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ELECTRICITY
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Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2223/00
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H01L2223/5442
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Patents Grants
last 30 patents
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Patent Grant
Semiconductor structure and method for manufacturing same
Patent number
11,984,406
Issue date
May 14, 2024
CHANGXIN MEMORY TECHNOLOGIES, INC.
Yunsheng Xia
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Interposer, method for fabricating the same, and semiconductor pack...
Patent number
11,984,415
Issue date
May 14, 2024
Samsung Electronics Co., Ltd.
Yukyung Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor devices and structures with metal layers
Patent number
11,984,445
Issue date
May 14, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information
Patent Grant
Substrate with cut semiconductor pieces having measurement test str...
Patent number
11,978,679
Issue date
May 7, 2024
KLA Corporation
Chen Dror
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package structure, electronic substrate and method of ma...
Patent number
11,978,706
Issue date
May 7, 2024
Advanced Semiconductor Engineering, Inc.
Shun-Tsat Tu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer positioning method and apparatus
Patent number
11,978,677
Issue date
May 7, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Chia-Cheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Reducing device overlay errors
Patent number
11,971,664
Issue date
Apr 30, 2024
KLA-Tencor Corporation
Liran Yerushalmi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Organic light emitting display device including dam structure and a...
Patent number
11,968,860
Issue date
Apr 23, 2024
LG Display Co., Ltd.
Dongjin Kim
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Display substrate, manufacturing method thereof, and display apparatus
Patent number
11,968,879
Issue date
Apr 23, 2024
BOE Technology Group Co., Ltd.
Yunlong Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for producing overlay results with absolute reference for se...
Patent number
11,966,171
Issue date
Apr 23, 2024
Tokyo Electron Limited
Anton J. deVilliers
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Method for manufacturing semiconductor device
Patent number
11,967,564
Issue date
Apr 23, 2024
Denso Corporation
Aiko Kaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
On-product overlay targets
Patent number
11,967,535
Issue date
Apr 23, 2024
KLA Corporation
Amnon Manassen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display panel, manufacturing method thereof, and display device
Patent number
11,957,033
Issue date
Apr 9, 2024
Chengdu BOE Optoelectronics Technology Co., Ltd.
Huijuan Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for III-v/silicon hybrid integration
Patent number
11,953,728
Issue date
Apr 9, 2024
Rockley Photonics Limited
Guomin Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method of forming the same
Patent number
11,942,451
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Mao-Yen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Overlay alignment mark and method for measuring overlay error
Patent number
11,934,109
Issue date
Mar 19, 2024
Zhongke Jingyuan Electron Limited, Beijing (CN)
Weimin Ma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and system for fabricating fiducials using selective area gr...
Patent number
11,935,838
Issue date
Mar 19, 2024
NEXGEN POWER SYSTEMS, INC.
Clifford Drowley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate assembly
Patent number
11,935,487
Issue date
Mar 19, 2024
Innolux Corporation
Kuan-Feng Lee
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor integrated fluxgate device shielded by discrete magne...
Patent number
11,921,134
Issue date
Mar 5, 2024
Texas Instruments Incorporated
Dok Won Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with bonding
Patent number
11,923,230
Issue date
Mar 5, 2024
Monolithic 3D Inc.
Zvi Or-Bach
G11 - INFORMATION STORAGE
Information
Patent Grant
Semiconductor device and method of manufacturing
Patent number
11,916,031
Issue date
Feb 27, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Chia Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Photolithography alignment process for bonded wafers
Patent number
11,916,022
Issue date
Feb 27, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yeong-Jyh Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating a chip package
Patent number
11,908,692
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package, method of bonding workpieces and method of m...
Patent number
11,908,843
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Bingchien Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
Patent number
11,908,836
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Array substrate and display panel
Patent number
11,908,804
Issue date
Feb 20, 2024
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
Linfeng Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D semiconductor device and structure with memory
Patent number
11,901,210
Issue date
Feb 13, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated aligned stealth laser with blade and grinding apparatus...
Patent number
11,901,171
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Ming-Tung Wu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for fabricating semiconductor structure having alignment mar...
Patent number
11,901,305
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Co. Ltd.
Kuo-Hung Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure
Patent number
11,901,306
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chung-Yu Lu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
HIGH ASPECT RATIO TGV SUBSTRATES THROUGH DIRECT HYBRID BONDING OF T...
Publication number
20240153857
Publication date
May 9, 2024
Intel Corporation
Bainye Francoise ANGOUA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SI...
Publication number
20240154031
Publication date
May 9, 2024
Fuji Electric Co., Ltd.
Masaki MIYAZATO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE INCLUDING OVERLAY TARGET STRUCTURE
Publication number
20240153883
Publication date
May 9, 2024
Samsung Electronics Co., Ltd.
Seunghoon HAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF BONDING WORKPIECES AND METHOD OF M...
