comprising protrusions or indentations

Industry

CPC
H01L2224/29018

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29018comprising protrusions or indentations

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method and structure to control the solder thickness for double sid...
- Patent number 12,243,845
- Issue date Mar 4, 2025
- Hyundai Motor Company
- Tae Hwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,855,014
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,854,936
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure to control the solder thickness for double sid...
- Patent number 11,756,915
- Issue date Sep 12, 2023
- Huyndai Motor Company
- Tae Hwa Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,574,853
- Issue date Feb 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for adjusting dimensions of dielectric bond line material...
- Patent number 11,189,590
- Issue date Nov 30, 2021
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,867,941
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate
- Patent number 9,655,240
- Issue date May 16, 2017
- Kabushiki Kaisha Toyota Jidoshokki
- Kiminori Ozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device having a functional capping
- Patent number 9,620,390
- Issue date Apr 11, 2017
- Silex Microsystems AB
- Thorbjörn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low void solder joint for multiple reflow applications
- Patent number 9,468,136
- Issue date Oct 11, 2016
- Indium Corporation
- Jordan Peter Ross
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a semiconductor device having a functional capping
- Patent number 9,362,139
- Issue date Jun 7, 2016
- Silex Microsystems AB
- Thorbjörn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for mounting a semiconductor chip on a carrier
- Patent number 9,034,751
- Issue date May 19, 2015
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low void solder joint for multiple reflow applications
- Patent number 9,010,616
- Issue date Apr 21, 2015
- Indium Corporation
- Jordan Peter Ross
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package including cap
- Patent number 8,946,877
- Issue date Feb 3, 2015
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Rick Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting a semiconductor chip on a carrier
- Patent number 8,802,553
- Issue date Aug 12, 2014
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pads defined by embedded traces
- Patent number 8,772,908
- Issue date Jul 8, 2014
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die backside standoff structures for semiconductor devices
- Patent number 8,722,528
- Issue date May 13, 2014
- Fairchild Semiconductor Corporation
- Michael Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, manufacturing program...
- Patent number 8,691,628
- Issue date Apr 8, 2014
- Kabushiki Kaisha Toshiba
- Yasuo Tane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, method for manufacturing semiconductor device...
- Patent number 8,610,269
- Issue date Dec 17, 2013
- NEC Corporation
- Kenji Nanba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive pads defined by embedded traces
- Patent number 8,432,045
- Issue date Apr 30, 2013
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die backside standoff structures for semiconductor devices
- Patent number 8,314,473
- Issue date Nov 20, 2012
- Fairchild Semiconductor Corporation
- Michael Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT PACKAGE HAVING A METAL PLATE STRUCTURE THAT IN...
- Publication number 20250105195
- Publication date Mar 27, 2025
- TEXAS INSTRUMENTS INCORPORATED
- JOHN CARLO MOLINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250054897
- Publication date Feb 13, 2025
- Fuji Electric Co., Ltd.
- Mai SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BUMPS WITH A PLURALITY OF SEPARATIO...
- Publication number 20240128221
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Minsoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240087986
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE
- Publication number 20240038795
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- Sang-Uk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI CAGE FOR MICROSTRIP ROUTING VIA DUAL LAYER UNDERFILL CONCEPT
- Publication number 20230395524
- Publication date Dec 7, 2023
- Intel Corporation
- Eng Huat GOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE TO CONTROL THE SOLDER THICKNESS FOR DOUBLE SID...
- Publication number 20230369275
- Publication date Nov 16, 2023
- Hyundai Motor Company
- Tae Hwa KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display Device and Method of Manufacturing the Same
- Publication number 20230215852
- Publication date Jul 6, 2023
- LG Display Co., Ltd.
- Byonghoo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230170280
- Publication date Jun 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS
- Publication number 20220375894
- Publication date Nov 24, 2022
- LG ELECTRONICS INC.
- Taesu OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210407887
- Publication date Dec 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE TO CONTROL THE SOLDER THICKNESS FOR DOUBLE SID...
- Publication number 20210327842
- Publication date Oct 21, 2021
- Huyndai Motor Company
- Tae Hwa KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
- Publication number 20210280548
- Publication date Sep 9, 2021
- DEXERIALS CORPORATION
- Kenichi SARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSES FOR ADJUSTING DIMENSIONS OF DIELECTRIC BOND LINE MATERIAL...
- Publication number 20210183806
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- Andrew M. Bayless
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
- Publication number 20190096844
- Publication date Mar 28, 2019
- DEXERIALS CORPORATION
- Kenichi SARUYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
- Publication number 20190067234
- Publication date Feb 28, 2019
- DEXERIALS CORPORATION
- Kenichi SARUYAMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20170200693
- Publication date Jul 13, 2017
- Hamamatsu Photonics K.K.
- Yoshimaro FUJII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip with Electrically Conducting Layer
- Publication number 20150145107
- Publication date May 28, 2015
- INFINEON TECHNOLOGIES AG
- Chee Yang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Mounting a Semiconductor Chip on a Carrier
- Publication number 20140329361
- Publication date Nov 6, 2014
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW VOID SOLDER JOINT FOR MULTIPLE REFLOW APPLICATIONS
- Publication number 20140193658
- Publication date Jul 10, 2014
- Indium Corporation
- Jordan Peter Ross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BACKSIDE STANDOFF STRUCTURES FOR SEMICONDUCTOR DEVICES
- Publication number 20120322211
- Publication date Dec 20, 2012
- Michael Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PADS DEFINED BY EMBEDDED TRACES
- Publication number 20120306092
- Publication date Dec 6, 2012
- Tessera, Inc.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW VOID SOLDER JOINT FOR MULTIPLE REFLOW APPLICATIONS
- Publication number 20120305632
- Publication date Dec 6, 2012
- Jordan Peter Ross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Functional Capping
- Publication number 20120267773
- Publication date Oct 25, 2012
- Silex Microsystems AB
- Thorbjorn Ebefors
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Mounting a Semiconductor Chip on a Carrier
- Publication number 20120208323
- Publication date Aug 16, 2012
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING PROGRAM...
- Publication number 20120149151
- Publication date Jun 14, 2012
- Kabushiki Kaisha Toshiba
- Yasuo TANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PADS DEFINED BY EMBEDDED TRACES
- Publication number 20120119367
- Publication date May 17, 2012
- Tessera Research LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20120104602
- Publication date May 3, 2012
- Kenji Nanba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING CAP
- Publication number 20120074555
- Publication date Mar 29, 2012
- Avago Technologies Wireless IP (Singapore) Pte. Ltd.
- Rick Snyder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BACKSIDE STANDOFF STRUCTURES FOR SEMICONDUCTOR DEVICES
- Publication number 20110272792
- Publication date Nov 10, 2011
- Michael Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS

