board, heat-dissipating member, and aluminum-diamon...

Display device having information code on a lateral side of display...

Mask design for improved attach position

Secure chips with serial numbers

Systems for direct transfer of semiconductor device die

Semiconductor packages with indications of die-specific information

Direct transfer of semiconductor devices from a substrate

Shield package and method of manufacturing shield package

Microchip affixing probe and method of use

Method for transfer of semiconductor devices onto glass substrates

Display device and method for manufacturing display device

Mask design for improved attach position

Electronic semiconductor component and method for producing an elec...

Integrated circuit product customizations for identification code v...

Marking method

Method for improved transfer of semiconductor die

Method of dampening a force applied to an electrically-actuatable e...

Semiconductor package authentication feature

Secure chips with serial numbers

Secure permanent integrated circuit personalization

Apparatus for direct transfer of semiconductor device die

Microchip affixing probe and method of use

Chip parts and method for manufacturing the same, circuit assembly...

Elastic wave device

Secure chips with serial numbers

Compact laser device

Device wafer processing method

Overlay measurement method and apparatus

Patents Applicationslast 30 patents

ENCLOSURE

POWER SEMICONDUCTOR MODULE AND METHOD OF INCREASING PIN ALIGNMENT A...

CERAMIC SUBSTRATE EQUIPPED WITH A UNIQUE CODE FOR A HEAT DISSIPATIO...

MANUFACTURING METHOD OF A HEAT DISSIPATION SUBSTRATE EQUIPPED WITH...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SUBSTRATE BARCODE READABILITY ENHANCEMENT STRUCTURES AND METHOD

DISPLAY DEVICE

PACKAGE, SEMICONDUCTOR DEVICE, AND APPARATUS

METHOD FOR FORMING MARK, PACKAGING METHOD OF SEMICONDUCTOR DEVICE,...

SEMICONDUCTOR PACKAGE WITH MARKING PATTERNS

CARRIER STRUCTURE

METHOD AND SYSTEM FOR IMPRINTING UNIQUE IDENTIFIERS ON SEMICONDUCTO...

CHIP PACKAGE STRUCTURE AND PACKAGE MODULE THEREOF

CHIP PACKAGE STRUCTURE AND ELECTROMAGNETIC INTERFERENCE SHIELDING P...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SECURE CHIPS WITH SERIAL NUMBERS

INTEGRATED DEVICE PACKAGE WITH REDUCED THICKNESS

ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDED INTEGRATED DEVICE PACKAGE

SEMICONDUCTOR PACKAGE

PHOTOVOLTAIC CELL, METHOD FOR FORMING SAME, AND PHOTOVOLTAIC MODULE

DISAGGREGATED ENTROPY SERVICES FOR MICROELECTRONIC ASSEMBLIES

INTERCONNECT FOR IC PACKAGE

SEMICONDUCTOR PACKAGES WITH INDICATIONS OF DIE-SPECIFIC INFORMATION

CERAMIC CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND ALUMINUM-DIAMON...

SEMICONDUCTOR STRUCTURE

Mask Design for Improved Attach Position

Mask Design for Improved Attach Position

OPTOELECTRONIC COMPONENT, SYSTEM AND METHOD FOR PRODUCING SAME

WORKPIECE MANAGEMENT METHOD AND SHEET CUTTING MACHINE

PHYSICALLY UNCLONABLE FUNCTION CIRCUITRY OF A PACKAGE SUBSTRATE AND...