Publication number
20240153930
Publication date
May 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
BINGCHIEN WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF BONDING WORKPIECES
Publication number
20240153931
Publication date
May 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
BINGCHIEN WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARRIER STRUCTURE
Publication number
20240145398
Publication date
May 2, 2024
Siliconware Precision Industries Co., Ltd.
Cheng-Liang HSU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES AND DATA STORAGE SYSTEMS INCLUDING THE SAME
Publication number
20240145400
Publication date
May 2, 2024
Samsung Electronics Co., Ltd.
Jinhyuk Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED STEALTH LASER FOR WAFER EDGE TRIMMING PROCESS
Publication number
20240136174
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Ming-Tung Wu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MICRO DEVICE ARRANGEMENT IN DONOR SUBSTRATE
Publication number
20240133940
Publication date
Apr 25, 2024
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR WAFER, PROCESSING APPARATUS FOR OVERLAY SHIFT AND PRO...
Publication number
20240134291
Publication date
Apr 25, 2024
WINBOND ELECTRONICS CORP.
Meng-Hsien TSAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OVERLAY MARK FORMING MOIRE PATTERN, OVERLAY MEASUREMENT METHOD USIN...
Publication number
20240136300
Publication date
Apr 25, 2024
AUROS TECHNOLOGY, INC.
Hyun Chul LEE
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
WAFER ALIGNMENT STRUCTURE
Publication number
20240136303
Publication date
Apr 25, 2024
Tesla, Inc.
Yong guo Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240136302
Publication date
Apr 25, 2024
RENESAS ELECTRONICS CORPORATION
Ryusei TAKAISHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RESOURCE MANAGEMENT WITH TIME AND EXPENSE TRACKING
Publication number
20240128115
Publication date
Apr 18, 2024
VueReal Inc.
Heidi Elizabeth Bailey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240120199
Publication date
Apr 11, 2024
Samsung Electronics Co., Ltd.
So Young LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFER
Publication number
20240120231
Publication date
Apr 11, 2024
VueReal Inc.
Gholamreza Chaji
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE HAVING A DIE POSITION MARK AND A SEMICONDUCTOR DIE STACK...
Publication number
20240120285
Publication date
Apr 11, 2024
SK HYNIX INC.
Bok Gyu MIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OVERLAY MARK, MANUFACTURING METHOD USING THE SAME, AND SEMICONDUCTO...
Publication number
20240120287
Publication date
Apr 11, 2024
Samsung Electronics Co., Ltd.
Sang Won PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
3D SEMICONDUCTOR DEVICES AND STRUCTURES WITH METAL LAYERS
Publication number
20240120332
Publication date
Apr 11, 2024
Monolithic 3D Inc.
Zvi Or-Bach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR MODULE, POWER SEMICONDUCTOR DEVICE AND METHOD F...
Publication number
20240120255
Publication date
Apr 11, 2024
Hitachi Energy Switzerland AG
Dominik TRUESSEL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240120286
Publication date
Apr 11, 2024
Samsung Electronics Co., Ltd.
Hyeonseok LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTRA-BONDING SEMICONDUCTOR INTEGRATED CIRCUIT CHIPS
Publication number
20240113076
Publication date
Apr 4, 2024
International Business Machines Corporation
Frank Robert Libsch
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SINGLE DIE REINFORCED GALVANIC ISOLATION DEVICE
Publication number
20240113042
Publication date
Apr 4, 2024
TEXAS INSTRUMENTS INCORPORATED
Jeffrey Alan West
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR FORMING SEMICONDUCTOR PACKAGE
Publication number
20240113034
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Hung LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, BASE-SIDE SEMICONDUCTOR CHIP, AND BONDING-SID...
Publication number
20240113035
Publication date
Apr 4, 2024
LAPIS Technology Co., Ltd.
JUNICHI IKEDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240105634
Publication date
Mar 28, 2024
WINBOND ELECTRONICS CORP.
Chang-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER-SCALE CHIP STRUCTURE AND METHOD AND SYSTEM FOR DESIGNING THE...
Publication number
20240105633
Publication date
Mar 28, 2024
GLOBALFOUNDRIES U.S. Inc.
Osamu Samuel Nakagawa
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
INTEGRATED PACKAGE AND METHOD FOR MAKING THE SAME
Publication number
20240105569
Publication date
Mar 28, 2024
STATS ChipPAC Pte Ltd.
ByungHyun KWAK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OVERLAY TARGET AND OVERLAY METHOD
Publication number
20240103383
Publication date
Mar 28, 2024
United Microelectronics Corp.
Hui Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PROCESSING FOR ALIGNMENT MARK
Publication number
20240096814
Publication date
Mar 21, 2024
TEXAS INSTRUMENTS INCORPORATED
Guoyong Zhang
H01 - BASIC ELECTRIC ELEMENTS