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H01L2224/05557

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/05557comprising protrusions or indentations

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method of forming integrated chip structure having slotted bond pad...
- Patent number 12,322,715
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Harry-Hak-Lay Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing die stack structure
- Patent number 12,322,728
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution plugs
- Patent number 12,315,793
- Issue date May 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor redistribution structure with integrated test pad and...
- Patent number 12,288,759
- Issue date Apr 29, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,266,627
- Issue date Apr 1, 2025
- Mitsubishi Electric Corporation
- Shinji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding using metastable gas atoms
- Patent number 12,245,379
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermocompression bonding with passivated copper-based contacting m...
- Patent number 12,245,380
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wirebondable interposer for flip chip packaged integrated circuit die
- Patent number 12,243,840
- Issue date Mar 4, 2025
- Samtec, Inc.
- Edwin Loy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermocompression bonding with passivated nickel-based contacting m...
- Patent number 12,245,381
- Issue date Mar 4, 2025
- SET North America, LLC
- Eric Frank Schulte
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package
- Patent number 12,237,285
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Gayoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clamped semiconductor wafers and semiconductor devices
- Patent number 12,224,259
- Issue date Feb 11, 2025
- SanDisk Technologies, Inc.
- Kirubakaran Periyannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro LED display and manufacturing method therefor
- Patent number 12,218,295
- Issue date Feb 4, 2025
- Samsung Electronics Co., Ltd.
- Byunghoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip parts
- Patent number 12,218,123
- Issue date Feb 4, 2025
- Rohm Co., Ltd.
- Keisuke Fukae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,218,088
- Issue date Feb 4, 2025
- Kioxia Corporation
- Masayoshi Tagami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit bond pad with multi-material toothed structure
- Patent number 12,205,910
- Issue date Jan 21, 2025
- Microchip Technology Incorporated
- Justin Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,205,913
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Gayoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 12,191,266
- Issue date Jan 7, 2025
- Kabushiki Kaisha Toshiba
- Emiko Inoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,165,997
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Hung Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned and planarized under-bump metallization
- Patent number 12,119,316
- Issue date Oct 15, 2024
- NXP USA, INC.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device with redistribution plugs
- Patent number 12,112,978
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming semiconductor struct...
- Patent number 12,100,677
- Issue date Sep 24, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Hua Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad with micro-protrusions for direct metallic bonding
- Patent number 12,087,719
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration and bonding of micro-devices into system substrate
- Patent number 12,014,999
- Issue date Jun 18, 2024
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including through-silicon-vias and methods of...
- Patent number 12,014,972
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing substrate structure with filling material f...
- Patent number 11,973,014
- Issue date Apr 30, 2024
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming same
- Patent number 11,973,045
- Issue date Apr 30, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond enhancement structure in microelectronics for trapping contami...
- Patent number 11,967,575
- Issue date Apr 23, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnect structures with vertically offset bondin...
- Patent number 11,942,444
- Issue date Mar 26, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing side wettable package
- Patent number 11,916,030
- Issue date Feb 27, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature hybrid bonding
- Patent number 11,911,839
- Issue date Feb 27, 2024
- Advanced Micro Devices, Inc.
- Priyal Shah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250210555
- Publication date Jun 26, 2025
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250212480
- Publication date Jun 26, 2025
- Kabushiki Kaisha Toshiba
- Yoshiki Endo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192083
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Jongpa HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME
- Publication number 20250191984
- Publication date Jun 12, 2025
- AMOGREENTECH CO., LTD.
- Jihyung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20250183205
- Publication date Jun 5, 2025
- WIN SEMICONDUCTORS CORP.
- Shao-Yu TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250157958
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongkook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157960
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Sangho CHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250149475
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Min Seung JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149481
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250132281
- Publication date Apr 24, 2025
- DENSO CORPORATION
- Nobuyuki KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250132276
- Publication date Apr 24, 2025
- KIOXIA Corporation
- Masayoshi TAGAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDE-WETTABLE PACKAGE WITH EDGE-RECESSED BOND PADS
- Publication number 20250125292
- Publication date Apr 17, 2025
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mitigating process problems in hybrid bonding of vertical die stacking
- Publication number 20250118692
- Publication date Apr 10, 2025
- Marvell Asia Pte Ltd.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component Comprising Structured Contacts and A Method...
- Publication number 20250118691
- Publication date Apr 10, 2025
- IMEC vzw
- Jaber Derakhshandeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE AND METHODS OF FORMATION
- Publication number 20250112183
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- CHERN-YOW HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device And Method Of Manufacturing The Same
- Publication number 20250105180
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Hung Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250105187
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Gayoung Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Multichip Package
- Publication number 20250105238
- Publication date Mar 27, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE THEREWITH
- Publication number 20250079359
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Jeong Wan HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING IMPROVED BALL BONDING ADHESION
- Publication number 20250079388
- Publication date Mar 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- JOHN CARLO CRUZ MOLINA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION PLUGS AND METHOD FOR FABRI...
- Publication number 20250070017
- Publication date Feb 27, 2025
- NANYA TECHNOLOGY CORPORATION
- Chun-Cheng LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONAL COMPONENT, FORMING METHOD THEREOF AND ELECTRONIC DEVICE
- Publication number 20250046699
- Publication date Feb 6, 2025
- Shanghai Avic Opto Electronics Co., Ltd.
- Huijun JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250029941
- Publication date Jan 23, 2025
- Samsung Electronics Co., Ltd.
- HYUNSU HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20250015025
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Junyeong Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE-TO-WAFER HYBRID BONDING
- Publication number 20250015029
- Publication date Jan 9, 2025
- Murata Manufacturing Co., Ltd.
- Sinan GOKTEPELI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20250006675
- Publication date Jan 2, 2025
- KIOXIA Corporation
- Shinya ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFIED CRACKSTOP STRUCTURE FOR JOINING SEMICONDUCTOR BUILDS
- Publication number 20250006681
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING
- Publication number 20240429190
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Aibin Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packaging Method
- Publication number 20240404968
- Publication date Dec 5, 2024
- SHENZHEN SIPTORY TECHNOLOGY CO., LTD
- Dongdong Shao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240395774
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS

comprising protrusions or indentations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method of forming integrated chip structure having slotted bond pad...

Method of manufacturing die stack structure

Semiconductor device with redistribution plugs

Semiconductor redistribution structure with integrated test pad and...

Semiconductor device and method for manufacturing the same

Thermocompression bonding using metastable gas atoms

Thermocompression bonding with passivated copper-based contacting m...

Wirebondable interposer for flip chip packaged integrated circuit die

Thermocompression bonding with passivated nickel-based contacting m...

Semiconductor package

Clamped semiconductor wafers and semiconductor devices

Micro LED display and manufacturing method therefor

Chip parts

Semiconductor device

Integrated circuit bond pad with multi-material toothed structure

Semiconductor package

Semiconductor device and manufacturing method of semiconductor device

Semiconductor device and method of manufacturing the same

Patterned and planarized under-bump metallization

Method for fabricating semiconductor device with redistribution plugs

Semiconductor structure and method for forming semiconductor struct...

Bond pad with micro-protrusions for direct metallic bonding

Integration and bonding of micro-devices into system substrate

Semiconductor devices including through-silicon-vias and methods of...

Method of manufacturing substrate structure with filling material f...

Semiconductor structure and method for forming same

Bond enhancement structure in microelectronics for trapping contami...

Semiconductor interconnect structures with vertically offset bondin...

Method for manufacturing side wettable package

Low temperature hybrid bonding

Patents Applicationslast 30 patents

BONDING PAD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

CERAMIC SUBSTRATE UNIT AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SIDE-WETTABLE PACKAGE WITH EDGE-RECESSED BOND PADS

Mitigating process problems in hybrid bonding of vertical die stacking

Semiconductor Component Comprising Structured Contacts and A Method...

SEMICONDUCTOR DIE AND METHODS OF FORMATION

Semiconductor Device And Method Of Manufacturing The Same

SEMICONDUCTOR PACKAGE

3D Multichip Package

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE THEREWITH

INTEGRATED CIRCUIT HAVING IMPROVED BALL BONDING ADHESION

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION PLUGS AND METHOD FOR FABRI...

FUNCTIONAL COMPONENT, FORMING METHOD THEREOF AND ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

MULTI-DIE-TO-WAFER HYBRID BONDING

SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

UNIFIED CRACKSTOP STRUCTURE FOR JOINING SEMICONDUCTOR BUILDS

BOND PAD WITH MICRO-PROTRUSIONS FOR DIRECT METALLIC BONDING

Semiconductor Packaging Method

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME