Concurrent filling of a plurality of trenches having a different trench shape or dimension

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CPC
H01L21/76229

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76229Concurrent filling of a plurality of trenches having a different trench shape or dimension

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Structures with deep trench isolation regions for a high-voltage fi...
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Dielectric fin structures with varying height
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Metal mask having a plurality of strip-shaped structures
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Method for manufacturing a semiconductor device having a dummy section
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Array boundary structure to reduce dishing
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Deep trench isolations and methods of forming the same
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Patents Applicationslast 30 patents

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BACKSIDE FUSE CONNECTED TO BACKSIDE BACK END OF THE LINE NETWORK
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DAM LAMINATE ISOLATION SUBSTRATE
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- TEXAS INSTRUMENTS INCORPORATED
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SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME
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- UNITED MICROELECTRONICS CORP.
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- UNITED MICROELECTRONICS CORP.
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Semiconductor Device and Method
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Structure and Method for FinFET Device with Asymmetric Contact
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MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
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- UNITED MICROELECTRONICS CORP.
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Dummy Fin Structures and Methods of Forming Same
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- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Hsiang Lin
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SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
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Semiconductor device and fabricating method of the same
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- UNITED MICROELECTRONICS CORP.
- Ya-Ting Hu
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SEMICONDUCTOR FEATURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240371681
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Harry-Hak-Lay CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
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ARRAY BOUNDARY STRUCTURE TO REDUCE DISHING
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- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Han Lin
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SEMICONDUCTOR TRENCH CAPACITOR STRUCTURE AND MANUFACTURING METHOD T...
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- Ryan Chia-Jen Chen
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HYBRID ISOLATION REGIONS HAVING UPPER AND LOWER PORTIONS WITH SEAMS
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- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ting Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
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- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHALLOW TRENCH ISOLATION (STI) CONTACT STRUCTURES AND METHODS OF FO...
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- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tai-Yuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
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- Taiwan Semiconductor Manufacturing Company, Ltd.
- Joanna Chaw Yane Yin
- H01 - BASIC ELECTRIC ELEMENTS

Concurrent filling of a plurality of trenches having a different trench shape or dimension

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structures with deep trench isolation regions for a high-voltage fi...

Dielectric fin structures with varying height

Integrated circuit with a Fin and gate structure and method making...

Metal mask having a plurality of strip-shaped structures

Method for manufacturing a semiconductor device having a dummy section

Semiconductor device structure and method for preparing the same

Semiconductor device and method for manufacturing the same

Semiconductor device and method of fabricating the same having a se...

Backside power rails and power distribution network for density sca...

Gapfill of variable aspect ratio features with a composite PEALD an...

Trench isolation structures with varying depths and method of formi...

Managing trench depth in integrated systems

Semiconductor device

Method of fabricating semiconductor device

Method of depositing silicon oxide films

Semiconductor devices and methods for fabricating the same

Isolation structures and methods of forming the same in field-effec...

Method of manufacturing semiconductor device including isolation st...

Dummy fin structures and methods of forming same

Semiconductor device and method for fabricating the same

Seal method to integrate non-volatile memory (NVM) into logic or bi...

Semiconductor structure cutting process and structures formed thereby

Array boundary structure to reduce dishing

Semiconductor trench capacitor structure and manufacturing method t...

Hybrid isolation regions having upper and lower portions with seams

Semiconductor feature and method for manufacturing the same

Deep trench isolations and methods of forming the same

Hybrid scheme for improved performance for P-type and N-type FinFETs

Shallow trench isolation (STI) contact structures and methods of fo...

Semiconductor device and method

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

METHOD OF FORMING LINE PATTERN IN SEMICONDUCTOR DEVICE

ISOLATION STRUCTURES AND METHODS OF FORMING THE SAME IN FIELD-EFFEC...

Method for Thinning a Semiconductor Substrate

BACKSIDE FUSE CONNECTED TO BACKSIDE BACK END OF THE LINE NETWORK

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

DAM LAMINATE ISOLATION SUBSTRATE

SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME

HIGH VOLTAGE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF AND MEMORY S...

ISOLATION STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD FOR FABRICAT...

FIELD EFFECT TRANSISTOR WITH DUAL LAYER ISOLATION STRUCTURE AND METHOD

NANOSHEET HEIGHT CONTROL WITH DENSE OXIDE SHALLOW TRENCH ISOLATION

SEMICONDUCTOR DEVICE WITH DEEP TRENCH ISOLATION AND SHALLOW TRENCH...

Semiconductor Device and Method

Structure and Method for FinFET Device with Asymmetric Contact

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

Dummy Fin Structures and Methods of Forming Same

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Semiconductor device and fabricating method of the same

SEMICONDUCTOR FEATURE AND METHOD FOR MANUFACTURING THE SAME

ARRAY BOUNDARY STRUCTURE TO REDUCE DISHING

SEMICONDUCTOR TRENCH CAPACITOR STRUCTURE AND MANUFACTURING METHOD T...

Semiconductor Structure Cutting Process and Structures Formed Thereby

HYBRID ISOLATION REGIONS HAVING UPPER AND LOWER PORTIONS WITH SEAMS

DEEP TRENCH ISOLATIONS AND METHODS OF FORMING THE SAME

SHALLOW TRENCH ISOLATION (STI) CONTACT STRUCTURES AND METHODS OF FO...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

METHOD OF FABRICATING A FINFET DEVICE