comprising protrusions or indentations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and structure to control the solder thickness for double sid...

Semiconductor device and method

Semiconductor device

Method and structure to control the solder thickness for double sid...

Semiconductor device

Processes for adjusting dimensions of dielectric bond line material...

Semiconductor device and method

Substrate

Method of making a semiconductor device having a functional capping

Low void solder joint for multiple reflow applications

Method of making a semiconductor device having a functional capping

Method for mounting a semiconductor chip on a carrier

Low void solder joint for multiple reflow applications

Semiconductor package including cap

Method for mounting a semiconductor chip on a carrier

Conductive pads defined by embedded traces

Die backside standoff structures for semiconductor devices

Method of manufacturing semiconductor device, manufacturing program...

Semiconductor device, method for manufacturing semiconductor device...

Conductive pads defined by embedded traces

Die backside standoff structures for semiconductor devices

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT PACKAGE HAVING A METAL PLATE STRUCTURE THAT IN...

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE INCLUDING BUMPS WITH A PLURALITY OF SEPARATIO...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE

EMI CAGE FOR MICROSTRIP ROUTING VIA DUAL LAYER UNDERFILL CONCEPT

METHOD AND STRUCTURE TO CONTROL THE SOLDER THICKNESS FOR DOUBLE SID...

Display Device and Method of Manufacturing the Same

SEMICONDUCTOR DEVICE

DISPLAY APPARATUS

SEMICONDUCTOR DEVICE

METHOD AND STRUCTURE TO CONTROL THE SOLDER THICKNESS FOR DOUBLE SID...

ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

PROCESSES FOR ADJUSTING DIMENSIONS OF DIELECTRIC BOND LINE MATERIAL...

ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF

ELECTRONIC COMPONENT

Semiconductor Chip with Electrically Conducting Layer

Method for Mounting a Semiconductor Chip on a Carrier

LOW VOID SOLDER JOINT FOR MULTIPLE REFLOW APPLICATIONS

DIE BACKSIDE STANDOFF STRUCTURES FOR SEMICONDUCTOR DEVICES

CONDUCTIVE PADS DEFINED BY EMBEDDED TRACES

LOW VOID SOLDER JOINT FOR MULTIPLE REFLOW APPLICATIONS

Functional Capping

Method for Mounting a Semiconductor Chip on a Carrier

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING PROGRAM...

CONDUCTIVE PADS DEFINED BY EMBEDDED TRACES

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

SEMICONDUCTOR PACKAGE INCLUDING CAP

DIE BACKSIDE STANDOFF STRUCTURES FOR SEMICONDUCTOR DEVICES